Patents by Inventor Masahiro Meguro

Masahiro Meguro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11933543
    Abstract: A heat sink includes: a container having a cavity inside and a first surface and a second surface opposite the first surface; a working fluid encapsulated in the cavity; and a steam flow path in the cavity where the working fluid in a gas phase flows, the first surface having a flat part and a protruding part projecting from the flat part in an external direction, causing the container to have a flat portion and a protruding portion projecting from the flat portion in the external direction, an inner space of the protruding portion of the container being in communication with an inner space of the flat portion, causing the cavity to be formed, and a first heat radiating fin being provided on an exterior of the flat part of the first surface and a second heat radiating fin being provided on an exterior of the second surface.
    Type: Grant
    Filed: October 21, 2022
    Date of Patent: March 19, 2024
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kenya Kawabata, Masahiro Meguro, Ryo Tsubata, Hirofumi Aoki, Yoshikatsu Inagaki, Hiroshi Sakai, Hideaki Kawabata
  • Patent number: 11867467
    Abstract: A cooling device includes a heat-radiating fin group having a plurality of heat-radiating fins that are arranged parallel to each other in a first direction; first heat pipes, one end of each first heat pipe being configured to be thermally connected to a first heat-generating element, another end of each first heat pipe being thermally connected to the heat-radiating fin group; and second heat pipes, one end of each second heat pipe being configured to be thermally connected to a second heat-generating element, another end of each second heat pipe being thermally connected to the heat-radiating fin group, wherein respective inserted another ends of the first and second heat pipes are disposed on a plane parallel to the first direction and defined in the heat-radiating fin group and have portions parallel to the first direction.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: January 9, 2024
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Shinichi Ito, Masahiro Meguro, Kenya Kawabata, Yoshikatsu Inagaki
  • Patent number: 11725883
    Abstract: Provided herein is an example heat sink including a heat dissipation unit including a plurality of heat dissipation fin groups including a plurality of heat dissipation fins, the plurality of heat dissipation fin groups forming a laminated structure and a plurality of heat pipes, one end portions of which are thermally connected to a heating element and other end portions of which are inserted into a space provided between the plurality of heat dissipation fin groups forming the laminated structure and thermally connected to the heat dissipation unit.
    Type: Grant
    Filed: October 28, 2022
    Date of Patent: August 15, 2023
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Yasuyuki Tochigi, Masahiro Meguro, Hiroshi Sakai, Kenya Kawabata
  • Publication number: 20230106794
    Abstract: A heat sink includes: a container having a cavity inside and a first surface and a second surface opposite the first surface; a working fluid encapsulated in the cavity; and a steam flow path in the cavity where the working fluid in a gas phase flows, the first surface having a flat part and a protruding part projecting from the flat part in an external direction, causing the container to have a flat portion and a protruding portion projecting from the flat portion in the external direction, an inner space of the protruding portion of the container being in communication with an inner space of the flat portion, causing the cavity to be formed, and a first heat radiating fin being provided on an exterior of the flat part of the first surface and a second heat radiating fin being provided on an exterior of the second surface.
    Type: Application
    Filed: October 21, 2022
    Publication date: April 6, 2023
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kenya Kawabata, Masahiro Meguro, Ryo Tsubata, Hirofumi Aoki, Yoshikatsu Inagaki, Hiroshi Sakai, Hideaki Kawabata
  • Publication number: 20230102800
    Abstract: Provided herein is an example heat sink including a heat dissipation unit including a plurality of heat dissipation fin groups including a plurality of heat dissipation fins, the plurality of heat dissipation fin groups forming a laminated structure and a plurality of heat pipes, one end portions of which are thermally connected to a heating element and other end portions of which are inserted into a space provided between the plurality of heat dissipation fin groups forming the laminated structure and thermally connected to the heat dissipation unit.
    Type: Application
    Filed: October 28, 2022
    Publication date: March 30, 2023
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Yasuyuki TOCHIGI, Masahiro MEGURO, Hiroshi SAKAI, Kenya KAWABATA
  • Patent number: 11543189
    Abstract: Provided herein is an example heat sink including a heat dissipation unit including a plurality of heat dissipation fin groups including a plurality of heat dissipation fins, the plurality of heat dissipation fin groups forming a laminated structure and a plurality of heat pipes, one end portions of which are thermally connected to a heating element and other end portions of which are inserted into a space provided between the plurality of heat dissipation fin groups forming the laminated structure and thermally connected to the heat dissipation unit.
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: January 3, 2023
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Yasuyuki Tochigi, Masahiro Meguro, Hiroshi Sakai, Kenya Kawabata
  • Patent number: 11287192
    Abstract: Provided is a heat sink having excellent heat dissipation efficiency by having excellent thermal diffusion characteristics in a planar direction of a heat receiving plate. The heat sink has the heat receiving plate that is thermally connected to a heating element, heat pipes that are thermally connected to the heat receiving plate and are formed from a tube body, and heat dissipation fins that are thermally connected to the heat receiving plate, wherein the heat pipes are provided in a plurality of layers in a vertical direction to a surface of the heat receiving plate, and in at least two layers of the plurality of layers, positions of the heat pipes on the surface of the heat receiving plate are not identical to each other.
