Abstract: An electronic device 1 has a first semiconductor substrate 2 on which a bonding projection section 42 is projected via an insulation film 41, a second semiconductor substrate 3 that is bonded by welding the bonding projection section 42 of the first semiconductor substrate 2 via conductive bonding material, a through hole 54 that is formed to penetrate the bonding projection section 42 and the insulation film 41 in a bonding direction, and a conduction wiring section 44 that is formed by the conductive bonding material filled in the through hole 54 at a time of bonding by welding and conducts the first semiconductor substrate 2 with the second semiconductor substrate 3 to have same electric potential.

Abstract: Disclosed is an electromechanical conversion element, including an electromechanical conversion film including a PIT, an upper electrode formed on a top of the electromechanical conversion film and including a first strontium ruthenium oxide, and a lower electrode formed on a bottom of the electromechanical conversion film and including a second strontium ruthenium oxide, wherein Sr-pzt/Sr-sr?0.01, wherein Sr-pzt is a SIMS intensity for a secondary ion of strontium of the PZT at a position of ½ of a thickness of the electromechanical conversion film and Sr-sr is a SIMS intensity for a secondary ion of strontium of the second strontium ruthenium oxide at a position of ½ of a thickness of the lower electrode.

Abstract: A method of bonding a semiconductor substrate having a substrate 11 formed with a MEMS sensor and a substrate 21 having a bonding portion 30b film-formed by contacting an aluminum containing layer 31 with a germanium layer 32 on either a front surface or a rear surface and formed with an integrated circuit that controls the MEMS sensor, either a front surface or a rear surface of the substrate 11 is put to contact directly on the bonding portion of the substrate 21 to bond by eutectic bonding with pressurization and heating.

Abstract: Disclosed is a method for bonding semiconductor substrates, wherein an eutectic alloy does run off the bonding surfaces during the eutectic bonding. Also disclosed is an MEMS device which is obtained by bonding semiconductor substrates by this method. Specifically, a substrate (11) and a substrate (21) are eutectically bonded with each other by pressing and heating the substrate (11) and the substrate (21), while interposing an aluminum-containing layer (31) and a germanium layer (32) between a bonding part (30a) of the substrate (11) and a bonding part (30b) of the substrate (21) in such a manner that the aluminum-containing layer (31) and the germanium layer (32) overlap each other, with an outer edge (32a) of the germanium layer (32) being inwardly set back from the an outer edge (31a) of the aluminum-containing layer (31).

Abstract: A method of bonding a semiconductor substrate in which a first semiconductor substrate is bonded with a second semiconductor substrate by eutectic bonding with pressurization and heating, an aluminum containing layer primarily made of aluminum and a germanium layer in a polymer state being interposed between a bonding surface of the first semiconductor substrate and a bonding surface of the second semiconductor substrate, the method including a step of: setting a weight ratio of the germanium layer to an aluminum containing layer to be eutectic alloyed is between 27 wt % to 52 wt %.

Abstract: A driving apparatus (1) is provided with: a fixed part (11) having a fixed-part plane (12); and a driven part (13) having a driven-part plane (14), which faces the fixed-part plane, and driven in a direction substantially parallel to the fixed-part plane, a liquid lubricant (30) is between the fixed-portion plane and the driven-part plane, the driven-part plane faces the fixed-part plane such that the driven-part plane is substantially parallel to the fixed-part plane.

Abstract: An actuator comprises a connection section having one end rotatably connected to a connection point (C1) of a fixed section and the other end rotatably connected to a connection point (C2) of a moving section, a connection section having one end rotatably connected to a connection point (C3) of the fixed section and the other end rotatably connected to a connection point (C4) of the moving sections a comb-teeth electrode having the root section connected to a comb-teeth base point (B1) and the fore-end section extending along the turning path, and a comb-teeth electrode having the root section connected to the fixed section and the other section extending along the curve of the comb-teeth electrode and opposed to the comb-teeth electrode with a predetermined gap.

Abstract: A first thermal buffer layer and a second thermal buffer layer are arranged between a recording medium and an actuator structure. The heat conductivity of the first thermal buffer layer is set low and the heat conductivity of the second thermal buffer layer is set high. Most of the heat generated from a coil wiring of the actuator structure is blocked by the first thermal buffer layer, and heat leaked from the first thermal buffer layer is diffused by the second thermal buffer layer. Temperature distribution on the recording medium is made uniform, and thus, a configuration wherein the recording medium and the actuator structure are placed one over another can be provided, information reading accuracy or information recording stability can be improved and the sizes of an information storage device can be reduced.

Abstract: An information recording/reproducing device includes with a recording medium having a recording surface and a probe array in which a plurality of probes are disposed in a direction intersecting at least a track direction for carrying out either the record processing or the reproduction processing of information by scanning a plurality of information tracks in parallel with the track direction along the rack direction on the recording surface. One of the recording medium and the probe array is divided into a plurality of divided portions in the intersecting direction, so that each of them is configured to include at least one information track or probe. The information recording/reproducing device also includes a first driving element for driving each of the plural portions divided in the intersecting direction and a second driving element for driving each of the probe arrays in the track direction with respect to the recording surface.

Abstract: A driving apparatus (1) is provided with: a fixed part (11) having a fixed-part plane (12); and a driven part (13) having a driven-part plane (14), which faces the fixed-part plane, and driven in a direction substantially parallel to the fixed-part plane, a liquid lubricant (30) is between the fixed-portion plane and the driven-part plane, the driven-part plane faces the fixed-part plane such that the driven-part plane is substantially parallel to the fixed-part plane.

Abstract: An actuator comprises a connection section having one end rotatably connected to a connection point (C1) of a fixed section and the other end rotatably connected to a connection point (C2) of a moving section, a connection section having one end rotatably connected to a connection point (C3) of the fixed section and the other end rotatably connected to a connection point (C4) of the moving sections a comb-teeth electrode having the root section connected to a comb-teeth base point (B1) and the fore-end section extending along the turning path, and a comb-teeth electrode having the root section connected to the fixed section and the other section extending along the curve of the comb-teeth electrode and opposed to the comb-teeth electrode with a predetermined gap.

Abstract: A first thermal buffer layer and a second thermal buffer layer are arranged between a recording medium and an actuator structure. The heat conductivity of the first thermal buffer layer is set low and the heat conductivity of the second thermal buffer layer is set high. Most of the heat generated from a coil wiring of the actuator structure is blocked by the first thermal buffer layer, and heat leaked from the first thermal buffer layer is diffused by the second thermal buffer layer. Temperature distribution on the recording medium is made uniform, and thus, a configuration wherein the recording medium and the actuator structure are placed one over another can be provided, information reading accuracy or information recording stability can be improved and the sizes of an information storage device can be reduced.