Patents by Inventor Masahiro Moteki

Masahiro Moteki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11608419
    Abstract: A thermally conductive sheet in which a cured layer of a thermally conductive silicone composition is laminated on one or both sides of a synthetic resin film layer of aromatic polyimide, etc. having excellent heat resistance, electrical insulation, and mechanical strength, wherein good thermal conductivity, good insulation, and strong interlayer adhesion are provided because the thermally conductive silicone composition includes 250 to 600 wt. % of an aspherical thermally conductive filler material, which contains no more than 80 ml/100 g of a DOP oil absorption amount and an organic silicon compound component including an adhesion imparting agent, relative to 100 wt. % of the organic silicon compound component, and moreover the thermally conductive sheet with no brittleness during use can be made using continuous molding.
    Type: Grant
    Filed: January 16, 2018
    Date of Patent: March 21, 2023
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Akihiro Endo, Yasuhisa Ishihara, Hisaharu Yamaguchi, Masahiro Moteki
  • Publication number: 20210130561
    Abstract: A thermally conductive sheet in which a cured layer of a thermally conductive silicone composition is laminated on one or both sides of a synthetic resin film layer of aromatic polyimide, etc. having excellent heat resistance, electrical insulation, and mechanical strength, wherein good thermal conductivity, good insulation, and strong interlayer adhesion are provided because the thermally conductive silicone composition includes 250 to 600 wt. % of an aspherical thermally conductive filler material, which contains no more than 80 ml/100 g of a DOP oil absorption amount and an organic silicon compound component including an adhesion imparting agent, relative to 100 wt. % of the organic silicon compound component, and moreover the thermally conductive sheet with no brittleness during use can be made using continuous molding.
    Type: Application
    Filed: January 16, 2018
    Publication date: May 6, 2021
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Akihiro ENDO, Yasuhisa ISHIHARA, Hisaharu YAMAGUCHI, Masahiro MOTEKI
  • Patent number: 10676587
    Abstract: A heat conductive sheet comprising a cured product layer of a heat conductive silicone composition on one or both surfaces of a glass cloth sealed using a cured product of a heat conductive resin composition. The heat conductive silicone composition includes an organic silicon compound component and an aspherical heat conductive filler. The amount of the heat conductive filler is 250 to 600 parts by mass with respect to 100 parts by mass of the organic silicon compound component, and the heat conductive filler has a DOP oil absorption of not more than 80 ml/100 g. The heat conductive sheet can be continuously manufactured by coating molding and wound into a roll even with the use of an inexpensive aspherical heat conductive filler, and has high heat conductivity, low thermal contact resistance, and high insulating properties.
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: June 9, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Akihiro Endo, Yasuhisa Ishihara, Toru Tsuchiya, Hisaharu Yamaguchi, Masahiro Moteki, Takahiro Maruyama
  • Publication number: 20190233612
    Abstract: A heat conductive sheet comprising a cured product layer of a heat conductive silicone composition on one or both surfaces of a glass cloth sealed using a cured product of a heat conductive resin composition. The heat conductive silicone composition includes an organic silicon compound component and an aspherical heat conductive filler. The amount of the heat conductive filler is 250 to 600 parts by mass with respect to 100 parts by mass of the organic silicon compound component, and the heat conductive filler has a DOP oil absorption of not more than 80 ml/100 g. The heat conductive sheet can be continuously manufactured by coating molding and wound into a roll even with the use of an inexpensive aspherical heat conductive filler, and has high heat conductivity, low thermal contact resistance, and high insulating properties.
    Type: Application
    Filed: June 9, 2017
    Publication date: August 1, 2019
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Akihiro ENDO, Yasuhisa ISHIHARA, Toru TSUCHIYA, Hisaharu YAMAGUCHI, Masahiro MOTEKI, Takahiro MARUYAMA