    Type: Grant
    Filed: October 4, 2016
    Date of Patent: March 29, 2022
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yasuyuki Tochigi, Hung Wei Tseng, Kuang Yu Chu, Masahiro Meguro, Kenya Kawabata
  • Patent number: 11150028
    Abstract: A cooling device includes first heat pipes thermally connected to a first heat-generating element at one end and thermally connected to the superimposed first and second heat-radiating fin groups at another end; and second heat pipes thermally connected to a second heat-generating element at one end and thermally connected to the superimposed second and third heat-radiating fin groups at another end, wherein the respective another ends of the first heat pipes altogether span a substantially entirety of a planar area between the first and second heat-radiating fin groups, and the respective another ends of the second heat pipes altogether span a substantially entirety of a planar area between the second and third heat-radiating fin groups.
    Type: Grant
    Filed: February 21, 2020
    Date of Patent: October 19, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Shinichi Ito, Masahiro Meguro, Kenya Kawabata
  • Publication number: 20210318072
    Abstract: A cooling device includes a heat-radiating fin group having a plurality of heat-radiating fins that are arranged parallel to each other in a first direction; first heat pipes, one end of each first heat pipe being configured to be thermally connected to a first heat-generating element, another end of each first heat pipe being thermally connected to the heat-radiating fin group; and second heat pipes, one end of each second heat pipe being configured to be thermally connected to a second heat-generating element, another end of each second heat pipe being thermally connected to the heat-radiating fin group, wherein respective inserted another ends of the first and second heat pipes are disposed on a plane parallel to the first direction and defined in the heat-radiating fin group and have portions parallel to the first direction.
    Type: Application
    Filed: June 23, 2021
    Publication date: October 14, 2021
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Shinichi ITO, Masahiro MEGURO, Kenya KAWABATA, Yoshikatsu INAGAKI
  • Publication number: 20210010761
    Abstract: The heat sink includes a radiation fin extending in a vertical direction from a heat-receiving unit, in which the radiation fin includes a notched portion in which a tip end side corner of the radiation fin is retracted inward in a main surface direction of the radiation fin with respect to a virtual rectangle or a virtual square formed of a side of the radiation fin on the heat-receiving unit side viewed from the main surface side, a first side extending from both ends of the side on the heat-receiving unit side in a direction orthogonal to the side on the heat-receiving unit side and a second side formed by extending a linear portion on the side of the radiation fin on a tip end side facing the side on the heat-receiving unit side to the first side.
    Type: Application
    Filed: September 28, 2020
    Publication date: January 14, 2021
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Masato WATANABE, Masahiro MEGURO, Hiroshi SAKAI, Yasuhiro UCHIMURA, Shuta HIKICHI
  • Publication number: 20200355443
    Abstract: Provided herein is an example heat sink including a heat dissipation unit including a plurality of heat dissipation fin groups including a plurality of heat dissipation fins, the plurality of heat dissipation fin groups forming a laminated structure and a plurality of heat pipes, one end portions of which are thermally connected to a heating element and other end portions of which are inserted into a space provided between the plurality of heat dissipation fin groups forming the laminated structure and thermally connected to the heat dissipation unit.
    Type: Application
    Filed: July 21, 2020
    Publication date: November 12, 2020
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Yasuyuki TOCHIGI, Masahiro MEGURO, Hiroshi SAKAI, Kenya KAWABATA
  • Patent number: 10809011
    Abstract: Provided is a heat sink where the formation of a boundary layer on surfaces of heat radiating fins is suppressed so that portions other than on the windward side along the cooling air flow can also exhibit excellent heat radiation property. The heat sink includes: a base plate; a first heat radiating fin thermally connected to the base plate; and a second heat radiating fin disposed adjacently to a side end portion of the first heat radiating fin, and thermally connected to the base plate, wherein a surface of the first heat radiating fin is not parallel to a surface of the second heat radiating fin, and at least one of the second heat radiating fins is disposed at a position lower than at least one of the first heat radiating fins in a vertical direction with respect to a front surface of the base plate.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: October 20, 2020
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Kuang Yu Chu, Masaaki Yamamoto, Hung Wei Tseng, Masahiro Meguro, Masato Watanabe
  • Publication number: 20200326131
    Abstract: Example embodiments may provide a heat sink capable of cooling even when hot spots generate a large amount of heat that is unevenly distributed in some regions of a heating element package. The heat sink may include a plurality of heat pipes including one end portions thermally connected to a heating element package provided with a heating element in a package and other end portions thermally connected to a heat dissipation unit, in which the plurality of heat pipes includes at least a first heat pipe and a second heat pipe having greater heat transport capacity than heat transport capacity of the first heat pipe.
