Patents by Inventor Masahiro Miyasaka

Masahiro Miyasaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10104781
    Abstract: A photosensitive resin composition includes a binder polymer, a photopolymerizable compound, and a photopolymerization initiator. The binder polymer has a structural unit derived from a (meth)acrylic acid, a structural unit derived from styrene or ?-methylstyrene, and a structural unit derived from a hydroxyalkyl (meth)acrylate ester having a hydroxyalkyl group having from 1 to 12 carbon atoms. The photopolymerizable compound include a bisphenolic di(meth)acrylate having from 1 to 20 structural units of an ethyleneoxy group and having from 0 to 7 structural units of a propyleneoxy group.
    Type: Grant
    Filed: December 22, 2014
    Date of Patent: October 16, 2018
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Shota Okade, Masahiro Miyasaka, Yukiko Muramatsu
  • Publication number: 20160330845
    Abstract: A photosensitive resin composition includes a binder polymer, a photopolymerizable compound, and a photopolymerization initiator. The binder polymer has a structural unit derived from a (meth)acrylic acid, a structural unit derived from styrene or ?-methylstyrene, and a structural unit derived from a hydroxyalkyl (meth)acrylate ester having a hydroxyalkyl group having from 1 to 12 carbon atoms. The photopolymerizable compound include a bisphenolic di(meth)acrylate having from 1 to 20 structural units of an ethyleneoxy group and having from 0 to 7 structural units of a propyleneoxy group.
    Type: Application
    Filed: December 22, 2014
    Publication date: November 10, 2016
    Inventors: Shota OKADE, Masahiro MIYASAKA, Yukiko MURAMATSU
  • Publication number: 20150293443
    Abstract: The invention provides a photosensitive resin that includes: a binder polymer that has a structural unit derived from (meth)acrylic acid, a structural unit derived from styrene or ?-methyl styrene, and a structural unit derived from benzyl (meth)acrylate; a photopolymerizable compound including a first bisphenol di(meth)acrylate that has an ethyleneoxy group and a propyleneoxy group, in which a number of structural units of the ethyleneoxy group is from 1 to 20 and a number of structural units of the propyleneoxy group is from 2 to 7, and in which a total number of structural units of the ethyleneoxy group and the propyleneoxy group is more than 10; and a photopolymerization initiator.
    Type: Application
    Filed: November 14, 2013
    Publication date: October 15, 2015
    Applicant: Hitachi Chemical Company, Ltd.
    Inventors: Shota Okade, Masahiro Miyasaka, Yukiko Muramatsu
  • Patent number: 8592130
    Abstract: A photosensitive resin composition comprising: (A) a binder polymer having a divalent group represented by formula (I), (II) and (III); (B) a photopolymerizing compound; and (C) a photopolymerization initiator. [In formulas (I), (II) and (III), R1, R2, R4 each independently represents a hydrogen atom or a methyl group, R3 is C1-C3 alkyl group, etc., m is an integer of 0-5, R5, R6 and R7 each independently represents a hydrogen atom or a C1-C5 alkyl group, and at least two among R5, R6 and R7 are C1-C5 alkyl groups.
    Type: Grant
    Filed: May 22, 2009
    Date of Patent: November 26, 2013
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Masahiro Miyasaka, Yukiko Muramatsu
  • Patent number: 8586284
    Abstract: The invention provides a photosensitive resin composition comprising (A) 100 parts by weight of a binder polymer having 10-65 parts by weight of a divalent group obtained from a specific styrene compound and its derivative, 5-55 parts by weight of a divalent group obtained from a specific (meth)acrylic acid ester and its derivative and 15-50 parts by weight of a divalent group obtained from (meth)acrylic acid, (B) a photopolymerizing compound and (C) a photopolymerization initiator.
    Type: Grant
    Filed: June 10, 2008
    Date of Patent: November 19, 2013
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Hanako Nankawa, Masahiro Miyasaka, Yukiko Muramatsu
  • Publication number: 20130298398
    Abstract: The invention relates to a photosensitive resin composition comprising a binder polymer having a (meth)acrylic acid-based structural unit, with a dispersity (weight-average molecular weight/number-average molecular weight) of no greater than 1.6, a photopolymerizable compound, a photopolymerization initiator and a sensitizing dye.
    Type: Application
    Filed: November 15, 2011
    Publication date: November 14, 2013
    Inventors: Masahiro Miyasaka, Masaki Endou, Masataka Kushida, Yukiko Muramatsu, Makoto Kaji
  • Patent number: 8501392
    Abstract: A photosensitive element comprises a support, a photosensitive layer and a protective film laminated in that order, wherein the photosensitive layer is composed of a photosensitive resin composition containing a binder polymer, a photopolymerizing compound, a photopolymerization initiator and a compound with a maximum absorption wavelength of 370-420 nm, and the protective film is composed mainly of polypropylene.
