Patents by Inventor Masahiro Miyo

Masahiro Miyo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Liquid-cooled electronic apparatus
    Patent number: 6621707
    Abstract: An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.
    Type: Grant
    Filed: October 2, 2001
    Date of Patent: September 16, 2003
    Assignee: Fujitsu Limited
    Inventors: Junichi Ishimine, Masahiro Suzuki, Masahiro Miyo, Akihiko Fujisaki, Keizo Takemura, Jie Wei, Hisashi Kawashima, Yoshiaki Udagawa, Haruhiko Yamamoto, Masahiro Mochizuki
  • Liquid-cooled electronic apparatus
    Patent number: 6404640
    Abstract: An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.
    Type: Grant
    Filed: January 22, 1999
    Date of Patent: June 11, 2002
    Assignee: Fujitsu Limited
    Inventors: Junichi Ishimine, Masahiro Suzuki, Masahiro Miyo, Akihiko Fujisaki, Keizo Takemura, Jie Wie, Hisashi Kawashima, Yoshiaki Udagawa, Haruhiko Yamamoto, Masahiro Mochizuki
  • Liquid-cooled electronic apparatus
    Publication number: 20020021557
    Abstract: An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.
    Type: Application
    Filed: October 2, 2001
    Publication date: February 21, 2002
    Applicant: Fujitsu Limited,
    Inventors: Junichi Ishimine, Masahiro Suzuki, Akira Tamura, Masahiro Miyo, Akihiko Fujisaki, Keizo Takemura, Jie Wei, Hisashi Kawashima, Yoshiaki Udagawa, Haruhiko Yamamoto, Masahiro Mochizuki
  • Semiconductor element cooling apparatus
    Patent number: 5763950
    Abstract: A semiconductor element cooling apparatus adapted to cool at least one semiconductor element mounted on a circuit substrate. The semiconductor element cooling apparatus includes a first mechanism for generating a coolant flow by flowing a coolant over a top surface of the semiconductor element, and a second mechanism for obliquely obstructing the coolant flowing over the semiconductor element from an upstream side towards a downstream side of the coolant flow.
    Type: Grant
    Filed: February 8, 1996
    Date of Patent: June 9, 1998
    Assignee: Fujitsu Limited
    Inventors: Akihiko Fujisaki, Junichi Ishimine, Masumi Suzuki, Masahiro Miyo, Shunichi Kikuchi, Minoru Hirano, Hitoshi Nori