Patents by Inventor Masahiro Moriguchi
Masahiro Moriguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240132755Abstract: To provide a hot melt adhesive having excellent coatability, adhesiveness and creep resistance, being able to bond and retain an elastic material to a material containing biodegradable plastics, and a disposable product comprising the hot melt adhesive. A hot melt adhesive comprising (A) a thermoplastic block copolymer which is a copolymer of vinyl aromatic hydrocarbons and conjugated diene compounds, and (B) a tackifying resin, wherein (A) the thermoplastic block copolymer comprises: (A1) a styrene block copolymer having a styrene content of 35 to 50% by mass; and (A2) a styrene block copolymer having a styrene content of more than 10% by mass and less than 35% by mass; (B) the tackifying resin comprises: (B1) a natural resin; and the component (B1) being contained in an amount of 20 parts by mass or more based on 100 parts by mass of the component (B).Type: ApplicationFiled: December 7, 2023Publication date: April 25, 2024Inventor: MASAHIRO MORIGUCHI
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Publication number: 20240124748Abstract: To provide a hot melt adhesive having excellent coatability, adhesiveness and creep resistance, being able to bond and retain an elastic material to a material containing biodegradable plastics, and a disposable product comprising the hot melt adhesive. A hot melt adhesive comprising (A) a thermoplastic block copolymer which is a copolymer of vinyl aromatic hydrocarbons and conjugated diene compounds, and (B) a tackifying resin, wherein (A) the thermoplastic block copolymer comprises: (A1) a linear type styrene block copolymer having a styrene content of 35 to 50% by mass; and (A2) a styrene block copolymer having a styrene content of more than 10% by mass and less than 35% by mass; (B) the tackifying resin comprises: (B1) a natural resin having a biomass degree of 50% or more.Type: ApplicationFiled: December 7, 2023Publication date: April 18, 2024Inventor: MASAHIRO MORIGUCHI
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Patent number: 10808151Abstract: Problem to be solved of the present invention is to provide a hot-melt adhesive agent which is capable of applying at low temperature, excellent in adhesiveness at the wide temperature ranges (10 to 40° C.), and excellent in balance between tackiness and retention force, and a disposable product obtained by employing the hot-melt adhesive agent. Means for Solving the problem is a hot-melt adhesive agent comprising a thermoplastic block copolymer (A) which is a copolymer of vinyl class aromatic hydrocarbons and conjugated diene compounds, wherein the thermoplastic block copolymer (A) comprises the following component (A1) and component (A2): (A1) a radial type styrene block copolymer having a styrene content of 35 to 45% by weight, a diblock content of 50 to 90% by weight, and has a viscosity at 25° C. as 25% toluene solution of not more than 250 mPa·s; and (A2) a triblock type styrene block copolymer.Type: GrantFiled: June 12, 2018Date of Patent: October 20, 2020Assignee: HENKEL AG & CO. KGAAInventors: Masahiro Moriguchi, Naohiro Maeda
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Patent number: 10793754Abstract: Disclosed is a hot melt adhesive comprising: (A) a thermoplastic block copolymer which is a block copolymer of a vinyl-based aromatic hydrocarbon and a conjugated diene compound; and (B) an amorphous wax modified with a carboxylic acid and/or a carboxylic anhydride. The hot melt adhesive is excellent in applicability at a low temperature near from about 140° C. to about 150° C. and excellent in creep resistance in a wet state, can reduce odor, is excellent in initial adhesive force, and is excellent in adhesive property (peel strength) to an olefin substrate. This hot melt adhesive can be used suitably so as to produce a disposable product.Type: GrantFiled: August 14, 2017Date of Patent: October 6, 2020Assignee: HENKEL AG & CO. KGAAInventor: Masahiro Moriguchi
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Patent number: 10513642Abstract: Problem to be solved of the present invention is to provide a hot-melt adhesive agent which is capable of applying at low temperature, has an excellent adhesiveness at low temperature, and a disposable product obtained by employing the hot-melt adhesive agent. Means for solving the problem is a hot-melt adhesive agent comprised of a thermoplastic block copolymer (A) which is a copolymer of vinyl class aromatic hydrocarbons and conjugated diene compounds, wherein the thermoplastic block copolymer (A) comprises a radial type styrene block copolymer having a styrene content of 35 to 45% by weight and a diblock content of 50 to 90% by weight, and having a viscosity at 25° C. as a 25% (by weight) toluene solution of not more than 250 mPa·s (A1).Type: GrantFiled: October 23, 2018Date of Patent: December 24, 2019Assignee: HENKEL AG & CO. KGAAInventors: Kentarou Inoue, Masahiro Moriguchi, Naohiro Maeda