    Type: Grant
    Filed: April 13, 2007
    Date of Patent: August 6, 2013
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Manabu Saitou, Junichi Iso, Tatsuya Ichikawa, Takeshi Ohashi, Hanako Yori, Masahiro Miyasaka, Takashi Kumaki
  • Patent number: 8198008
    Abstract: A photosensitive resin composition comprising: (A) a binder polymer; (B) a photopolymerizable compound that has an ethylenically unsaturated bond; and (C1) a compound represented by general formula (1) below, wherein, at least one R represents a C1-10 alkoxy group or a C1-12 alkyl group; the sum of a, b, and c is 1 to 6; and when the sum of a, b, and c is 2 to 6, each R may be the same as or different from one another.
    Type: Grant
    Filed: July 16, 2010
    Date of Patent: June 12, 2012
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Masahiro Miyasaka, Takashi Kumaki
  • Patent number: 8192916
    Abstract: A photosensitive resin composition comprising: (A) a binder polymer; (B) a photopolymerizable compound that has an ethylenically unsaturated bond; and (C1) a compound represented by general formula (1) below, wherein, at least one R represents a C1-10 alkoxy group or a C1-12 alkyl group; the sum of a, b, and c is 1 to 6; and when the sum of a, b, and c is 2 to 6, each R may be the same as or different from one another.
    Type: Grant
    Filed: July 16, 2010
    Date of Patent: June 5, 2012
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Masahiro Miyasaka, Takashi Kumaki
  • Patent number: 8105759
    Abstract: A photosensitive resin composition comprising (A) a binder polymer, (B) a photopolymerizing compound with a polymerizable ethylenic unsaturated bond, (C) a photoradical polymerization initiator containing a 2,4,5-triarylimidazole dimer or its derivative, and (D) a compound represented by the following general formula (1) (wherein R1 and R2 each independently represent C1-20 alkyl, etc., and R3, R4, R5, R6, R7, R8, R9 and R10 each independently represent hydrogen, etc.).
    Type: Grant
    Filed: January 3, 2006
    Date of Patent: January 31, 2012
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Masahiro Miyasaka, Takashi Kumaki
  • Patent number: 7993809
    Abstract: A photosensitive resin composition comprising: (A) a binder polymer; (B) a photopolymerizable compound that has an ethylenically unsaturated bond; and (C1) a compound represented by general formula (1) below, wherein, at least one R represents a C1-10 alkoxy group or a C1-12 alkyl group; the sum of a, b, and c is 1 to 6; and when the sum of a, b, and c is 2 to 6, each R may be the same as or different from one another.
    Type: Grant
    Filed: May 22, 2006
    Date of Patent: August 9, 2011
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Masahiro Miyasaka, Takashi Kumaki
  • Publication number: 20110159430
    Abstract: A photosensitive resin composition comprising: (A) a binder polymer having a divalent group represented by formula (I), (II) and (III); (B) a photopolymerizing compound; and (C) a photopolymerization initiator. [In formulas (I), (II) and (III), R1, R2, R4 each independently represents a hydrogen atom or a methyl group, R3 is C1-C3 alkyl group, etc., m is an integer of 0-5, R5, R6 and R7 each independently represents a hydrogen atom or a C1-C5 alkyl group, and at least two among R5, R6 and R7 are C1-C5 alkyl groups.
    Type: Application
    Filed: May 22, 2009
    Publication date: June 30, 2011
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Masahiro Miyasaka, Yukiko Muramatsu
  • Publication number: 20110086309
    Abstract: The invention provides a photosensitive resin composition comprising (A) 100 parts by weight of a binder polymer having 10-65 parts by weight of a divalent group obtained from a specific styrene compound and its derivative, 5-55 parts by weight of a divalent group obtained from a specific (meth)acrylic acid ester and its derivative and 15-50 parts by weight of a divalent group obtained from (meth)acrylic acid, (B) a photopolymerizing compound and (C) a photopolymerization initiator.
    Type: Application
    Filed: June 10, 2008
    Publication date: April 14, 2011
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Hanako Nankawa, Masahiro Miyasaka, Yukiko Muramatsu
  • Publication number: 20100285408
    Abstract: A photosensitive resin composition comprising: (A) a binder polymer; (B) a photopolymerizable compound that has an ethylenically unsaturated bond; and (C1) a compound represented by general formula (1) below, wherein, at least one R represents a C1-10 alkoxy group or a C1-12 alkyl group; the sum of a, b, and c is 1 to 6; and when the sum of a, b, and c is 2 to 6, each R may be the same as or different from one another.
