Abstract: In a method for manufacturing a wiring board in which two base members 10 made of metal are pasted in a manner that one side surfaces thereof are opposed and pasted to each other, then a wiring board formed by plural layers is formed on the other surface of each of the base members 10, then both the base members 10 are separated from each other, and the base members 10 are removed thereby to obtain wiring boards separately, in the case of pasting the two base members 10, a mold release agent in a liquid state is coated or printed on a portion except for the peripheral portion of the one side surface of each of the two base members 10, and an adhesive agent resin sheet 11 is disposed between the two base members 10 thereby to paste the peripheral portions of the base members 10 being attached with no mold release agent to each other by the adhesive agent resin sheet 11.