Patents by Inventor Masahiro Meguro
Masahiro Meguro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11933543Abstract: A heat sink includes: a container having a cavity inside and a first surface and a second surface opposite the first surface; a working fluid encapsulated in the cavity; and a steam flow path in the cavity where the working fluid in a gas phase flows, the first surface having a flat part and a protruding part projecting from the flat part in an external direction, causing the container to have a flat portion and a protruding portion projecting from the flat portion in the external direction, an inner space of the protruding portion of the container being in communication with an inner space of the flat portion, causing the cavity to be formed, and a first heat radiating fin being provided on an exterior of the flat part of the first surface and a second heat radiating fin being provided on an exterior of the second surface.Type: GrantFiled: October 21, 2022Date of Patent: March 19, 2024Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Kenya Kawabata, Masahiro Meguro, Ryo Tsubata, Hirofumi Aoki, Yoshikatsu Inagaki, Hiroshi Sakai, Hideaki Kawabata
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Patent number: 11867467Abstract: A cooling device includes a heat-radiating fin group having a plurality of heat-radiating fins that are arranged parallel to each other in a first direction; first heat pipes, one end of each first heat pipe being configured to be thermally connected to a first heat-generating element, another end of each first heat pipe being thermally connected to the heat-radiating fin group; and second heat pipes, one end of each second heat pipe being configured to be thermally connected to a second heat-generating element, another end of each second heat pipe being thermally connected to the heat-radiating fin group, wherein respective inserted another ends of the first and second heat pipes are disposed on a plane parallel to the first direction and defined in the heat-radiating fin group and have portions parallel to the first direction.Type: GrantFiled: June 23, 2021Date of Patent: January 9, 2024Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Shinichi Ito, Masahiro Meguro, Kenya Kawabata, Yoshikatsu Inagaki
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Patent number: 11725883Abstract: Provided herein is an example heat sink including a heat dissipation unit including a plurality of heat dissipation fin groups including a plurality of heat dissipation fins, the plurality of heat dissipation fin groups forming a laminated structure and a plurality of heat pipes, one end portions of which are thermally connected to a heating element and other end portions of which are inserted into a space provided between the plurality of heat dissipation fin groups forming the laminated structure and thermally connected to the heat dissipation unit.Type: GrantFiled: October 28, 2022Date of Patent: August 15, 2023Assignee: Furukawa Electric Co., Ltd.Inventors: Yasuyuki Tochigi, Masahiro Meguro, Hiroshi Sakai, Kenya Kawabata
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Publication number: 20230106794Abstract: A heat sink includes: a container having a cavity inside and a first surface and a second surface opposite the first surface; a working fluid encapsulated in the cavity; and a steam flow path in the cavity where the working fluid in a gas phase flows, the first surface having a flat part and a protruding part projecting from the flat part in an external direction, causing the container to have a flat portion and a protruding portion projecting from the flat portion in the external direction, an inner space of the protruding portion of the container being in communication with an inner space of the flat portion, causing the cavity to be formed, and a first heat radiating fin being provided on an exterior of the flat part of the first surface and a second heat radiating fin being provided on an exterior of the second surface.Type: ApplicationFiled: October 21, 2022Publication date: April 6, 2023Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Kenya Kawabata, Masahiro Meguro, Ryo Tsubata, Hirofumi Aoki, Yoshikatsu Inagaki, Hiroshi Sakai, Hideaki Kawabata
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Publication number: 20230102800Abstract: Provided herein is an example heat sink including a heat dissipation unit including a plurality of heat dissipation fin groups including a plurality of heat dissipation fins, the plurality of heat dissipation fin groups forming a laminated structure and a plurality of heat pipes, one end portions of which are thermally connected to a heating element and other end portions of which are inserted into a space provided between the plurality of heat dissipation fin groups forming the laminated structure and thermally connected to the heat dissipation unit.Type: ApplicationFiled: October 28, 2022Publication date: March 30, 2023Applicant: Furukawa Electric Co., Ltd.Inventors: Yasuyuki TOCHIGI, Masahiro MEGURO, Hiroshi SAKAI, Kenya KAWABATA