    Type: Application
    Filed: June 25, 2020
    Publication date: October 15, 2020
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Shuta HIKICHI, Kenya KAWABATA, Masahiro MEGURO, Hiroshi SAKAI, Masato WATANABE, Yasuhiro UCHIMURA
  • Publication number: 20200191494
    Abstract: A cooling device includes first heat pipes thermally connected to a first heat-generating element at one end and thermally connected to the superimposed first and second heat-radiating fin groups at another end; and second heat pipes thermally connected to a second heat-generating element at one end and thermally connected to the superimposed second and third heat-radiating fin groups at another end, wherein the respective another ends of the first heat pipes altogether span a substantially entirety of a planar area between the first and second heat-radiating fin groups, and the respective another ends of the second heat pipes altogether span a substantially entirety of a planar area between the second and third heat-radiating fin groups.
    Type: Application
    Filed: February 21, 2020
    Publication date: June 18, 2020
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Shinichi ITO, Masahiro MEGURO, Kenya KAWABATA
  • Patent number: 10598441
    Abstract: A heat sink includes a base plate thermally connectable to a heat generating element and having a flat plate shape, a first heat radiating fin thermally connected to the base plate, and a second heat radiating fin disposed adjacently to a side end portion of the first heat radiating fin and thermally connected to the base plate. A surface of the first heat radiating fin is not parallel to a surface of the second heat radiating fin.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: March 24, 2020
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Kenya Kawabata, Masahiro Meguro, Kuang Yu Chu, Hung Wei Tseng
  • Patent number: 10571199
    Abstract: A cooling device includes first heat pipes thermally connected to a first heat-generating element at one end and thermally connected to the superimposed first and second heat-radiating fin groups at another end; and second heat pipes thermally connected to a second heat-generating element at one end and thermally connected to the superimposed second and third heat-radiating fin groups at another end, wherein the respective another ends of the first heat pipes altogether span a substantially entirety of a planar area between the first and second heat-radiating fin groups, and the respective another ends of the second heat pipes altogether span a substantially entirety of a planar area between the second and third heat-radiating fin groups.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: February 25, 2020
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Shinichi Ito, Masahiro Meguro, Kenya Kawabata
  • Publication number: 20200049418
    Abstract: Provided is a heat sink where the formation of a boundary layer on surfaces of heat radiating fins is suppressed so that portions other than on the windward side along the cooling air flow can also exhibit excellent heat radiation property. The heat sink includes: a base plate; a first heat radiating fin thermally connected to the base plate; and a second heat radiating fin disposed adjacently to a side end portion of the first heat radiating fin, and thermally connected to the base plate, wherein a surface of the first heat radiating fin is not parallel to a surface of the second heat radiating fin, and at least one of the second heat radiating fins is disposed at a position lower than at least one of the first heat radiating fins in a vertical direction with respect to a front surface of the base plate.
    Type: Application
    Filed: October 22, 2019
    Publication date: February 13, 2020
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kuang Yu CHU, Masaaki YAMAMOTO, Hung Wei TSENG, Masahiro MEGURO, Masato WATANABE
  • Publication number: 20190323779
    Abstract: A heat sink includes a base plate thermally connectable to a heat generating element and having a flat plate shape, a first heat radiating fin thermally connected to the base plate, and a second heat radiating fin disposed adjacently to a side end portion of the first heat radiating fin and thermally connected to the base plate. A surface of the first heat radiating fin is not parallel to a surface of the second heat radiating fin.
    Type: Application
    Filed: July 2, 2019
    Publication date: October 24, 2019
    Applicant: Furukawa Automotive Systems Inc.
    Inventors: Kenya Kawabata, Masahiro Meguro, Kuang Yu Chu, Hung Wei Tseng
  • Publication number: 20180283797
    Abstract: Provided is a heat sink having excellent heat dissipation efficiency by having excellent thermal diffusion characteristics in a planar direction of a heat receiving plate. The heat sink has the heat receiving plate that is thermally connected to a heating element, heat pipes that are thermally connected to the heat receiving plate and are formed from a tube body, and heat dissipation fins that are thermally connected to the heat receiving plate, wherein the heat pipes are provided in a plurality of layers in a vertical direction to a surface of the heat receiving plate, and in at least two layers of the plurality of layers, positions of the heat pipes on the surface of the heat receiving plate are not identical to each other.
    Type: Application
    Filed: October 4, 2016
    Publication date: October 4, 2018
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Yasuyuki Tochigi, Hung Wei Tseng, Kuang Yu Chu, Masahiro Meguro, Kenya Kawabata
  • Publication number: 20180128552
    Abstract: A cooling device includes first heat pipes thermally connected to a first heat-generating element at one end and thermally connected to the superimposed first and second heat-radiating fin groups at another end; and second heat pipes thermally connected to a second heat-generating element at one end and thermally connected to the superimposed second and third heat-radiating fin groups at another end, wherein the respective another ends of the first heat pipes altogether span a substantially entirety of a planar area between the first and second heat-radiating fin groups, and the respective another ends of the second heat pipes altogether span a substantially entirety of a planar area between the second and third heat-radiating fin groups.
    Type: Application
    Filed: January 10, 2018
    Publication date: May 10, 2018
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Shinichi ITO, Masahiro MEGURO, Kenya KAWABATA