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Patent number: 10370567Abstract: The present invention provides a hot melt adhesive for high-speed coating and spiral coating at low temperature. The hot melt adhesive has excellent adhesion to polyethylene and nonwoven fabric, and is suitable for disposable products. The hot melt adhesive comprises: (A) a propylene homopolymer having a melting point of 100° C. or lower which is obtainable by polymerizing propylene using a metallocene catalyst; and (B) an ethylene-based copolymer.Type: GrantFiled: May 31, 2017Date of Patent: August 6, 2019Assignee: HENKEL AG & CO. KGAAInventors: Masahiro Moriguchi, Shigekazu Saito
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Patent number: 10233366Abstract: The present invention provides a hot-melt adhesive agent which is capable of applying at low temperature, and has an excellent adhesiveness to a polyolefin substrate, and a disposable product obtained by employing the hot-melt adhesive agent. A hot-melt adhesive agent comprising a thermoplastic block copolymer (A) which is a copolymer of vinyl class aromatic hydrocarbons and conjugated diene compounds, wherein the thermoplastic block copolymer (A) comprises the following component (A1) and component (A2): (A1) a radial type styrene block copolymer having a styrene content of 35 to 45% by weight and a diblock content of 50 to 90% by weight, and having a viscosity at 25° C. as a 25% (by weight) toluene solution of not more than 250 mPa·s; and (A2) a styrene block copolymer having a styrene content of less than 30% by weight, and having a viscosity at 25° C. as a 25% (by weight) toluene solution of more than 250 mPa·s.Type: GrantFiled: October 23, 2015Date of Patent: March 19, 2019Assignee: HENKEL AG & CO. KGAAInventors: Kentarou Inoue, Masahiro Moriguchi
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Publication number: 20190055438Abstract: Problem to be solved of the present invention is to provide a hot-melt adhesive agent which is capable of applying at low temperature, has an excellent adhesiveness at low temperature, and a disposable product obtained by employing the hot-melt adhesive agent. Means for solving the problem is a hot-melt adhesive agent comprised of a thermoplastic block copolymer (A) which is a copolymer of vinyl class aromatic hydrocarbons and conjugated diene compounds, wherein the thermoplastic block copolymer (A) comprises a radial type styrene block copolymer having a styrene content of 35 to 45% by weight and a diblock content of 50 to 90% by weight, and having a viscosity at 25° C. as a 25% (by weight) toluene solution of not more than 250 mPa·s (A1).Type: ApplicationFiled: October 23, 2018Publication date: February 21, 2019Inventors: Kentarou INOUE, Masahiro MORIGUCHI, Naohiro MAEDA
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Patent number: 10138400Abstract: Problem to be solved of the present invention is to provide a hot-melt adhesive agent which is capable of applying at low temperature, has an excellent adhesiveness at low temperature, and a disposable product obtained by employing the hot-melt adhesive agent. Means for solving the problem is a hot-melt adhesive agent comprised of a thermoplastic block copolymer (A) which is a copolymer of vinyl class aromatic hydrocarbons and conjugated diene compounds, wherein the thermoplastic block copolymer (A) comprises a radial type styrene block copolymer having a styrene content of 35 to 45% by weight and a diblock content of 50 to 90% by weight, and having a viscosity at 25° C. as a 25% (by weight) toluene solution of not more than 250 mPa·s (A1).Type: GrantFiled: May 18, 2017Date of Patent: November 27, 2018Assignee: Henkel AG & Co., KGaAInventors: Kentarou Inoue, Masahiro Moriguchi, Naohiro Maeda
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Publication number: 20180291241Abstract: Problem to be solved of the present invention is to provide a hot-melt adhesive agent which is capable of applying at low temperature, excellent in adhesiveness at the wide temperature ranges (10 to 40° C.), and excellent in balance between tackiness and retention force, and a disposable product obtained by employing the hot-melt adhesive agent. Means for Solving the problem is a hot-melt adhesive agent comprising a thermoplastic block copolymer (A) which is a copolymer of vinyl class aromatic hydrocarbons and conjugated diene compounds, wherein the thermoplastic block copolymer (A) comprises the following component (A1) and component (A2): (A1) a radial type styrene block copolymer having a styrene content of 35 to 45% by weight, a diblock content of 50 to 90% by weight, and has a viscosity at 25° C. as 25% toluene solution of not more than 250 mPa·s; and (A2) a triblock type styrene block copolymer.Type: ApplicationFiled: June 12, 2018Publication date: October 11, 2018Inventors: Masahiro MORIGUCHI, Naohiro MAEDA