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Patent number: 11543189Abstract: Provided herein is an example heat sink including a heat dissipation unit including a plurality of heat dissipation fin groups including a plurality of heat dissipation fins, the plurality of heat dissipation fin groups forming a laminated structure and a plurality of heat pipes, one end portions of which are thermally connected to a heating element and other end portions of which are inserted into a space provided between the plurality of heat dissipation fin groups forming the laminated structure and thermally connected to the heat dissipation unit.Type: GrantFiled: July 21, 2020Date of Patent: January 3, 2023Assignee: Furukawa Electric Co., Ltd.Inventors: Yasuyuki Tochigi, Masahiro Meguro, Hiroshi Sakai, Kenya Kawabata
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Patent number: 11287192Abstract: Provided is a heat sink having excellent heat dissipation efficiency by having excellent thermal diffusion characteristics in a planar direction of a heat receiving plate. The heat sink has the heat receiving plate that is thermally connected to a heating element, heat pipes that are thermally connected to the heat receiving plate and are formed from a tube body, and heat dissipation fins that are thermally connected to the heat receiving plate, wherein the heat pipes are provided in a plurality of layers in a vertical direction to a surface of the heat receiving plate, and in at least two layers of the plurality of layers, positions of the heat pipes on the surface of the heat receiving plate are not identical to each other.Type: GrantFiled: October 4, 2016Date of Patent: March 29, 2022Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Yasuyuki Tochigi, Hung Wei Tseng, Kuang Yu Chu, Masahiro Meguro, Kenya Kawabata
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Patent number: 11150028Abstract: A cooling device includes first heat pipes thermally connected to a first heat-generating element at one end and thermally connected to the superimposed first and second heat-radiating fin groups at another end; and second heat pipes thermally connected to a second heat-generating element at one end and thermally connected to the superimposed second and third heat-radiating fin groups at another end, wherein the respective another ends of the first heat pipes altogether span a substantially entirety of a planar area between the first and second heat-radiating fin groups, and the respective another ends of the second heat pipes altogether span a substantially entirety of a planar area between the second and third heat-radiating fin groups.Type: GrantFiled: February 21, 2020Date of Patent: October 19, 2021Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Shinichi Ito, Masahiro Meguro, Kenya Kawabata
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Publication number: 20210318072Abstract: A cooling device includes a heat-radiating fin group having a plurality of heat-radiating fins that are arranged parallel to each other in a first direction; first heat pipes, one end of each first heat pipe being configured to be thermally connected to a first heat-generating element, another end of each first heat pipe being thermally connected to the heat-radiating fin group; and second heat pipes, one end of each second heat pipe being configured to be thermally connected to a second heat-generating element, another end of each second heat pipe being thermally connected to the heat-radiating fin group, wherein respective inserted another ends of the first and second heat pipes are disposed on a plane parallel to the first direction and defined in the heat-radiating fin group and have portions parallel to the first direction.Type: ApplicationFiled: June 23, 2021Publication date: October 14, 2021Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Shinichi ITO, Masahiro MEGURO, Kenya KAWABATA, Yoshikatsu INAGAKI
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Publication number: 20210010761Abstract: The heat sink includes a radiation fin extending in a vertical direction from a heat-receiving unit, in which the radiation fin includes a notched portion in which a tip end side corner of the radiation fin is retracted inward in a main surface direction of the radiation fin with respect to a virtual rectangle or a virtual square formed of a side of the radiation fin on the heat-receiving unit side viewed from the main surface side, a first side extending from both ends of the side on the heat-receiving unit side in a direction orthogonal to the side on the heat-receiving unit side and a second side formed by extending a linear portion on the side of the radiation fin on a tip end side facing the side on the heat-receiving unit side to the first side.Type: ApplicationFiled: September 28, 2020Publication date: January 14, 2021Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Masato WATANABE, Masahiro MEGURO, Hiroshi SAKAI, Yasuhiro UCHIMURA, Shuta HIKICHI
