Patents by Inventor Masahiro Ichino

Masahiro Ichino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10988589
    Abstract: Provided is a thermosetting resin composition which achieves both high heat resistance and high bending strength as a fiber-reinforced composite material, and also has rapid curability that enables high cycle press forming, thermal stability, and storage stability. The thermosetting resin composition of the present invention is a thermosetting resin composition comprising an epoxy resin, an epoxy resin curing agent, an imidazole compound, and an epoxy resin curing accelerator, in which the epoxy resin curing agent is dicyandiamide or a derivative thereof, and the epoxy resin curing accelerator comprises a urea derivative having two or more dimethylureido groups in a molecule.
    Type: Grant
    Filed: April 29, 2020
    Date of Patent: April 27, 2021
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Takuya Teranishi, Masahiro Ichino, Akira Oota
  • Publication number: 20210115209
    Abstract: A prepreg sheet includes a plurality of prepreg tapes each of which overlaps with a corresponding adjacent prepreg tape for a suitable overlapping length. The plurality of prepreg tapes each contain a reinforcing fiber bundle that is impregnated with a thermosetting resin composition. According to a method for manufacturing a preform, for example, a primary premolded article is manufactured by preforming an intermediate base material containing a reinforcing fiber base material and a matrix resin composition, and a secondary premolded article is manufactured by preforming the primary premolded article on which the intermediate base material is further placed.
    Type: Application
    Filed: December 18, 2020
    Publication date: April 22, 2021
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Yuma FURUHASHI, Masahiro ICHINO, Kazuhisa IKEDA
  • Patent number: 10920027
    Abstract: The invention provides an epoxy resin composition that is easily B-staged despite containing an epoxy resin inherently difficult to B-stage, has a long pot life, has excellent processability and storage stability after B-staging, and make it possible to obtain a fiber-reinforced composite material having excellent flexural strength and flexural modulus. A molding material, including a thickened product of an epoxy resin composition; and a reinforcing fiber; wherein the epoxy resin composition including: a component (A): an aromatic epoxy resin; a component (B): an alicyclic diamine; a component (C): an epoxy resin curing agent that is not an alicyclic diamine; and a component (D): an aliphatic epoxy resin, wherein, when the viscosity at 25° C. immediately after preparation of the epoxy resin composition is taken as (a) and the viscosity at 25° C. after three hours from the preparation is taken as (b), the epoxy resin composition satisfies: (a)=0.1 to 25 Pa·s; (b)=0.1 to 25 Pa·s; and (b)/(a)?5.
    Type: Grant
    Filed: August 27, 2018
    Date of Patent: February 16, 2021
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Akira Oota, Masahiro Ichino, Takuya Teranishi, Mitsuru Kutsuwada, Yusuke Watanabe, Natsumi Mukouzaka
  • Publication number: 20210009776
    Abstract: A prepreg contains: a reinforcing fiber material; and a resin composition with which the reinforcing fiber material is impregnated. The resin composition contains an epoxy resin, an amine curing agent, and an imidazole curing agent. An amount of the amine curing agent is less than or equal to 3.8 parts by mass, relative to 100 parts by mass of the epoxy resin, and a sum of the amount of the amine curing agent and an amount of the imidazole curing agent is less than or equal to 10 parts by mass, relative to 100 parts by mass of the epoxy resin. The fiber-reinforced composite material is a cured product of the prepreg.
    Type: Application
    Filed: July 10, 2020
    Publication date: January 14, 2021
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Takuya TERANISHI, Satoshi OKAMOTO, Akira OOTA, Masahiro ICHINO
  • Publication number: 20210001517
    Abstract: What is provided is a molding device which enables a molded article to be excellently released, has a region that is on a molding surface and exhibits excellent abrasion resistance by being treated to show mold release properties, and can suppress the deterioration of mold release properties. Also provided is a method for manufacturing a fiber-reinforced composite material molded article. A fiber-reinforced composite material molding device (101) includes a molding die (130) for obtaining a fiber-reinforced composite material molded article by molding a fiber-reinforced composite material prepared by impregnating a reinforcing fiber base material with a resin composition, in which a surface free energy of a portion or the entirety of cavity surfaces (113a) and (123a) of the molding die (130) is equal to or lower than 25.0 mJ/m2 which is measured by a three liquid method.
