Patents by Inventor Masahiro Kitamura
Masahiro Kitamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12238897Abstract: A heat dissipation structure, for a heat-generating electric component, includes: a heat dissipator disposed along a surface of the electric component; and a porous material held between the electric component and the heat dissipator. The porous material of the heat dissipation structure is impregnated with heat-transfer fluid. The heat-transfer fluid may include liquid metal.Type: GrantFiled: December 12, 2022Date of Patent: February 25, 2025Assignee: Lenovo (Singapore) Pte. Ltd.Inventors: Ryota Watanabe, Masahiro Kitamura, Mizuki Itoyama, Takuroh Kamimura, Junrong Zhou
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Publication number: 20250051299Abstract: A method for producing a fluoromethyl derivative represented by formula (1), the method including step A of reacting an alkene compound represented by formula (2) with a fluorine source represented by formula MFn, in the presence of a hypervalent-iodine aromatic compound (1a), or in the presence of an aromatic iodine compound (1b) and an oxidant (A) to fluorinate the alkene compound.Type: ApplicationFiled: October 29, 2024Publication date: February 13, 2025Applicants: DAIKIN INDUSTRIES, LTD., SAGA UNIVERSITYInventors: Masahiro HIGASHI, Yosuke KISHIKAWA, Tsugio KITAMURA
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Publication number: 20250008696Abstract: A heat radiation structure includes a metal mesh brought into contact with the surface of a die, and a heat receiving plate configured to sandwich the mesh between the surface of the die and the heat receiving plate. The mesh is impregnated with a liquid metal at least at a portion brought into contact with the surface of the die and has a shape in which intersection points of vertical and horizontal element wires are crushed in a thickness direction of the mesh. The mesh has a flat portion formed on the surface side of the element wire at each intersection point.Type: ApplicationFiled: March 25, 2024Publication date: January 2, 2025Applicant: LENOVO (SINGAPORE) PTE. LTD.Inventors: Masahiro Kitamura, Junki Hashiba, Takuroh Kamimura, Ryota Watanabe
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Patent number: 12124303Abstract: An electronic apparatus includes a chassis, a keyboard device, a frame including partition walls, and a fan device. At least part of the partition walls has a bottom edge surface notched to form an air flow path between the notched bottom edge surface and a top surface of the plate-shaped member, to have a communicating path through which adjacent key arrangement holes communicate. A height of the communicating path in a region not overlapping with the fan device is lower than a height of the communicating path in a region overlapping with the fan device, in a plan view of the chassis.Type: GrantFiled: September 21, 2022Date of Patent: October 22, 2024Assignee: LENOVO (SINGAPORE) PTE. LTD.Inventors: Masahiro Kitamura, Junki Hashiba, Po Han Chen, Satoshi Douzono
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Patent number: 12108561Abstract: An electronic apparatus includes a chassis, a heating element in the chassis, and a cooling module in the chassis to cool the heating element. The cooling module includes: a blower fan; a heat sink having a plurality of fins spaced to have a gap therebetween, a first face with a first gap from the first cover member, and a second face with a second gap from the second cover member; a seal member attached to the first face of the heat sink so as to surround the first face; and a cover sheet attached to a surface of the seal member so as to cover the first face of the heat sink, thus defining a duct between the cover sheet and the first face to let air from the blower fan pass through the duct.Type: GrantFiled: September 16, 2022Date of Patent: October 1, 2024Assignee: LENOVO (SINGAPORE) PTE. LTD.Inventors: Junki Hashiba, Masahiro Kitamura, Shunsuke Mashimo
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Patent number: 12096598Abstract: An electronic apparatus includes: a chassis; a first and a second heat generating elements which are placed with a step between surfaces thereof; and a cooling module that absorbs heat generated by the first and the second heat generating elements. The cooling module has: a first heat pipe having a first surface thereof connected to a surface of the first heat generating element; a plate-shaped vapor chamber having a first surface thereof connected to a surface of the second heat generating element and a second surface of the first heat pipe; a second heat pipe which is connected to a second surface of the vapor chamber and overlaps the second heat generating element; a first fin connected to the first heat pipe; and a second fin connected to the second heat pipe.Type: GrantFiled: September 24, 2022Date of Patent: September 17, 2024Assignee: LENOVO (SINGAPORE) PTE. LTD.Inventors: Kengo Sano, Masahiro Kitamura, Junki Hashiba, Shusaku Tomizawa
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Patent number: 12002733Abstract: A heat dissipation structure of an electric component that generates heat includes: a heat dissipator provided along a surface of the electric component; a liquid metal interposed between the electric component and the heat dissipator; and a fencing body interposed between the electric component and the heat dissipator in a crushed state and surrounding the liquid metal.Type: GrantFiled: November 9, 2022Date of Patent: June 4, 2024Assignee: Lenovo (Singapore) Pte. Ltd.Inventors: Masahiro Kitamura, Takuroh Kamimura, Junki Hashiba, Takateru Adachi