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Publication number: 20200355443Abstract: Provided herein is an example heat sink including a heat dissipation unit including a plurality of heat dissipation fin groups including a plurality of heat dissipation fins, the plurality of heat dissipation fin groups forming a laminated structure and a plurality of heat pipes, one end portions of which are thermally connected to a heating element and other end portions of which are inserted into a space provided between the plurality of heat dissipation fin groups forming the laminated structure and thermally connected to the heat dissipation unit.Type: ApplicationFiled: July 21, 2020Publication date: November 12, 2020Applicant: Furukawa Electric Co., Ltd.Inventors: Yasuyuki TOCHIGI, Masahiro MEGURO, Hiroshi SAKAI, Kenya KAWABATA
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Patent number: 10809011Abstract: Provided is a heat sink where the formation of a boundary layer on surfaces of heat radiating fins is suppressed so that portions other than on the windward side along the cooling air flow can also exhibit excellent heat radiation property. The heat sink includes: a base plate; a first heat radiating fin thermally connected to the base plate; and a second heat radiating fin disposed adjacently to a side end portion of the first heat radiating fin, and thermally connected to the base plate, wherein a surface of the first heat radiating fin is not parallel to a surface of the second heat radiating fin, and at least one of the second heat radiating fins is disposed at a position lower than at least one of the first heat radiating fins in a vertical direction with respect to a front surface of the base plate.Type: GrantFiled: October 22, 2019Date of Patent: October 20, 2020Assignee: Furukawa Electric Co., Ltd.Inventors: Kuang Yu Chu, Masaaki Yamamoto, Hung Wei Tseng, Masahiro Meguro, Masato Watanabe
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Publication number: 20200326131Abstract: Example embodiments may provide a heat sink capable of cooling even when hot spots generate a large amount of heat that is unevenly distributed in some regions of a heating element package. The heat sink may include a plurality of heat pipes including one end portions thermally connected to a heating element package provided with a heating element in a package and other end portions thermally connected to a heat dissipation unit, in which the plurality of heat pipes includes at least a first heat pipe and a second heat pipe having greater heat transport capacity than heat transport capacity of the first heat pipe.Type: ApplicationFiled: June 25, 2020Publication date: October 15, 2020Applicant: Furukawa Electric Co., Ltd.Inventors: Shuta HIKICHI, Kenya KAWABATA, Masahiro MEGURO, Hiroshi SAKAI, Masato WATANABE, Yasuhiro UCHIMURA
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Publication number: 20200191494Abstract: A cooling device includes first heat pipes thermally connected to a first heat-generating element at one end and thermally connected to the superimposed first and second heat-radiating fin groups at another end; and second heat pipes thermally connected to a second heat-generating element at one end and thermally connected to the superimposed second and third heat-radiating fin groups at another end, wherein the respective another ends of the first heat pipes altogether span a substantially entirety of a planar area between the first and second heat-radiating fin groups, and the respective another ends of the second heat pipes altogether span a substantially entirety of a planar area between the second and third heat-radiating fin groups.Type: ApplicationFiled: February 21, 2020Publication date: June 18, 2020Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Shinichi ITO, Masahiro MEGURO, Kenya KAWABATA
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Patent number: 10598441Abstract: A heat sink includes a base plate thermally connectable to a heat generating element and having a flat plate shape, a first heat radiating fin thermally connected to the base plate, and a second heat radiating fin disposed adjacently to a side end portion of the first heat radiating fin and thermally connected to the base plate. A surface of the first heat radiating fin is not parallel to a surface of the second heat radiating fin.Type: GrantFiled: November 14, 2017Date of Patent: March 24, 2020Assignee: Furukawa Electric Co., Ltd.Inventors: Kenya Kawabata, Masahiro Meguro, Kuang Yu Chu, Hung Wei Tseng