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Patent number: 10017672Abstract: Problem to be solved of the present invention is to provide a hot-melt adhesive agent which is capable of applying at low temperature, excellent in adhesiveness at the wide temperature ranges (10 to 40° C.), and excellent in balance between tackiness and retention force, and a disposable product obtained by employing the hot-melt adhesive agent. Means for Solving the problem is a hot-melt adhesive agent comprising a thermoplastic block copolymer (A) which is a copolymer of vinyl class aromatic hydrocarbons and conjugated diene compounds, wherein the thermoplastic block copolymer (A) comprises the following component (A1) and component (A2): (A1) a radial type styrene block copolymer having a styrene content of 35 to 45% by weight, a diblock content of 50 to 90% by weight, and has a viscosity at 25° C. as 25% toluene solution of not more than 250 mPa·s; and (A2) a triblock type styrene block copolymer.Type: GrantFiled: November 18, 2015Date of Patent: July 10, 2018Assignee: HENKEL AG & CO. KGAAInventors: Masahiro Moriguchi, Naohiro Maeda
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Publication number: 20180016478Abstract: Disclosed is a hot melt adhesive comprising: (A) a thermoplastic block copolymer which is a block copolymer of a vinyl-based aromatic hydrocarbon and a conjugated diene compound; and (B) an amorphous wax modified with a carboxylic acid and/or a carboxylic anhydride. The hot melt adhesive is excellent in applicability at a low temperature near from about 140° C. to about 150° C. and excellent in creep resistance in a wet state, can reduce odor, is excellent in initial adhesive force, and is excellent in adhesive property (peel strength) to an olefin substrate. This hot melt adhesive can be used suitably so as to produce a disposable product.Type: ApplicationFiled: August 14, 2017Publication date: January 18, 2018Inventor: Masahiro MORIGUCHI
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Patent number: 9816014Abstract: The present invention provides a hot melt adhesive suitable for use in disposable products, which can be applied at a high speed and provides excellent in adhesion in a wet state and low-temperature coating, with little odor. The hot melt adhesive for disposable products comprises: (A) a propylene homopolymer having a melting point of 100° C. or lower obtained by polymerizing propylene using a metallocene catalyst; and (B) a wax modified with carboxylic acid and/or carboxylic acid anhydride. The wet adhesion of the hot melt adhesive is improved when the wax is modified with maleic acid and/or maleic anhydride.Type: GrantFiled: March 14, 2014Date of Patent: November 14, 2017Assignee: HENKEL AG & CO. KGAAInventors: Masahiro Moriguchi, Shigekazu Saito, Kentarou Inoue, Takanori Okuda, Naohiro Maeda
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Patent number: 9765245Abstract: Problem to be solved of the present invention is to provide a hot-melt adhesive agent which is capable of applying at low temperature, has an excellent adhesiveness at low temperature, and a disposable product obtained by employing the hot-melt adhesive agent. Means for solving the problem is a hot-melt adhesive agent comprised of a thermoplastic block copolymer (A) which is a copolymer of vinyl class aromatic hydrocarbons and conjugated diene compounds, wherein the thermoplastic block copolymer (A) comprises a radial type styrene block copolymer having a styrene content of 35 to 45% by weight and a diblock content of 50 to 90% by weight, and having a viscosity at 25° C. as a 25% (by weight) toluene solution of not more than 250 mPa·s (A1).Type: GrantFiled: September 25, 2015Date of Patent: September 19, 2017Assignee: HENKEL AG & CO. KGAAInventors: Kentarou Inoue, Masahiro Moriguchi, Naohiro Maeda
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Publication number: 20170260430Abstract: The present invention provides a hot melt adhesive for high-speed coating and spiral coating at low temperature. The hot melt adhesive has excellent adhesion to polyethylene and nonwoven fabric, and is suitable for disposable products. The hot melt adhesive comprises: (A) a propylene homopolymer having a melting point of 100° C. or lower which is obtainable by polymerizing propylene using a metallocene catalyst; and (B) an ethylene-based copolymer.Type: ApplicationFiled: May 31, 2017Publication date: September 14, 2017Inventors: Masahiro MORIGUCHI, Shigekazu SAITO
