Patents by Inventor Masahiro Kitamura

Masahiro Kitamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240038710
    Abstract: A heat radiation structure includes a vapor chamber provided along a surface of a die, a mesh interposed between the die and the vapor chamber, and a liquid metal impregnated in the mesh. In the mesh, a peripheral portion has a higher material density per unit volume than a central portion. In the mesh, the central portion may be formed of a single layer, and the peripheral portion is formed of two layers. The mesh may be a resin material.
    Type: Application
    Filed: June 21, 2023
    Publication date: February 1, 2024
    Applicant: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Junki Hashiba, Takuroh Kamimura, Masahiro Kitamura, Ryota Watanabe
  • Publication number: 20240038622
    Abstract: A heat radiation component radiates heat from a GPU that generates heat, and includes a mesh impregnated with a liquid metal, and two film bodies that cover both surfaces of the mesh and have sealed peripheries. An opening is formed in the film body. In the mesh, an exposed portion that is exposed through the opening abuts on a surface of a die of the GPU. In the mesh, the portion exposed through the opening is formed of two layers, a first layer and a second layer. In the mesh, an area of the exposed portion exposed through the opening is smaller than an area of the other portion.
    Type: Application
    Filed: July 24, 2023
    Publication date: February 1, 2024
    Applicant: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Ryota Watanabe, Masahiro Kitamura, Junki Hashiba, Takuroh Kamimura
  • Publication number: 20240014098
    Abstract: A heat radiating structure includes a mesh which abuts on a surface of a die of a GPU and a copper plate which is equipped with a recessed part into which the mesh fits and which sandwiches and holds the mesh together with the surface of the die. The mesh includes a heat generating element abutment range part into which a liquid metal is impregnated and which abuts on the surface of the die and receives heat from the die and a heat generating element non-abutment region part which is contiguous to the heat generating element abutment range part and does not abut on the surface of the die. The heat generating element non-abutment range part is fixed to the copper plate with the use of a sponge tape. The heat generating element abutment range part is shaped to protrude from the heat generating element abutment range part.
    Type: Application
    Filed: June 12, 2023
    Publication date: January 11, 2024
    Applicant: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Ryota Watanabe, Junki Hashiba, Masahiro Kitamura, Takuroh Kamimura
  • Publication number: 20230422446
    Abstract: A cooling module includes a fan, a heat sink, and a first heat pipe and a second heat pipe that are connected to a first surface of the heat sink. The heat sink includes a valley portion in which the second surface is recessed toward a side of the first surface, a first mountain portion that is between the valley portion and the air introduction surface and has a greater height of the fin than the valley portion, and a second mountain portion that is between the valley portion and the air exhaust surface and has a greater height of the fin than the valley portion. The first mountain portion is disposed at a position overlapping the first heat pipe, and the second mountain portion is disposed at a position overlapping the second heat pipe.
    Type: Application
    Filed: March 23, 2023
    Publication date: December 28, 2023
    Applicant: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Junki Hashiba, Masahiro Kitamura, Shusaku Tomizawa
  • Publication number: 20230403823
    Abstract: A vapor chamber includes: a first metal plate; a second metal plate having an outer edge portion joined to the first metal plate and forming a sealed space in which working fluid is enclosed, the sealed space being formed between the first metal plate and the second metal plate; and a wick stored inside the sealed space. The first metal plate has a through-hole communicating with the sealed space, and the vapor chamber further includes a metal block inserted into the through-hole and joined to the first metal plate to seal the through-hole, the metal block having an outer surface formed flat on a side opposite to a side facing the sealed space.
    Type: Application
    Filed: April 13, 2023
    Publication date: December 14, 2023
    Applicant: Lenovo (Singapore) Pte. Ltd.
    Inventors: Masahiro Kitamura, Takateru Adachi, Shusaku Tomizawa, Hajime Yoshizawa
  • Patent number: 11843066
    Abstract: A photovoltaic cell module in which a difference in color between a photovoltaic cell and the other portion is made to disappear and the changes of the color and appearance of its surface depending upon a viewing angle is hardly visually recognized, while suppressing the reduction of the power generation amount of the photovoltaic cell. The present photovoltaic cell module includes a thin plate-like photovoltaic cell enclosed in transparent sealing material; a transparent face plate laminated on the surface of the sealing material on the light receiving surface side of the photovoltaic cell; and a decorative layer laminated on the face plate, where a transparent resin is employed as base material of the decorative layer and light transmissive scaly glitter pigment is dispersed in the decorative layer such that the surface direction of the pigment is along the face plate surface.
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: December 12, 2023
    Assignees: TOYOTA JIDOSHA KABUSHIKI KAISHA, NIPPON PAINT AUTOMOTIVE COATINGS CO., LTD.
    Inventors: Yuki Kudo, Taizo Masuda, Masahiro Kitamura, Takakazu Hase
  • Publication number: 20230382089
    Abstract: The present disclosure provides a multilayer film having a polyolefin layer (A), an adhesive resin layer (B), and an ethylene-vinyl alcohol copolymer resin composition layer (C).
