Patents by Inventor Masahiro Ichiki

Masahiro Ichiki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4785455
    Abstract: A light emitting device is disclosed which includes a semiconductor block, an active layer disposed in such a fashion as to penetrate through the mutually facing end surfaces of the semiconductor block, and an electrode disposed on the main plane of the semiconductor block, wherein the electrode consists of a first electrode portion disposed along the active layer, and a second electrode portion continuing integrally the first electrode portion and having the periphery thereof out of contact from the periphery of the second main plane of the semiconductor block. A current is caused to uniformly flow through the entire active layer, and a light emitting operation is carried out stably. Since the electrode is not disposed on the periphery of the semiconductor block, the occurrence of junction short-curcuit, which might otherwise occur when a wafer is cut off to produce laser chips or when the corners of the chip break off, can be reduced.
    Type: Grant
    Filed: July 27, 1987
    Date of Patent: November 15, 1988
    Assignee: Hitachi, Ltd.
    Inventors: Masaaki Sawai, Masamichi Kobayashi, Shoji Hayashi, Hiroshi Naka, Masahiro Ichiki
  • Patent number: 4692927
    Abstract: A light emitting device is disclosed which includes a semiconductor block, an active layer disposed in such a fashion as to penetrate through the mutually facing end surfaces of the semiconductor block, and an electrode disposed on the main plane of the semiconductor block, wherein the electrode consists of a first electrode portion disposed along the active layer, and a second electrode portion continuing integrally the first electrode portion and having the periphery thereof out of contact from the periphery of the second main plane of the semiconductor block. A current is caused to uniformly flow through the entire active layer, and a light emitting operation is carried out stably. Since the electrode is not disposed on the periphery of the semiconductor block, the occurrence of junction short-circuit, which might otherwise occur when a wafer is cut off to produce laser chips or when the corners of the chip break off, can be reduced.
    Type: Grant
    Filed: March 15, 1985
    Date of Patent: September 8, 1987
    Assignee: Hitachi, Ltd.
    Inventors: Masaaki Sawai, Masamichi Kobayashi, Shoji Hayashi, Hiroshi Naka, Masahiro Ichiki
  • Patent number: 4367483
    Abstract: An optical semiconductor device includes a light emitting element disposed on a silicon sub-mount having a light receiving element formed in a surface region. By virtue of integral arrangement of the light emitting element and the light receiving element, a single lens can be used for both optical transmission and optical reception, whereby an optical communication system can be manufactured very inexpensively. Further, transmission and reception can be carried out simultaneously.
    Type: Grant
    Filed: October 2, 1980
    Date of Patent: January 4, 1983
    Assignee: Hitachi, Ltd.
    Inventors: Takeo Takahashi, Kazuhiro Kurata, Yuichi Ono, Kazuhiro Ito, Makoto Morioka, Mitsuhiro Mori, Ginro Takemura, Makoto Sakamoto, Masahiro Ichiki, Youichi Yasuda, Hirobumi Ouchi
  • Patent number: RE34378
    Abstract: A light emitting device is disclosed which includes a semiconductor block, an active layer disposed in such a fashion as to penetrate through the mutually facing end surfaces of the semiconductor block, and an electrode disposed on the main plane of the semiconductor block, wherein the electrode consists of a first electrode portion disposed along the active layer, and a second electrode portion continuing integrally the first electrode portion and having the periphery thereof out of contact from the periphery of the second main plane of the semiconductor block. A current is caused to uniformly flow through the entire active layer, and a light emitting operation is carried out stably. Since the electrode is not disposed on the periphery of the semiconductor block, the occurrence of junction short-curcuit, which might otherwise occur when a wafer is cut off to produce laser chips or when the corners of the chip break off, can be reduced.
    Type: Grant
    Filed: November 15, 1990
    Date of Patent: September 14, 1993
    Assignee: Hitachi, Ltd.
    Inventors: Masaaki Sawai, Masamichi Kobayashi, Shoji Hayashi, Hiroshi Naka, Masahiro Ichiki