Abstract: A multilayer wiring board with a high degree of heat resistance, which is capable of low temperature fusion without the occurrence of resin flow, enables high precision, finely detailed conductive wiring, can be ideally applied to low volume high mix manufacturing configurations, and also has little impact on the environment is provided, together with a semiconductor device mounting board using such a multilayer wiring board, and a method of manufacturing such a multilayer wiring board. In the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating substrate formed from a thermoplastic resin composition comprising a polyarylketone resin with a crystalline melting peak temperature of at least 260° C.

Abstract: A multilayer wiring board with a high degree of heat resistance, which is capable of low temperature fusion without the occurrence of resin flow, enables high precision, finely detailed conductive wiring, can be ideally applied to low volume high mix manufacturing configurations, and also has little impact on the environment is provided, together with a semiconductor device mounting board using such a multilayer wiring board, and a method of manufacturing such a multilayer wiring board. In the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating substrate formed from a thermoplastic resin composition comprising a polyarylketone resin with a crystalline melting peak temperature of at least 260° C.

Abstract: A lighting device having a circuit board with a fine tube inserting opening, and electric parts, outputs high-frequency power to an emission bulb having a bent tube. A cover member has a cap on the one end side, and a holder on the other end side. A fine tube protruding from the end of the emission bulb, and having a bent portion on the middle portion thereof, is disposed so that the tip end portion from the bent portion is positioned close to the axis passing through the center of the cap as compared with the base portion from the bent portion on the side of the emission bulb. A principal amalgam is contained at a position on the cap side as to the position where the electric parts, which emit relatively a great quantity of heat, have been disposed. The bent portion is disposed on the side of the emission bulb as to the circuit board, and the tip end portion is inserted into the fine tube inserting opening, and is extended on the cap side.

Abstract: A glow discharge lamp has a discharge vessel, a pair of electrodes mounted in the discharge vessel, ionizable filling which is principally made of rare gas and filled in the discharge vessel, and emissive material containing zinc alloy and provided on at least one of the electrodes.

Abstract: A multilayer wiring board with a high degree of heat resistance, which is capable of low temperature fusion without the occurrence of resin flow, enables high precision, finely detailed conductive wiring, can be ideally applied to low volume high mix manufacturing configurations, and also has little impact on the environment is provided, together with a semiconductor device mounting board using such a multilayer wiring board, and a method of manufacturing such a multilayer wiring board. In the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating substrate formed from a thermoplastic resin composition comprising a polyarylketone resin with a crystalline melting peak temperature of at least 260° C.

Abstract: The present invention provides a semiconductor device integrated multilayer wiring board with a high degree of heat resistance, which is capable of low temperature fusion without the occurrence of resin flow, enables high precision, finely detailed conductive wiring, thereby enabling the production of high density, ultra small three dimensional mounting modules and the like, can also be ideally applied to low volume high mix manufacturing configurations, and has little impact on the environment, and also provides a method of manufacturing such a semiconductor device integrated multilayer wiring board. In the semiconductor device integrated multilayer wiring board, a wiring substrate is formed by embedding conductive wiring within an insulating substrate, formed from a thermoplastic resin composition comprising a polyarylketone resin with a crystalline melting peak temperature of at least 260° C.

Abstract: A glow discharge lamp has a discharge vessel, a pair of electrodes mounted in the discharge vessel, ionizable filling which is principally made of rare gas and filled in the discharge vessel, and emissive material containing zinc alloy and provided on at least one of the electrodes.

Abstract: A coupling device for a sheathed cable comprises a first coupling member for being connected to an end of a sheath of a sheathed cable and having a recess defined therein, a second coupling member slidable within the recess of the first coupling member, the first and second coupling members having openings defined therethrough so that the end of a core of the sheathed cable may be extended through the coupling members and operatively connected to one of an actuating mechanism and an actuatable mechanism, and a clip engageable to the first and second coupling members for locking the members together.

Abstract: An anchoring structure for a cable end comprises a securing body having a recess defined therein and having an opening defined through an outer surface thereof and extending into the recess, an anchoring nipple for being fixed to the end of the cable and fitted into the recess of the securing body through the opening for being operatively connected to the securing body. The nipple is a unitary member with a first substantially cylindrical half portion having an opening defined in a side wall thereof for receiving the end of the cable, and a second substantially cylindrical half portion joined side-by-side to the first substantially cylindrical half portion such that the nipple is substantially 8-shaped when viewed towards ends of the half portions.

Abstract: A solid state relay circuit includes a MOSFET receiving a photovoltaic output generated across a photovoltaic diode array responsive to a light signal from a light emitting element, a control electrode of a normally ON type driving transistor made to be at a high impedance state by a voltage generated across an impedance element connected in series to the photovoltaic diode array upon application of the photovoltaic output across the gate and source of the MOSFET and at a low impedance state upon disappearance of the photovoltaic output is connected to a connecting point between the diode array and the impedance element, and the driving transistor is connected across the gate and source of the MOSFET with a resistor interposed. A falling gradient of output signal upon being turned OFF of the relay circuit is made thereby sufficiently gentle, and relay operation upon being turned OFF can be minimized in response time.

Abstract: An intake system in a multi-cylinder type internal combustion engine comprises throttle valves disposed in a plurality of intake passages commonly connected to an air cleaner, and fuel injection valves disposed in the intake passages downstream of the throttle valves in an intake direction. In such intake system, a plurality of funnel-shaped portions are provided in a throttle body having opposite ends directly coupled to an intake manifold and an air cleaner, respectively, and each of the throttle valves is disposed in the throttle body, so that its upstream end in the intake direction is located at least on the corresponding funnel-shaped portion, when the throttle valve is fully opened. The throttle body includes ports provided therein, which are opened into the intake passages between a coupled surface of the throttle body to the intake manifold and the throttle valves, respectively, and which communicate with one another.

Abstract: A coil wire has a lubricant film formed on an outer surface of an insulation film covering a conductor. The lubricant film is made of polypropylene glycol or a material obtained by substituting a hydrogen atom at at least one end of polypropylene glycol with another reactive group so as to provide a coil wire wherein generation of organic gases can be suppressed.