    Type: Application
    Filed: July 16, 2010
    Publication date: November 11, 2010
    Inventors: Masahiro MIYASAKA, Takashi Kumaki
  • Publication number: 20100279229
    Abstract: A photosensitive resin composition comprising: (A) a binder polymer; (B) a photopolymerizable compound that has an ethylenically unsaturated bond; and (C1) a compound represented by general formula (1) below, wherein, at least one R represents a C1-10 alkoxy group or a C1-12 alkyl group; the sum of a, b, and c is 1 to 6; and when the sum of a, b, and c is 2 to 6, each R may be the same as or different from one another.
    Type: Application
    Filed: July 16, 2010
    Publication date: November 4, 2010
    Inventors: Masahiro MIYASAKA, Takashi Kumaki
  • Publication number: 20100233627
    Abstract: A photosensitive resin composition comprising (A) a binder polymer with a weight-average molecular weight of 35000 to 65000, (B) a photopolymerizable compound with an ethylenically unsaturated bond and (C) a photopolymerization initiator, wherein component (B) includes (B1) a photopolymerizable compound with one ethylenically unsaturated bond, (B2) a photopolymerizable compound with two ethylenically unsaturated bonds and (B3) a photopolymerizable compound with three ethylenically unsaturated bonds, and the proportion of component (B3) with respect to the total of component (B) is 15 to 30 wt %.
    Type: Application
    Filed: February 20, 2007
    Publication date: September 16, 2010
    Applicant: Hitachi Chemical Co., Ltd.
    Inventors: Takashi Kumaki, Masahiro Miyasaka
  • Patent number: 7736834
    Abstract: The photosensitive resin composition of the invention comprises (A) a photopolymerizing compound with two or more ethylenic unsaturated bonds in the molecule and (B) a photopolymerization initiator which initiates photopolymerization reaction of the (A) photopolymerizing compound, the photosensitive resin composition being characterized in that the molecule of the (A) photopolymerizing compound further contains a characteristic group with a bond which breaks when the (A) photopolymerizing compound is heated under temperature conditions of 130-250° C.
    Type: Grant
    Filed: August 25, 2004
    Date of Patent: June 15, 2010
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Masahiro Miyasaka, Toshiki Ito
  • Publication number: 20090297982
    Abstract: A photosensitive element comprises a support, a photosensitive layer and a protective film laminated in that order, wherein the photosensitive layer is composed of a photosensitive resin composition containing a binder polymer, a photopolymerizing compound, a photopolymerization initiator and a compound with a maximum absorption wavelength of 370-420 nm, and the protective film is composed mainly of polypropylene.
    Type: Application
    Filed: April 13, 2007
    Publication date: December 3, 2009
    Inventors: Manabu Saitou, Junichi Iso, Tatsuya Ichikawa, Takeshi Ohashi, Hanako Yori, Masahiro Miyasaka, Takashi Kumaki
  • Patent number: 7622243
    Abstract: The present invention is a photosensitive element including a support and a photosensitive resin composition layer composed of a photosensitive resin composition containing (A) a binder polymer, (B) a photopolymerizable compound, and (C) a photopolymerization initiator, wherein, the photosensitive resin composition contains a thioxanthone-based compound represented by the following general formula (I) as the component (C), and when the parts by weight of the thioxanthone-based compound relative to 100 parts by weight for the total weight of the component (A) and the component (B) is taken to be P, and the film thickness of the photosensitive resin composition layer is taken to be Q (?m), then R, which is the product of P and Q, satisfies the condition of the following formula (1). In the following general formula (I), R1to R8 represent a hydrogen atom, halogen atom or hydrocarbon group. 25.5?R?79.
    Type: Grant
    Filed: September 17, 2004
    Date of Patent: November 24, 2009
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Takashi Kumaki, Masahiro Miyasaka, Yasuhisa Ichihashi, Toshiki Ito, Makoto Kaji
  • Publication number: 20090202944
    Abstract: A photosensitive resin composition comprising (A) a binder polymer, (B) a photopolymerizing compound with a polymerizable ethylenic unsaturated bond, (C) a photoradical polymerization initiator containing a 2,4,5-triarylimidazole dimer or its derivative, and (D) a compound represented by the following general formula (1) (wherein R1 and R2 each independently represent C1-20 alkyl, etc., and R3, R4, R5, R6, R7, R8, R9 and R10 each independently represent hydrogen, etc.).
    Type: Application
    Filed: January 3, 2006
    Publication date: August 13, 2009
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Masahiro Miyasaka, Takashi Kumaki