Abstract: A strap-like layered resin film (4) having the same width as a semiconductor chip (2) is cut out from a layered resin film (4F) and pressurized while being heated to the temperature below the transition temperature of a resin ribbon (4b), to be bonded onto a predetermined region (1R) of a lead frame (1). Subsequently, removing a cover ribbon (4a) of non-stickiness from the film (4), the semiconductor chip (2) is bonded to the predetermined region (1R) with the resin ribbon (4b) of stickiness heated to about the transition temperature, and further pressurized. With this structure, in bonding the lead frame and the semiconductor chip with the resin film as a bonding material, it is possible to prevent emergence of a void caused by sucking air and extending-off of the bonding material.

Abstract: A semiconductor manufacturing apparatus includes a film feeder for sequentially feeding a die bonding film; and a film piece cutter for cutting a die bonding film piece having a shape and dimension from the die bonding film fed by the film feeder. Further, the film piece cutter includes a male blade member which has a cutting blade at circumferential edges, reciprocated along a direction, and a female blade member which has an opening and a receiving blade corresponding to the cutting blade of the male blade member at an inner circumferential edge of the opening. The male blade member and the female blade member are alterable, and thus, it is possible to change the shape and dimension of the film piece defined by the cutting blades.

Abstract: A semiconductor device has a lead, an inner lead of which is upwardly bent while an outer lead is downwardly bent. A junction part of the outer lead is guided from a resin block on a level which is lower than that of an upper major surface of the semiconductor chip. In fabrication of this semiconductor device, a guide frame of a lead frame, a suspending lead and a die pad held by the same are flush with each other.