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Publication number: 20170253778Abstract: Problem to be solved of the present invention is to provide a hot-melt adhesive agent which is capable of applying at low temperature, has an excellent adhesiveness at low temperature, and a disposable product obtained by employing the hot-melt adhesive agent. Means for solving the problem is a hot-melt adhesive agent comprised of a thermoplastic block copolymer (A) which is a copolymer of vinyl class aromatic hydrocarbons and conjugated diene compounds, wherein the thermoplastic block copolymer (A) comprises a radial type styrene block copolymer having a styrene content of 35 to 45% by weight and a diblock content of 50 to 90% by weight, and having a viscosity at 25° C. as a 25% (by weight) toluene solution of not more than 250 mPa·s (A1).Type: ApplicationFiled: May 18, 2017Publication date: September 7, 2017Inventors: Kentarou INOUE, Masahiro MORIGUCHI, Naohiro MAEDA
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Patent number: 9695340Abstract: The present invention provides a hot melt adhesive for high-speed coating and spiral coating at low temperature. The hot melt adhesive has excellent adhesion to polyethylene and nonwoven fabric, and is suitable for disposable products. The hot melt adhesive comprises: (A) a propylene homopolymer having a melting point of 100° C. or lower which is obtainable by polymerizing propylene using a metallocene catalyst; and (B) an ethylene-based copolymer.Type: GrantFiled: March 14, 2014Date of Patent: July 4, 2017Assignee: HENKEL AG & CO. KGAAInventors: Masahiro Moriguchi, Shigekazu Saito
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Publication number: 20160068723Abstract: Problem to be solved of the present invention is to provide a hot-melt adhesive agent which is capable of applying at low temperature, excellent in adhesiveness at the wide temperature ranges (10 to 40° C.), and excellent in balance between tackiness and retention force, and a disposable product obtained by employing the hot-melt adhesive agent. Means for Solving the problem is a hot-melt adhesive agent comprising a thermoplastic block copolymer (A) which is a copolymer of vinyl class aromatic hydrocarbons and conjugated diene compounds, wherein the thermoplastic block copolymer (A) comprises the following component (A1) and component (A2): (A1) a radial type styrene block copolymer having a styrene content of 35 to 45% by weight, a diblock content of 50 to 90% by weight, and has a viscosity at 25° C. as 25% toluene solution of not more than 250 mPa·s; and (A2) a triblock type styrene block copolymer.Type: ApplicationFiled: November 18, 2015Publication date: March 10, 2016Inventors: Masahiro MORIGUCHI, Naohiro MAEDA
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Publication number: 20160040047Abstract: The present invention provides a hot-melt adhesive agent which is capable of applying at low temperature, and has an excellent adhesiveness to a polyolefin substrate, and a disposable product obtained by employing the hot-melt adhesive agent. A hot-melt adhesive agent comprising a thermoplastic block copolymer (A) which is a copolymer of vinyl class aromatic hydrocarbons and conjugated diene compounds, wherein the thermoplastic block copolymer (A) comprises the following component (A1) and component (A2): (A1) a radial type styrene block copolymer having a styrene content of 35 to 45% by weight and a diblock content of 50 to 90% by weight, and having a viscosity at 25° C. as a 25% (by weight) toluene solution of not more than 250 mPa·s; and (A2) a styrene block copolymer having a styrene content of less than 30% by weight, and having a viscosity at 25° C. as a 25% (by weight) toluene solution of more than 250 mPa·s.Type: ApplicationFiled: October 23, 2015Publication date: February 11, 2016Inventors: Kentarou INOUE, Masahiro MORIGUCHI
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Publication number: 20160009966Abstract: Problem to be solved of the present invention is to provide a hot-melt adhesive agent which is capable of applying at low temperature, has an excellent adhesiveness at low temperature, and a disposable product obtained by employing the hot-melt adhesive agent. Means for solving the problem is a hot-melt adhesive agent comprised of a thermoplastic block copolymer (A) which is a copolymer of vinyl class aromatic hydrocarbons and conjugated diene compounds, wherein the thermoplastic block copolymer (A) comprises a radial type styrene block copolymer having a styrene content of 35 to 45% by weight and a diblock content of 50 to 90% by weight, and having a viscosity at 25° C. as a 25% (by weight) toluene solution of not more than 250 mPa·s (A1).Type: ApplicationFiled: September 25, 2015Publication date: January 14, 2016Inventors: Kentarou INOUE, Masahiro MORIGUCHI, Naohiro MAEDA