Abstract: An object of the present invention is to provide a chemical liquid storage body which hardly causes short and defects in a formed wiring board in a case where a chemical liquid stored in the chemical liquid storage body is used in a wiring forming process including photolithography after the chemical liquid storage body is preserved for a certain period of time.

Abstract: An object of the present invention is to provide a chemical liquid purification method which makes it possible to obtain a chemical liquid having excellent defect inhibition performance. Another object of the present invention is to provide a chemical liquid. The chemical liquid purification method according to an embodiment of the present invention is a chemical liquid purification method including obtaining a chemical liquid by purifying a substance to be purified containing an organic solvent, in which a content of the stabilizer in the substance to be purified with respect to the total mass of the substance to be purified is equal to or greater than 0.1 mass ppm and less than 100 mass ppm.

Abstract: A touch panel member includes a first transparent resin layer, a first electrode substrate, a second transparent resin layer, and a second electrode substrate, which are disposed in this order. The first electrode substrate includes a first substrate and a first conductive pattern group. The second electrode substrate includes a second substrate and a second conductive pattern group. When a reference conductor is brought into contact with a touch panel cover while the touch panel cover is disposed on the first transparent resin layer at a side opposite to the first electrode substrate, the second conductive pattern group is configured to cause a second electrostatic capacity between the reference conductor and the second conductive pattern group range from 80% to 120%, inclusive, of a first electrostatic capacity between the reference conductor and the first conductive pattern group.

Abstract: A touch panel member includes a first transparent resin layer, a first electrode substrate, a second transparent resin layer, and a second electrode substrate, which are disposed in this order. The first electrode substrate includes a first substrate and a first conductive pattern group. The second electrode substrate includes a second substrate and a second conductive pattern group. When a reference conductor is brought into contact with a touch panel cover while the touch panel cover is disposed on the first transparent resin layer at a side opposite to the first electrode substrate, the second conductive pattern group is configured to cause a second electrostatic capacity between the reference conductor and the second conductive pattern group range from 80% to 120%, inclusive, of a first electrostatic capacity between the reference conductor and the first conductive pattern group.