Abstract: A copper clad laminate having a bonded side ensuring powerful adhesion between the copper foil and insulating layer, without providing protrusions on the copper foil or making roughing treatment or black treatment, by designing such a configuration that the copper foil has a metal layer on the side to be bonded with the insulating layer and the metal layer and insulating layer are cross-linked with each other by chemical bonds through sulfur atoms. Further, there is provided a multilayer printed circuit board which has a bonded side ensuring a powerful adhesion of the circuit copper foil and insulating layer, by designing such a configuration that the alternating metal layers and insulating layers are cross-linked with each other by chemical bonds through sulfur atoms.

Abstract: An article of manufacture in form of a multilayer material includes(a) a conductive layer made of an electrically highly conductive material,(b) a resistance layer formed on the conductive layer, the resistance layer being made of an electrical resistance material,(c) a chromate treatment layer formed on the resistance layer, the chromate treatment layer being formed on the resistance layer by subjecting the surface of the resistance layer to a chromate treatment and containing chromium in an amount of 5 to 120 .mu.g per 1 dm.sup.2 of the chromate treatment layer and,(d) a silane coupling agent layer formed on the chromate treatment layer, the silane coupling agent layer being formed by applying a solution of a silane coupling agent to the surface of the chromate layer followed by drying. The concentration of the silane coupling agent in the solution is 0.001 to 5% by weight.