    Type: Application
    Filed: September 23, 2020
    Publication date: January 7, 2021
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Masahiro Ichino, Tsuneo Takano, Shirou Asada
  • Publication number: 20200255614
    Abstract: Provided is a thermosetting resin composition which achieves both high heat resistance and high bending strength as a fiber-reinforced composite material, and also has rapid curability that enables high cycle press forming, thermal stability, and storage stability. The thermosetting resin composition of the present invention is a thermosetting resin composition comprising an epoxy resin, an epoxy resin curing agent, an imidazole compound, and an epoxy resin curing accelerator, in which the epoxy resin curing agent is dicyandiamide or a derivative thereof, and the epoxy resin curing accelerator comprises a urea derivative having two or more dimethylureido groups in a molecule.
    Type: Application
    Filed: April 29, 2020
    Publication date: August 13, 2020
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Takuya Teranishi, Masahiro Ichino, Akira Oota
  • Patent number: 10647828
    Abstract: This prepreg comprises reinforcing fibers and a matrix resin composition. The matrix resin composition comprises at least an epoxy resin (component (A)), a radical polymerizable unsaturated compound (component (B)), and a polymer formed by radical polymerization of the component (B) (component (E)).
    Type: Grant
    Filed: September 5, 2013
    Date of Patent: May 12, 2020
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Takuya Teranishi, Manabu Kaneko, Masahiro Ichino, Teppei Miura, Tadao Samejima, Akira Miyauchi, Kiharu Numata, Shouhei Mori, Masaki Kusumi
  • Publication number: 20200140633
    Abstract: The invention provides an epoxy resin composition that is easily B-staged despite containing an epoxy resin inherently difficult to B-stage, has a long pot life, has excellent processability and storage stability after B-staging, and make it possible to obtain a fiber-reinforced composite material having excellent flexural strength and flexural modulus. A molding material, including a thickened product of an epoxy resin composition; and a reinforcing fiber; wherein the epoxy resin composition including: a component (A): an aromatic epoxy resin; a component (B): an alicyclic diamine; a component (C): an epoxy resin curing agent that is not an alicyclic diamine; and a component (D): an aliphatic epoxy resin, wherein, when the viscosity at 25° C. immediately after preparation of the epoxy resin composition is taken as (a) and the viscosity at 25° C. after three hours from the preparation is taken as (b), the epoxy resin composition satisfies: (a)=0.1 to 25 Pa·s; (b)=0.1 to 25 Pa·s; and (b)/(a)?5.
    Type: Application
    Filed: August 27, 2018
    Publication date: May 7, 2020
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Akira OOTA, Masahiro ICHINO, Takuya TERANISHI, Mitsuru KUTSUWADA, Yusuke WATANABE, Natsumi MUKOUZAKA
  • Publication number: 20200087506
    Abstract: A molding material that enables acquirement of a fiber-reinforced composite material which has excellent demoldability from a mold and excellent surface appearance, which contaminates a mold surface after molding less, and which has excellent mechanical properties and heat resistance; and a fiber-reinforced composite material which has excellent demoldability from a mold and surface appearance, which contaminates a mold surface after molding less, and which has excellent mechanical properties and heat resistance, are provided. A molding material of the present invention includes a component (A): an epoxy resin; a component (B): an epoxy resin curing agent; a component (C): a compound that has a solubility parameter of 11.2 or less and a melting point of 115° C. or lower; and a reinforcement fiber.
    Type: Application
    Filed: November 19, 2019
    Publication date: March 19, 2020
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Akira OOTA, Masahiro Ichino, Takuya Teranishi, Yusuke Watanabe, Natsumi Mukouzaka
  • Publication number: 20200055978
    Abstract: A sheet-molding compound comprising a thickened thermosetting resin composition and reinforcing fiber bundles. The thermosetting resin composition comprises components (A), (B) and (D). The content of component (D) is 10 parts by mass to 30 parts by mass with respect to 100 parts by mass of the total amount of epoxy resin. The final viscosity of the thickened thermosetting resin composition is 150 Pa·s to 20000 Pa·s, and the minimum viscosity is 2 Pa·s to 600 Pa·s, the final viscosity being higher than the minimum viscosity.