    Type: Application
    Filed: October 14, 2021
    Publication date: November 30, 2023
    Applicant: KURARAY CO., LTD.
    Inventors: Hiroyuki Shimo, Masahiro Kitamura, Houssier Didier
  • Patent number: 11817398
    Abstract: A conductive paste contains (A) copper fine particles having an average particle diameter of 50 nm to 400 nm and a crystallite diameter of 20 nm to 50 nm, (B) copper particles having an average particle diameter of 0.8 ?m to 5 ?m and a ratio of a crystallite diameter to the crystallite diameter of the copper fine particles (A) of 1.0 to 2.0, and (C) a solvent.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: November 14, 2023
    Assignee: NAMICS CORPORATION
    Inventors: Masashi Kajita, Masahiro Kitamura, Takayuki Higuchi, Noritsuka Mizumura
  • Publication number: 20230294380
    Abstract: There is provided a multilayer film having a structure in which a layer (X) is an outermost layer and at least the layer (X), a layer (Y), and a layer (Z) are adjacently laminated in sequence, wherein the layer (X) is made of a resin composition (A) comprising a vinyl alcohol polymer (a) having a melting point of lower than 150° C. as a main component; the layer (Y) comprises an adhesive resin (B) having a melting point of lower than 150° C. as a main component; the layer (Z) comprises a polyolefin resin (C) having a melting point of lower than 150° C. as a main component; and the resin composition (A) comprises alkali metal ions (b) in 25 to 1500 ppm. Such a multilayer film is suitably used as a gas barrier film because it has excellent appearance and interlayer adhesiveness even while having a vinyl alcohol polymer as an outermost layer.
    Type: Application
    Filed: June 24, 2021
    Publication date: September 21, 2023
    Applicant: KURARAY CO., LTD.
    Inventors: Masahiro Kitamura, Kentaro Yoshida, Wout Luyten
  • Publication number: 20230240047
    Abstract: A heat dissipation structure, for a heat-generating electric component, includes: a heat dissipator disposed along a surface of the electric component; and a porous material held between the electric component and the heat dissipator. The porous material of the heat dissipation structure is impregnated with heat-transfer fluid. The heat-transfer fluid may include liquid metal.
    Type: Application
    Filed: December 12, 2022
    Publication date: July 27, 2023
    Applicant: Lenovo (Singapore) Pte. Ltd.
    Inventors: Ryota Watanabe, Masahiro Kitamura, Mizuki Itoyama, Takuroh Kamimura, Junrong Zhou
  • Publication number: 20230207419
    Abstract: A heat dissipation structure of an electric component that generates heat includes: a heat dissipator provided along a surface of the electric component; a liquid metal interposed between the electric component and the heat dissipator; and a fencing body interposed between the electric component and the heat dissipator in a crushed state and surrounding the liquid metal.
    Type: Application
    Filed: November 9, 2022
    Publication date: June 29, 2023
    Applicant: Lenovo (Singapore) Pte. Ltd.
    Inventors: Masahiro Kitamura, Takuroh Kamimura, Junki Hashiba, Takateru Adachi
  • Publication number: 20230197564
    Abstract: A heat dissipation structure, for a semiconductor chip in which a die is provided on a surface of a substrate and an electric element is provided around the die, includes: a heat transfer plate thermally connected to a surface of the die; a liquid metal provided between the surface of the die and the heat transfer plate; and an insulating material covering the electric element. The heat transfer plate has a recessed portion in a location facing the electric element.
    Type: Application
    Filed: October 4, 2022
    Publication date: June 22, 2023
    Applicant: Lenovo (Singapore) Pte. Ltd.
    Inventors: Junki Hashiba, Masahiro Kitamura, Akinori Uchino, Yusuke Onoue
  • Publication number: 20230200013
    Abstract: An electronic apparatus includes: a chassis; a first and a second heat generating elements which are placed with a step between surfaces thereof; and a cooling module that absorbs heat generated by the first and the second heat generating elements. The cooling module has: a first heat pipe having a first surface thereof connected to a surface of the first heat generating element; a plate-shaped vapor chamber having a first surface thereof connected to a surface of the second heat generating element and a second surface of the first heat pipe; a second heat pipe which is connected to a second surface of the vapor chamber and overlaps the second heat generating element; a first fin connected to the first heat pipe; and a second fin connected to the second heat pipe.
    Type: Application
    Filed: September 24, 2022
    Publication date: June 22, 2023
    Applicant: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Kengo Sano, Masahiro Kitamura, Junki Hashiba, Shusaku Tomizawa
  • Publication number: 20230189471
    Abstract: An electronic apparatus includes a chassis, a heating element in the chassis, and a cooling module in the chassis to cool the heating element. The cooling module includes: a blower fan; a heat sink having a plurality of fins spaced to have a gap therebetween, a first face with a first gap from the first cover member, and a second face with a second gap from the second cover member; a seal member attached to the first face of the heat sink so as to surround the first face; and a cover sheet attached to a surface of the seal member so as to cover the first face of the heat sink, thus defining a duct between the cover sheet and the first face to let air from the blower fan pass through the duct.
