Abstract: A planar heating element includes an insulating resin film and a heating portion that includes a conductive circuit on the insulating resin film. The insulating resin film includes missing portions penetrating the insulating resin film, surrounding a point on the insulating resin film, and including one or both of openings and recesses. The openings are disposed within the conductive circuit and outside of a circular region of a radius centered at the point. The recesses are recessed toward an inside of the insulating resin film and located on an outer edge of the insulating resin film.

Abstract: A wiring board includes: a support body including a plurality of openings passing from one surface to one other surface; and a conductor supported by the support body. The conductor includes: a first outer layer formed on one side of the support body; a second outer layer formed on the other surface of the support body and that has substantially the same shape as the first outer layer; and an inner layer formed inside the support body and that connects the first outer layer and the second outer layer. The inner layer has a frame shape along an outer edge of the first outer layer and along an outer edge of the second outer layer.

Abstract: A wiring board includes: a support body including at least one woven fabric woven from weaving yarns that are each formed by bundling insulating fibers; and a conductive body supported by the support body. The conductive body includes a first conductive path disposed on a first main face of the support body and that extends in a planar direction of the first main face. The first conductive path includes at least one of a first conductor portion disposed in a basket hole of the woven fabric and a first intervening portion disposed in a gap between the insulating fibers.

Abstract: A method of manufacturing a conductive layer on a support body includes a first process of forming a precursor layer containing at least one of metal particles and metal oxide particles on the support body; a second process of forming a sintering layer by irradiating an electromagnetic wave pulse on the precursor layer; and a third process of compressing the sintering layer. The conductive layer is formed by repeating the first to third processes “N” times, where “N” denotes a natural number equal to or greater than 2, on the same location of the support body, and the third process performed in the first to (N?1)th operations includes forming a surface of the sintering layer in an uneven shape.

Abstract: A method of manufacturing a conductive layer on a support body includes a first process of forming a precursor layer containing at least one of metal particles and metal oxide particles on the support body; a second process of forming a sintering layer by irradiating an electromagnetic wave pulse on the precursor layer; and a third process of compressing the sintering layer. The conductive layer is formed by repeating the first to third processes “N” times, where “N” denotes a natural number equal to or greater than 2, on the same location of the support body, and the third process performed in the first to (N?1)th operations includes forming a surface of the sintering layer in an uneven shape.

Abstract: The present invention provides a key switch diaphragm capable of obtaining a good click feeling and capable of avoiding contact failure and having a high durability. A key switch diaphragm 30 comprises a thin plate having flexibility and conductivity, and the key switch diaphragm 30 includes a truncated pedestal 16, and a spherical domical portion 18 being raised toward an upper portion of the pedestal 16 on the side of the upper portion of the pedestal 16. The domical portion 18 is provided at its substantially central portion with an outwardly raised portion 32 being raised toward an outer surface of the domical portion 18. An edge of the outwardly raised portion 32 on the side of its inner surface forms a contact 34.

Abstract: An insulating layer (3) having an opening portion (3a) at a position conformable to an electrode pad (2) is formed. Next, a resin projection portion (4) is formed on the insulating layer (3). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion (3a), the resin projection portion (4) and the region sandwiched therebetween. A Cu plating layer (6) is formed by electrolytic copper plating, using the resist film as a mask.

Abstract: An insulating layer (3) having an opening portion (3a) at a position conformable to an electrode pad (2) is formed. Next, a resin projection portion (4) is formed on the insulating layer (3). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion (3a), the resin projection portion (4) and the region sandwiched therebetween. A Cu plating layer (6) is formed by electrolytic copper plating, using the resist film as a mask.

Abstract: The present invention provides a key switch diaphragm capable of obtaining a good click feeling and capable of avoiding contact failure and having a high durability. A key switch diaphragm 30 comprises a thin plate having flexibility and conductivity, and the key switch diaphragm 30 includes a truncated pedestal 16, and a spherical domical portion 18 being raised toward an upper portion of the pedestal 16 on the side of the upper portion of the pedestal 16. The domical portion 18 is provided at its substantially central portion with an outwardly raised portion 32 being raised toward an outer surface of the domical portion 18. An edge of the outwardly raised portion 32 on the side of its inner surface forms a contact 34.

Abstract: An insulating layer (3) having an opening portion (3a) at a position conformable to an electrode pad (2) is formed. Next, a resin projection portion (4) is formed on the insulating layer (3). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion (3a), the resin projection portion (4) and the region sandwiched therebetween. A Cu plating layer (6) is formed by electrolytic copper plating, using the resist film as a mask.

