Abstract: A wire processing apparatus includes an applicator (60) for crimping a crimp contact onto an end of a wire (2) and solder depositing units (7, 8) for depositing solder onto an exposed core on the wire end, all of which serve as wire processing units. The applicator (60) and the solder depositing units (7, 8) are attachable to and removable from a placement section (13a) and are interchangeable with each other. Each of the solder depositing units (7, 8) includes a flux bath (15) for storing a flux liquid therein, a solder bath (16) for storing solder in a molten state therein, and a flux liquid holding tube having a holding hole for holding the flux liquid therein and capable of releasably receiving the core. The core is moved downwardly into a solder portion raised by the surface tension of the solder stored in the solder bath 16, whereby the solder is deposited on the core.

Abstract: A wire processing apparatus includes an applicator (60) for crimping a crimp contact onto an end of a wire (2) and solder depositing units (7, 8) for depositing solder onto an exposed core on the wire end, all of which serve as wire processing units. The applicator (60) and the solder depositing units (7, 8) are attachable to and removable from a placement section (13a) and are interchangeable with each other. Each of the solder depositing units (7, 8) includes a flux bath (15) for storing a flux liquid therein, a solder bath (16) for storing solder in a molten state therein, and a flux liquid holding tube having a holding hole for holding the flux liquid therein and capable of releasably receiving the core. The core is moved downwardly into a solder portion raised by the surface tension of the solder stored in the solder bath 16, whereby the solder is deposited on the core.

Abstract: The wire handling apparatus of the present invention comprises a length measuring unit, a first clamp mechanism and a second clamp mechanism, a cutter mechanism, a first terminal pressing mechanism and a second terminal pressing mechanism, a first carrier mechanism and a second carrier mechanism, and a wire discharge mechanism, and synchronous moving means for upwardly/downwardly moving a receiving clamp part of the wire discharge mechanism in synchronization with upward/downward movement of a clamp part of the said second clamp mechanism in a terminal pressing operation of the said second terminal pressing mechanism is provided while the position of the said receiving clamp part is coincided with the position of a coated wire so that grasping of the coated wire by the receiving clamp part is enabled in the terminal pressing operation of the second terminal pressing mechanism.

Abstract: Two photoelectric switches on a path for coating stripping processing of a wire detect passages of an exposed core portion and a residual coating portion of a wire end respectively in a non-contact manner, to derive passage signals corresponding to the times of the passages. These passage signals are compared in length with each other, whereby a decision of effective stripping is made when the difference therebetween is larger than a prescribed value while a decision of defective stripping is made when the difference is smaller than the prescribed value.