    Type: Application
    Filed: October 16, 2019
    Publication date: February 20, 2020
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Akira OOTA, Masahiro Ichino, Takuya Teranishi, Tooru Kondou, Mitsuru Kutsuwada
  • Publication number: 20200032047
    Abstract: A sheet molding compound which is a thickened material of an epoxy resin composition, including a component (A), a component (B), and a component (C), in which the component (A) is an epoxy resin staying at a liquid state at 25° C., the component (B) is an acid anhydride, the component (C) is an epoxy resin curing agent, and in the thickened material, at least some of epoxy groups of the component (A) and at least some of carboxy groups derived from the component (B) form ester.
    Type: Application
    Filed: October 7, 2019
    Publication date: January 30, 2020
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Akira OTA, Masahiro ICHINO, Takuya TERANISHI
  • Publication number: 20200024414
    Abstract: A prepreg sheet (1) is formed by stacking a plurality of unit layers (10a, 10b) In the unit layers (10a, 10b), prepreg tapes (100), in which a reinforced fiber bundle is impregnated with a thermosetting matrix resin composition, are disposed in rows a plurality of times. One or more of the unit layers (10a, 10b) has a gap (G) between adjacent prepreg tapes (100), and the width thereof is 10% or less of the width of the narrower of the adjacent prepreg tapes (100).
    Type: Application
    Filed: September 27, 2019
    Publication date: January 23, 2020
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Masahiro Ichino, Kazuhisa Ikeda, Satoshi Okamoto, Yuma Furuhashi
  • Patent number: 10494475
    Abstract: A sheet-molding compound comprising a thickened thermosetting resin composition and reinforcing fiber bundles. The thermosetting resin composition comprises components (A), (B) and (D). The content of component (D) is 10 parts by mass to 30 parts by mass with respect to 100 parts by mass of the total amount of epoxy resin. The final viscosity of the thickened thermosetting resin composition is 150 Pa·s to 20000 Pa·s, and the minimum viscosity is 2 Pa·s to 600 Pa·s, the final viscosity being higher than the minimum viscosity.
    Type: Grant
    Filed: May 13, 2016
    Date of Patent: December 3, 2019
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Akira Oota, Masahiro Ichino, Takuya Teranishi, Tooru Kondou, Mitsuru Kutsuwada
  • Patent number: 10363724
    Abstract: A resin composition including an epoxy resin (A), a curing agent (B), and vinyl polymer particles (C), in which the contained amount of epoxy resin (a1) having a molecular weight of 100-480 is 30-90 parts by mass per 100 parts by mass of the epoxy resin (A), the contained amount of epoxy resin (a2) having a molecular weight of 2,000-40,000 is 10-70 parts by mass per 100 parts by mass of the epoxy resin (A), the contained amount of the vinyl polymer particles (C) is 2-30 parts by mass per 100 parts by mass of the epoxy resin (A), and the instantaneous maximum thickening value of the vinyl polymer particles obtained by the following method is 0.3-5.0 Pa·s/° C.
    Type: Grant
    Filed: October 14, 2015
    Date of Patent: July 30, 2019
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Takuya Teranishi, Akira Oota, Masahiro Ichino, Toru Kondo
  • Publication number: 20190185612
    Abstract: Provided is a thermosetting resin composition (C) of which curing can be started at a relatively low temperature in a short time and a cured product exhibits high heat resistance, the thermosetting resin composition (C) comprising an epoxy resin; an epoxy resin curing agent; and an epoxy resin curing accelerator, wherein the epoxy resin curing agent contains an imidazole-based curing agent 1 which is not encapsulated in a microcapsule and a curing agent 2 which is encapsulated in a microcapsule, and the epoxy resin curing accelerator comprises a urea derivative.
    Type: Application
    Filed: February 21, 2019
    Publication date: June 20, 2019
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Takuya TERANISHI, Masahiro Ichino, Kazuhisa Ikeda, Akira Oota
  • Publication number: 20180142057
    Abstract: A sheet-molding compound comprising a thickened thermosetting resin composition and reinforcing fiber bundles. The thermosetting resin composition comprises components (A), (B) and (D). The content of component (D) is 10 parts by mass to 30 parts by mass with respect to 100 parts by mass of the total amount of epoxy resin. The final viscosity of the thickened thermosetting resin composition is 150 Pa·s to 20000 Pa·s, and the minimum viscosity is 2 Pa·s to 600 Pa·s, the final viscosity being higher than the minimum viscosity.