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Publication number: 20240165932Abstract: Provided is a decorative laminate having excellent distinctness of design of a design layer and excellent surface smoothness of a clear layer after removal of a cover film. The decorative laminate includes a cover film, a clear layer, a design layer, a substrate film, and an adhesive layer adjacently to one another in order. The cover film is thermally laminated to the clear layer. The design layer is a coating film of a design layer coating material. The clear layer is a coating film of a clear layer coating material.Type: ApplicationFiled: March 31, 2022Publication date: May 23, 2024Applicant: NIPPON PAINT AUTOMOTIVE COATINGS CO., LTD.Inventors: Masahiro KITAMURA, Takakazu HASE
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Patent number: 11971755Abstract: An electronic apparatus includes a chassis, a keyboard device which is installed on the upper surface side of the chassis and has a plurality of keycaps and a frame which is installed on the upper surface side of the chassis and isolates the respective keycaps of the keyboard device from one another, in which each of at least some of the plurality of keycaps has an upper plate which forms an operation surface, and side walls on four sides which are provided so as to hang down from a peripheral edge part of the upper plate and face the frame respectively, and in at least the side wall on one side of the side walls on the four sides, a flow path formation part which widens a clearance between that side wall and the frame and thereby forms an air flow path is provided.Type: GrantFiled: August 25, 2022Date of Patent: April 30, 2024Assignee: LENOVO (SINGAPORE) PTE. LTD.Inventors: Junki Hashiba, Masahiro Kitamura, Satoshi Douzono
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Patent number: 11968806Abstract: An electronic apparatus includes: a chassis; first and second heating elements in the chassis; and a cooling module absorbing the heat. The cooling module includes: a first vapor chamber connected to the first heating element; and a second vapor chamber connected to the second heating element. The first and second vapor chambers are placed adjacent to each other with a step therebetween. The first vapor chamber has a bridge that is a part of at least one of the two first metal plates, the bridge straddling the step and extending toward the second vapor chamber to be connected to a surface of the second vapor chamber. The bridge is not provided with the closed space.Type: GrantFiled: June 2, 2022Date of Patent: April 23, 2024Assignee: LENOVO (SINGAPORE) PTE. LTD.Inventors: Masahiro Kitamura, Yusuke Onoue, Takuroh Kamimura, Akinori Uchino
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Patent number: 11963333Abstract: An electronic apparatus includes: a chassis; a heat generating element provided in the chassis; and a cooling device that has a cooling fin, a heat pipe connecting the cooling fin and the heat generating element, and a pressing assembly pressing the heat pipe against the heat generating element, and is provided in the chassis. The heat pipe has: a heat absorbing section that absorbs heat generated by the heat generating element; and a thin plate section having a thickness which is smaller than that of the heat absorbing section. The pressing assembly has: a base assembly relatively fixed to the chassis; and a bridge section that is provided integrally with the base assembly and placed on a surface of the thin plate section in such a manner as to extend over the heat pipe in a width direction.Type: GrantFiled: March 29, 2022Date of Patent: April 16, 2024Assignee: LENOVO (SINGAPORE) PTE. LTD.Inventors: Masahiro Kitamura, Akinori Uchino, Shusaku Tomizawa
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Publication number: 20240121909Abstract: A centrifugal fan includes: a fan having a motor that rotates around a central axis, and a plurality of blades provided on an outer periphery of the motor; and a casing which accommodates the fan, and has an intake port provided in the axial direction of the central axis, and an exhaust port provided in a direction orthogonal to the central axis, wherein an end surface of each of the plurality of blades that faces the intake port is provided with an inclined portion that inclines such that a height thereof in the axial direction gradually decreases toward the motor, and the plurality of blades include a plurality of blade groups having different start point positions at which the inclined portions start to incline in a direction from the tips of the blades toward the motor.Type: ApplicationFiled: August 16, 2023Publication date: April 11, 2024Applicant: Lenovo (Singapore) Pte. Ltd.Inventors: Masahiro Kitamura, Junki Hashiba, Shusaku Tomizawa, Takateru Adachi
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Publication number: 20240121916Abstract: A heat radiation structure includes a mesh that abuts on a surface of a die, and a vapor chamber that interposes the mesh between the surface of the die and the vapor chamber. The mesh includes a heat generation element abutting range portion that is provided at a central portion of the mesh, is impregnated with a liquid metal, and abuts on the surface of the die to receive heat, and a pair of heat generation element non-abutting range portions that continuously extends from both sides of the heat generation element abutting range portion and does not abut on the surface of the die. Each of the pair of heat generation element non-abutting range portions is fixed to the vapor chamber via a sheet material. Each of a pair of the heat generation element non-abutting range portions is interposed between a pair of the sheet materials.Type: ApplicationFiled: September 19, 2023Publication date: April 11, 2024Applicant: LENOVO (SINGAPORE) PTE. LTD.Inventors: Masahiro Kitamura, Takuroh Kamimura, Ryota Watanabe, Junki Hashiba