    Type: Application
    Filed: September 16, 2022
    Publication date: June 15, 2023
    Applicant: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Junki Hashiba, Masahiro Kitamura, Shunsuke Mashimo
  • Publication number: 20230152867
    Abstract: An electronic apparatus includes a chassis, a keyboard device, a frame including partition walls, and a fan device. At least part of the partition walls has a bottom edge surface notched to form an air flow path between the notched bottom edge surface and a top surface of the plate-shaped member, to have a communicating path through which adjacent key arrangement holes communicate. A height of the communicating path in a region not overlapping with the fan device is lower than a height of the communicating path in a region overlapping with the fan device, in a plan view of the chassis.
    Type: Application
    Filed: September 21, 2022
    Publication date: May 18, 2023
    Applicant: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Masahiro Kitamura, Junki Hashiba, Po Han Chen, Satoshi Douzono
  • Publication number: 20230150235
    Abstract: The present disclosure provides a multilayer film comprising a resin composition layer containing an ethylene-vinyl alcohol copolymer with an ethylene unit content of 20 mol% or more and 60 mol% or less and an ethylene-vinyl alcohol copolymer with an ethylene unit content being more than the ethylene-vinyl alcohol copolymer, and a thermoplastic resin layer.
    Type: Application
    Filed: April 14, 2021
    Publication date: May 18, 2023
    Applicant: KURARAY CO., LTD.
    Inventors: Frank Balemans, Hiroyuki Shimo, Masahiro Kitamura, Yuji Shimizu
  • Publication number: 20230147548
    Abstract: An electronic apparatus includes a chassis, a keyboard device which is installed on the upper surface side of the chassis and has a plurality of keycaps and a frame which is installed on the upper surface side of the chassis and isolates the respective keycaps of the keyboard device from one another, in which each of at least some of the plurality of keycaps has an upper plate which forms an operation surface, and side walls on four sides which are provided so as to hang down from a peripheral edge part of the upper plate and face the frame respectively, and in at least the side wall on one side of the side walls on the four sides, a flow path formation part which widens a clearance between that side wall and the frame and thereby forms an air flow path is provided.
    Type: Application
    Filed: August 25, 2022
    Publication date: May 11, 2023
    Applicant: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Junki Hashiba, Masahiro Kitamura, Satoshi Douzono
  • Publication number: 20230124239
    Abstract: An electronic apparatus includes: a heating element; and a plurality of heat pipes that is thermally connected to the heating element. Each of the heat pipes has a cross section having a rectangular shape, a heat receiving surface thermally connected to the heating element, and a side surface orthogonal to the heat receiving surface. The side surfaces of the heat pipes, which are adjacent to each other, are in surface contact with each other.
    Type: Application
    Filed: September 14, 2022
    Publication date: April 20, 2023
    Applicant: Lenovo (Singapore) Pte. Ltd.
    Inventors: Masahiro Kitamura, Takuroh Kamimura, Akinori Uchino, Ryota Watanabe
  • Publication number: 20230079287
    Abstract: An electronic apparatus uses the cooling effect of a vapor chamber and includes: a chassis; a motherboard which is provided in the chassis and has a CPU mounted on a front surface thereof; a vapor chamber having a working fluid sealed in a hermetically sealed space formed between two metal plates; a stud fixed to the upper surface of the vapor chamber; and a screw fixing the stud and the motherboard. The CPU is thermally connected to the upper surface of the vapor chamber. The motherboard has a mounting hole formed therein, and the screw is screwed to the stud through the mounting hole from the rear surface of the motherboard. The CPU is rectangular, and four studs and four screws are provided at positions in the vicinity of the four corners of the CPU.
    Type: Application
    Filed: July 7, 2022
    Publication date: March 16, 2023
    Applicant: Lenovo (Singapore) Pte. Ltd.
    Inventors: Masahiro Kitamura, Yusuke Onoue, Takuroh Kamimura
  • Publication number: 20230069684
    Abstract: An electronic apparatus includes: a chassis; first and second heating elements in the chassis; and a cooling module absorbing the heat. The cooling module includes: a first vapor chamber connected to the first heating element; and a second vapor chamber connected to the second heating element. The first and second vapor chambers are placed adjacent to each other with a step therebetween. The first vapor chamber has a bridge that is a part of at least one of the two first metal plates, the bridge straddling the step and extending toward the second vapor chamber to be connected to a surface of the second vapor chamber. The bridge is not provided with the closed space.
    Type: Application
    Filed: June 2, 2022
    Publication date: March 2, 2023
    Applicant: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Masahiro Kitamura, Yusuke Onoue, Takuroh Kamimura, Akinori Uchino