    Type: Application
    Filed: May 13, 2016
    Publication date: May 24, 2018
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Akira OOTA, Masahiro ICHINO, Takuya TERANISHI, Tooru KONDOU, Mitsuru KUTSUWADA
  • Publication number: 20170282516
    Abstract: A resin composition including an epoxy resin (A), a curing agent (B), and vinyl polymer particles (C), in which the contained amount of epoxy resin (a1) having a molecular weight of 100-480 is 30-90 parts by mass per 100 parts by mass of the epoxy resin (A), the contained amount of epoxy resin (a2) having a molecular weight of 2,000-40,000 is 10-70 parts by mass per 100 parts by mass of the epoxy resin (A), the contained amount of the vinyl polymer particles (C) is 2-30 parts by mass per 100 parts by mass of the epoxy resin (A), and the instantaneous maximum thickening value of the vinyl polymer particles obtained by the following method is 0.3-5.0 Pa·s/° C.
    Type: Application
    Filed: October 14, 2015
    Publication date: October 5, 2017
    Applicant: Mitsubishi Rayon Co., Ltd.
    Inventors: Takuya TERANISHI, Akira OOTA, Masahiro ICHINO, Toru KONDO
  • Patent number: 9481789
    Abstract: The present invention relates to a method for producing a prepreg which contains reinforcing fibers and a matrix resin composition with the weight per square meter of the reinforcing fibers being 250-2,000 g/m2. The production method comprises the following steps (1)-(3): (1) a matrix resin composition blending step for obtaining a matrix resin composition by mixing an epoxy resin, a radically polymerizable unsaturated compound, an epoxy resin curing agent and a polymerization initiator that generates radicals, in said step the content of the radically polymerizable unsaturated compound relative to 100% by mass of the total of the epoxy resin and the radically polymerizable unsaturated compound being 10-25% by mass; (2) a matrix resin composition impregnating step; and (3) a surface viscosity increasing step.
    Type: Grant
    Filed: March 2, 2012
    Date of Patent: November 1, 2016
    Assignee: Mitsubishi Rayon Co., Ltd.
    Inventors: Masahiro Ichino, Manabu Kaneko, Kazuki Koga, Teppei Miura, Takuya Teranishi, Kiharu Numata, Kazutami Mitani, Tadao Samejima
  • Publication number: 20160303777
    Abstract: A method for producing a prepreg, includes: preparing a reinforcing fiber sheet containing multiple reinforcing fiber bundles, a matrix resin composition, first and second release sheets, and elastic members; forming a prepreg precursor by providing the matrix resin composition on the reinforcing fiber sheet; sandwiching the prepreg precursor between the first and second release sheets so that first surfaces of the first and second release sheets make contact with the prepreg precursor and that the first and second release sheets respectively include extended portions that protrude outward from both edges of the prepreg precursor in a width direction; positioning the elastic members to face the extended portions of the second release sheet and to make contact with the second surface of the second release sheet; and compressing the prepreg precursor, first and second release sheets and the elastic members all at once in a thickness direction of the prepreg precursor.
    Type: Application
    Filed: October 21, 2014
    Publication date: October 20, 2016
    Applicant: MITSUBISHI RAYON CO., LTD.
    Inventors: Akira MIYAUCHI, Tadao SAMEJIMA, Masahiro ICHINO, Takuya TERANISHI
  • Publication number: 20150252160
    Abstract: This prepreg comprises reinforcing fibers and a matrix resin composition. The matrix resin composition comprises at least an epoxy resin (component (A)), a radical polymerizable unsaturated compound (component (B)), and a polymer formed by radical polymerization of the component (B) (component (E)).
    Type: Application
    Filed: September 5, 2013
    Publication date: September 10, 2015
    Applicant: Mitsubishi Rayon Co., Ltd.
    Inventors: Takuya Teranishi, Manabu Kaneko, Masahiro Ichino, Teppei Miura, Tadao Samejima, Akira Miyauchi, Kiharu Numata, Shouhei Mori, Masaki Kusumi