Abstract: An insulating layer (3) having an opening portion (3a) at a position conformable to an electrode pad (2) is formed. Next, a resin projection portion (4) is formed on the insulating layer (3). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion (3a), the resin projection portion (4) and the region sandwiched therebetween. A Cu plating layer (6) is formed by electrolytic copper plating, using the resist film as a mask.

Abstract: A flexible printed circuit board (FPC) comprises a base film; a base film side adhesive layer provided on the base film; a metal foil layer on which a pattern circuit is formed, provided on the base film side adhesive layer; and a cover layer side adhesive layer provided on the metal foil layer, wherein at least one of the base film side adhesive and the cover layer side adhesive layer has a higher glass transition temperature than an operating temperature of the flexible printed circuit board, so that the FPC has a stable flexibility at high temperature.

Abstract: An insulating layer (3) having an opening portion (3a) at a position conformable to an electrode pad (2) is formed. Next, a resin projection portion (4) is formed on the insulating layer (3). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion (3a), the resin projection portion (4) and the region sandwiched therebetween. A Cu plating layer (6) is formed by electrolytic copper plating, using the resist film as a mask.

Abstract: A flexible printed circuit board (FPC) comprises a base film; a base film side adhesive layer provided on the base film; a metal foil layer on which a pattern circuit is formed, provided on the base film side adhesive layer; and a cover layer side adhesive layer provided on the metal foil layer, wherein at least one of the base film side adhesive and the cover layer side adhesive layer has a higher glass transition temperature than the working environment temperature of the flexible printed circuit board, so that the FPC has a stable flexibility at high temperature.

Abstract: A multi-layer structured printed circuit substrate having an upper conductive layer and a lower conductive layer with an inter-layer insulating layer is used. A chip assembly part of bump connection type is formed by forming openings in a portion of the upper conductive layer and the inter-layer insulating layer in order to expose the lower conductive layer. A bear chip is buried in the chip assembly part for assembly. A sealing member is filled in the lower space of the bear chip. A flat plate type radiating plate having an opening corresponding to the chip assembly part is located on the substrate and a heat conductive adhesive is filled between the radiating plate and the bear chip.

Abstract: An insulating layer (3) is formed on a Si wafer (1). An opening portion is made in this insulating layer (3), and subsequently a rerouting layer (2) is formed. Next, a resin layer (4) is formed on the rerouting layer (2). The resin layer (4) is then cured so that the rerouting layer (2) and a Cu foil (5) are bonded to each other through the resin layer (4). Thereafter, a ring-like opening portion (4a) is made in the resin layer (4), and a Cu plating layer (8) is formed inside this opening portion (4a).

Abstract: A light illumination membrane switch having a configuration with a reduced size, capable of realizing an effective light illumination of the keys and a highly reliable operation even under the high humidity environment. The switch has a light source section using an LED bare chip element for emitting lights to illuminate the key section which is directly mounted on the electrode circuit member of the printed circuit board. The switch may includes a translucent diffuser member having a cavity region for directly transmitting the lights emitted from the light source section to the key section. The switch may includes a translucent diffuser member having a side wall portion defining an opening such that the translucent diffuser member and the printed circuit board are assembled together by inserting the printed circuit board into the opening defined by the side wall portion.

Abstract: A light illumination membrane switch having a configuration with a reduced size, capable of realizing an effective light illumination of the keys and a highly reliable operation even under the high humidity environment. The switch has a light source section using an LED bare chip element for emitting lights to illuminate the key section which is directly mounted on the electrode circuit member of the printed circuit board. The switch may include a translucent diffuser member having a cavity region for directly transmitting the lights emitted from the light source section to the key section. The switch may include a translucent diffuser member having a side wall portion defining an opening such that the translucent diffuser member and the printed circuit board are assembled together by inserting the printed circuit board into the opening defined by the side wall portion.

Abstract: A click-action membrane switch unit comprises a flexible base film having two surfaces, flexible circuits formed on at least one of the two surfaces of the base film and having interdigitating electrode contacts, a resist film formed on the flexible circuits and having a window in the region of the electrode contacts, a dome-shaped click spring made of electrically conducting material and having an edge placed on the circuits, and a layer fixed to the other surface of the base film and having an opening formed in the portion of the layer which aligns with the click spring.