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Publication number: 20240038622Abstract: A heat radiation component radiates heat from a GPU that generates heat, and includes a mesh impregnated with a liquid metal, and two film bodies that cover both surfaces of the mesh and have sealed peripheries. An opening is formed in the film body. In the mesh, an exposed portion that is exposed through the opening abuts on a surface of a die of the GPU. In the mesh, the portion exposed through the opening is formed of two layers, a first layer and a second layer. In the mesh, an area of the exposed portion exposed through the opening is smaller than an area of the other portion.Type: ApplicationFiled: July 24, 2023Publication date: February 1, 2024Applicant: LENOVO (SINGAPORE) PTE. LTD.Inventors: Ryota Watanabe, Masahiro Kitamura, Junki Hashiba, Takuroh Kamimura
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Publication number: 20240038710Abstract: A heat radiation structure includes a vapor chamber provided along a surface of a die, a mesh interposed between the die and the vapor chamber, and a liquid metal impregnated in the mesh. In the mesh, a peripheral portion has a higher material density per unit volume than a central portion. In the mesh, the central portion may be formed of a single layer, and the peripheral portion is formed of two layers. The mesh may be a resin material.Type: ApplicationFiled: June 21, 2023Publication date: February 1, 2024Applicant: LENOVO (SINGAPORE) PTE. LTD.Inventors: Junki Hashiba, Takuroh Kamimura, Masahiro Kitamura, Ryota Watanabe
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Publication number: 20240014098Abstract: A heat radiating structure includes a mesh which abuts on a surface of a die of a GPU and a copper plate which is equipped with a recessed part into which the mesh fits and which sandwiches and holds the mesh together with the surface of the die. The mesh includes a heat generating element abutment range part into which a liquid metal is impregnated and which abuts on the surface of the die and receives heat from the die and a heat generating element non-abutment region part which is contiguous to the heat generating element abutment range part and does not abut on the surface of the die. The heat generating element non-abutment range part is fixed to the copper plate with the use of a sponge tape. The heat generating element abutment range part is shaped to protrude from the heat generating element abutment range part.Type: ApplicationFiled: June 12, 2023Publication date: January 11, 2024Applicant: LENOVO (SINGAPORE) PTE. LTD.Inventors: Ryota Watanabe, Junki Hashiba, Masahiro Kitamura, Takuroh Kamimura
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Publication number: 20230422446Abstract: A cooling module includes a fan, a heat sink, and a first heat pipe and a second heat pipe that are connected to a first surface of the heat sink. The heat sink includes a valley portion in which the second surface is recessed toward a side of the first surface, a first mountain portion that is between the valley portion and the air introduction surface and has a greater height of the fin than the valley portion, and a second mountain portion that is between the valley portion and the air exhaust surface and has a greater height of the fin than the valley portion. The first mountain portion is disposed at a position overlapping the first heat pipe, and the second mountain portion is disposed at a position overlapping the second heat pipe.Type: ApplicationFiled: March 23, 2023Publication date: December 28, 2023Applicant: LENOVO (SINGAPORE) PTE. LTD.Inventors: Junki Hashiba, Masahiro Kitamura, Shusaku Tomizawa
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Publication number: 20230403823Abstract: A vapor chamber includes: a first metal plate; a second metal plate having an outer edge portion joined to the first metal plate and forming a sealed space in which working fluid is enclosed, the sealed space being formed between the first metal plate and the second metal plate; and a wick stored inside the sealed space. The first metal plate has a through-hole communicating with the sealed space, and the vapor chamber further includes a metal block inserted into the through-hole and joined to the first metal plate to seal the through-hole, the metal block having an outer surface formed flat on a side opposite to a side facing the sealed space.Type: ApplicationFiled: April 13, 2023Publication date: December 14, 2023Applicant: Lenovo (Singapore) Pte. Ltd.Inventors: Masahiro Kitamura, Takateru Adachi, Shusaku Tomizawa, Hajime Yoshizawa
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Patent number: 11843066Abstract: A photovoltaic cell module in which a difference in color between a photovoltaic cell and the other portion is made to disappear and the changes of the color and appearance of its surface depending upon a viewing angle is hardly visually recognized, while suppressing the reduction of the power generation amount of the photovoltaic cell. The present photovoltaic cell module includes a thin plate-like photovoltaic cell enclosed in transparent sealing material; a transparent face plate laminated on the surface of the sealing material on the light receiving surface side of the photovoltaic cell; and a decorative layer laminated on the face plate, where a transparent resin is employed as base material of the decorative layer and light transmissive scaly glitter pigment is dispersed in the decorative layer such that the surface direction of the pigment is along the face plate surface.Type: GrantFiled: August 7, 2020Date of Patent: December 12, 2023Assignees: TOYOTA JIDOSHA KABUSHIKI KAISHA, NIPPON PAINT AUTOMOTIVE COATINGS CO., LTD.Inventors: Yuki Kudo, Taizo Masuda, Masahiro Kitamura, Takakazu Hase
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Publication number: 20230382089Abstract: The present disclosure provides a multilayer film having a polyolefin layer (A), an adhesive resin layer (B), and an ethylene-vinyl alcohol copolymer resin composition layer (C).Type: ApplicationFiled: October 14, 2021Publication date: November 30, 2023Applicant: KURARAY CO., LTD.Inventors: Hiroyuki Shimo, Masahiro Kitamura, Houssier Didier