Abstract: A titanium target assembly includes a titanium sputtering target, a copper or copper alloy backing plate and serving as a support member for the target and a silver or silver alloy coating film and formed between the target and backing plate. The coating film is formed on a surface subjected to cleaning treatment on the bonding side or sides of the target and backing plate by physical vapor deposition. The titanium target and backing plate are solid phase diffusion bonded. The face(s) serve as the bonding plane. The assembly can be manufactured by cleaning the surface(s) of the target and/or backing plate on bonding side(s), forming a coating film on the cleaned surface(s) on bonding side(s) and solid phase diffusion-bonding the target and backing plate, while using surface(s) provided with coated film as the bonding plane. The target assembly possesses high bonding strength and excellent bonding stability and reliability.

Abstract: A titanium target assembly comprises a sputtering target of titanium, a backing plate composed of copper or a copper alloy and serving as a support member for the target and a coating film composed of silver or a silver alloy and formed between the target and the backing plate, wherein the coating film is formed on the surface subjected to a cleaning treatment on the bonding side of the target or on the bonding sides of the target and the backing plate according to the physical vapor deposition technique and the titanium target and the backing plate are solid phase diffusion bonded, while the face(s) provided with the coating film serves as the bonding plane. The titanium target assembly can be manufactured by a method comprising the steps of cleaning the surface(s) of the target and/or the backing plate on the bonding side(s) thereof, forming a coating film on the cleaned surface(s) on the bonding side(s) and solid phase diffusion-bonding the target and the backing plate at a pressure of not more than 0.