Abstract: An object of the present disclosure is to propose a technology that can allow even non-specialists to easily identify driving forces (DF) in order to support the creation of scenarios in line with the actual situation of a company.

Abstract: An object of the present invention is to provide a resist pattern forming method that has excellent pattern forming properties and generates few residues and a semiconductor chip manufacturing method. The resist pattern forming method according to an embodiment of the present invention has a step A of forming a film on a substrate by using an actinic ray-sensitive or radiation-sensitive resin composition containing a photoacid generator and a resin whose polarity is increased by the action of an acid, a step B of exposing the film, step C of developing the exposed film by using an alkali developer, a step D of washing the developed film by using water, and a step E of washing the film washed in the step D by using a chemical liquid containing an alcohol-based solvent, in which the alkali developer contains a quaternary ammonium salt.

Abstract: A touch panel member includes a first transparent resin layer, a first electrode substrate, a second transparent resin layer, and a second electrode substrate, which are disposed in this order. The first electrode substrate includes a first substrate and a first conductive pattern group. The second electrode substrate includes a second substrate and a second conductive pattern group. When a reference conductor is brought into contact with a touch panel cover while the touch panel cover is disposed on the first transparent resin layer at a side opposite to the first electrode substrate, the second conductive pattern group is configured to cause a second electrostatic capacity between the reference conductor and the second conductive pattern group range from 80% to 120%, inclusive, of a first electrostatic capacity between the reference conductor and the first conductive pattern group.

Abstract: A touch panel member includes a first transparent resin layer, a first electrode substrate, a second transparent resin layer, and a second electrode substrate, which are disposed in this order. The first electrode substrate includes a first substrate and a first conductive pattern group. The second electrode substrate includes a second substrate and a second conductive pattern group. When a reference conductor is brought into contact with a touch panel cover while the touch panel cover is disposed on the first transparent resin layer at a side opposite to the first electrode substrate, the second conductive pattern group is configured to cause a second electrostatic capacity between the reference conductor and the second conductive pattern group range from 80% to 120%, inclusive, of a first electrostatic capacity between the reference conductor and the first conductive pattern group.