Abstract: In a heat exchanger, fins are simply and accurately positioned in place and heat is efficiently exchanged without increasing manufacture cost, and the plurality of corrugated plate-like fins are disposed in the flow direction of a coolant in a housing. The heat exchanger has: connecting parts, which connect together the adjacent fins among the fins; protrusions formed on the connecting parts; and positioning holes for positioning the fins formed in the housing. The adjacent fins are disposed at predetermined intervals in the coolant flow direction with a predetermined offset amount in the direction that orthogonally intersects the coolant flow direction by fitting the protrusions in the positioning holes.

Abstract: A semiconductor device and a method of producing the same, wherein a joining member and a joined member are bonded by means of brazing in a way such that no voids are left inside the joining layer. The semiconductor device comprises a joined member and a joining member which is joined to the joined member by means of brazing. The joined member is provided with a through hole which is open on the joining surface with the joining member, and a path communicating with the through hole is provided on at least one of the joining surface of the joining member with the joined member or the joining surface of the member with the joining member.

Abstract: Disclosed is a semiconductor device that can properly relax a stress produced by a difference in coefficient of linear expansion between an insulating substrate and a cooler and can properly remove heat by cooling of a semiconductor element. A semiconductor device comprises an insulating substrate, a semiconductor element provided on the insulating substrate, a cooler, and a porous metal plate provided between the insulating substrate and the cooler. Through holes in the porous metal plate are open at least to that surface of the porous metal plate which faces the cooler. The sectional size of the pores decreases gradually from the cooler side toward the insulating substrate side.

Abstract: A method of manufacturing a heat exchanger. The method involves extrusion-molding a long fin member, which has a plurality of long fins protruding from a flat-plate-shaped long base, and cutting the long fin member by a predetermined width. The base of the fin members are also cut. This results in a heat exchanger having a plurality of fin members (10) including a plurality of fins (11) that is arranged in parallel and protrudes from a flat-plate base (12) so that slit portions are formed on both side ends in a width direction of the base (12), the fin members being arranged so that respective bases abut on each other in a frame.

Abstract: Disclosed is a heat exchanger wherein warping (bending) of an intervening member and a frame is suppressed when the intervening member and a wall portion of the frame member having different linear expansion coefficients are welded with each other. A method for manufacturing the heat exchanger, a semiconductor device wherein warping (bending) of an intervening member and a frame is suppressed, and a method for manufacturing the semiconductor device are also disclosed. Specifically disclosed is a heat exchanger wherein a fin member provided with a plurality of fins forming flow channels for a refrigerant is arranged within a frame which forms the outer casing. The frame has a first frame member (a first wall portion) to which insulating plates (intervening members) interposed between the frame and heat-generating bodies (semiconductor elements are welded. The insulating plates (intervening members) have a linear expansion coefficient different from that of the frame.

Abstract: In a heat exchanger, fins are simply and accurately positioned in place and heat is efficiently exchanged without increasing manufacture cost, and the plurality of corrugated plate-like fins are disposed in the flow direction of a coolant in a housing. The heat exchanger has: connecting parts, which connect together the adjacent fins among the fins; protrusions ormed on the connecting parts; and positioning holes for positioning the fins formed in the housing. The adjacent fins are disposed at predetermined intervals in the coolant flow direction with a predetermined offset amount in the direction that orthogonally intersects the coolant flow direction by fitting the protrusions in the positioning holes.

Abstract: A heat exchanger is provided with a cooling fin including a plurality of fin portions and a base portion supporting the fin portions, and a plurality of pins press-fitted into the fin portions. In the heat exchanger the pins each having a wider width than each space between the fin portions formed in advance in parallel straight shapes are press-fitted into the spaces in a direction from a top end of each fin portion toward the base portion. Accordingly, the fin portions are formed into corrugated shapes by plastic deformation, thereby fixing the pins between the fin portions in positions apart from the base portion. In each space the pins are arranged at intervals in a longitudinal direction of each space. The pins arranged in adjacent spaces are placed with a displacement in alternating pattern.