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Patent number: 10571199Abstract: A cooling device includes first heat pipes thermally connected to a first heat-generating element at one end and thermally connected to the superimposed first and second heat-radiating fin groups at another end; and second heat pipes thermally connected to a second heat-generating element at one end and thermally connected to the superimposed second and third heat-radiating fin groups at another end, wherein the respective another ends of the first heat pipes altogether span a substantially entirety of a planar area between the first and second heat-radiating fin groups, and the respective another ends of the second heat pipes altogether span a substantially entirety of a planar area between the second and third heat-radiating fin groups.Type: GrantFiled: January 10, 2018Date of Patent: February 25, 2020Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Shinichi Ito, Masahiro Meguro, Kenya Kawabata
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Publication number: 20200049418Abstract: Provided is a heat sink where the formation of a boundary layer on surfaces of heat radiating fins is suppressed so that portions other than on the windward side along the cooling air flow can also exhibit excellent heat radiation property. The heat sink includes: a base plate; a first heat radiating fin thermally connected to the base plate; and a second heat radiating fin disposed adjacently to a side end portion of the first heat radiating fin, and thermally connected to the base plate, wherein a surface of the first heat radiating fin is not parallel to a surface of the second heat radiating fin, and at least one of the second heat radiating fins is disposed at a position lower than at least one of the first heat radiating fins in a vertical direction with respect to a front surface of the base plate.Type: ApplicationFiled: October 22, 2019Publication date: February 13, 2020Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Kuang Yu CHU, Masaaki YAMAMOTO, Hung Wei TSENG, Masahiro MEGURO, Masato WATANABE
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Publication number: 20190323779Abstract: A heat sink includes a base plate thermally connectable to a heat generating element and having a flat plate shape, a first heat radiating fin thermally connected to the base plate, and a second heat radiating fin disposed adjacently to a side end portion of the first heat radiating fin and thermally connected to the base plate. A surface of the first heat radiating fin is not parallel to a surface of the second heat radiating fin.Type: ApplicationFiled: July 2, 2019Publication date: October 24, 2019Applicant: Furukawa Automotive Systems Inc.Inventors: Kenya Kawabata, Masahiro Meguro, Kuang Yu Chu, Hung Wei Tseng
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Publication number: 20180283797Abstract: Provided is a heat sink having excellent heat dissipation efficiency by having excellent thermal diffusion characteristics in a planar direction of a heat receiving plate. The heat sink has the heat receiving plate that is thermally connected to a heating element, heat pipes that are thermally connected to the heat receiving plate and are formed from a tube body, and heat dissipation fins that are thermally connected to the heat receiving plate, wherein the heat pipes are provided in a plurality of layers in a vertical direction to a surface of the heat receiving plate, and in at least two layers of the plurality of layers, positions of the heat pipes on the surface of the heat receiving plate are not identical to each other.Type: ApplicationFiled: October 4, 2016Publication date: October 4, 2018Applicant: Furukawa Electric Co., Ltd.Inventors: Yasuyuki Tochigi, Hung Wei Tseng, Kuang Yu Chu, Masahiro Meguro, Kenya Kawabata
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Publication number: 20180128552Abstract: A cooling device includes first heat pipes thermally connected to a first heat-generating element at one end and thermally connected to the superimposed first and second heat-radiating fin groups at another end; and second heat pipes thermally connected to a second heat-generating element at one end and thermally connected to the superimposed second and third heat-radiating fin groups at another end, wherein the respective another ends of the first heat pipes altogether span a substantially entirety of a planar area between the first and second heat-radiating fin groups, and the respective another ends of the second heat pipes altogether span a substantially entirety of a planar area between the second and third heat-radiating fin groups.Type: ApplicationFiled: January 10, 2018Publication date: May 10, 2018Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Shinichi ITO, Masahiro MEGURO, Kenya KAWABATA