Abstract: A semiconductor device and a method of producing the same, wherein a joining member and a joined member are bonded by means of brazing in a way such that no voids are left inside the joining layer. The semiconductor device comprises a joined member and a joining member which is joined to the joined member by means of brazing. The joined member is provided with a through hole which is open on the joining surface with the joining member, and a path communicating with the through hole is provided on at least one of the joining surface of the joining member with the joined member or the joining surface of the member with the joining member.

Abstract: A heat exchanger is provided with a cooling fin including a plurality of fin portions and a base portion supporting the fin portions, and a plurality of pins press-fitted into the fin portions. In the heat exchanger, the pins each having a wider width than each space between the fin portions formed in advance in parallel straight shapes are press-fitted into the spaces in a direction from a top end of each fin portion toward the base portion. Accordingly, the fin portions are formed into corrugated shapes by plastic deformation, thereby fixing the pins between the fin portions in positions apart from the base portion. In each space, the pins are arranged at intervals in a longitudinal direction of each space. The pins arranged in adjacent spaces are placed with a displacement in alternating pattern.

Abstract: Disclosed is a semiconductor device that can properly relax a stress produced by a difference in coefficient of linear expansion between an insulating substrate and a cooler and can properly remove heat by cooling of a semiconductor element. A semiconductor device comprises an insulating substrate, a semiconductor element provided on the insulating substrate, a cooler, and a porous metal plate provided between the insulating substrate and the cooler. Through holes in the porous metal plate are open at least to that surface of the porous metal plate which faces the cooler. The sectional size of the pores decreases gradually from the cooler side toward the insulating substrate side.

Abstract: Disclosed is a heat exchanger wherein warping (bending) of an intervening member and a frame is suppressed when the intervening member and a wall portion of the frame member having different linear expansion coefficients are welded with each other. A method for manufacturing the heat exchanger, a semiconductor device wherein warping (bending) of an intervening member and a frame is suppressed, and a method for manufacturing the semiconductor device are also disclosed. Specifically disclosed is a heat exchanger wherein a fin member provided with a plurality of fins forming flow channels for a refrigerant is arranged within a frame which forms the outer casing. The frame has a first frame member (a first wall portion) to which insulating plates (intervening members) interposed between the frame and heat-generating bodies (semiconductor elements) are welded. The insulating plates (intervening members) have a linear expansion coefficient different from that of the frame.

Abstract: Provided are a heat exchanger having a novel structure and efficiently cooling a heat generating body, and a method of manufacturing the heat exchanger. A heat exchanger has flow paths formed by being closed by an upper plate and a lower plate which have rectilinearly formed upstanding fins parallelly arranged at specific intervals, and gaps extend between adjacent fins in the top-bottom direction along the direction in which the fins extend. Either of or both the upper plate and the lower plate are provided with projections arranged in the longitudinal direction of the flow path and projecting inward of the flow path.

Abstract: A method of manufacturing a heat exchanger is disclosed. The heat exchanger comprises a plurality of fin members including a plurality of fins that is arranged in parallel and protrudes from a flat-plate base so that slit portions are formed on both side ends in a width direction of the base, the fin members being arranged so that respective bases abut on each other in a frame. Specifically, the method comprises: an extrusion molding operation of extrusion-molding a long fin member; a fin cutting operation of cutting the long fin member having just been extrusion-molded to cut the long fin member by a predetermined width; and a base cutting operation of cutting a long base in a long-fin cutting region made in the fin cutting operation so that slit portions are formed.

Abstract: A cooling fin includes fin parts integrally extending from a base part. Each fin part is partially formed at a slant so that a proximal end portion is straight and a distal end portion is wavy (corrugated). Each fin part is partially slanted to make each fin part wavier as coming closer to the distal end portion from the proximal end portion. In a manufacturing process of the cooling fin, firstly, a straight cooling fin is produced by extrusion molding (an extruding step). Subsequently, the distal end portion of each fin is partially bent in a direction intersecting an extruding direction into a wave shape (a bending step).