Abstract: This is to provide an aqueous polyurethane resin dispersion which can form a tough coating film. An aqueous polyurethane resin dispersion is obtained by dispersing an aqueous polyurethane resin, which is obtained by reacting (A) a polyurethane prepolymer obtained by reacting (a1) a polycarbonate polyol having no urethane bonding having an average molecular weight of 400 to 5000, and having 2.05 to 5 hydroxyl groups in average in one molecule, (b) a polyol compound having an acidic group and (c) a polyisocyanate, or obtained by reacting (a2) the polycarbonate polyol having no urethane bonding having an average molecular weight of 600 to 5000, and having 2.05 to 5 hydroxyl groups in average in one molecule, and having an acidic group, and (c) a polyisocyanate, and (B) a chain elongating agent having a reactivity with the isocyanate group of (A) the polyurethane prepolymer, being dispersed in an aqueous medium.

Abstract: It is to provide an aqueous polyurethane dispersion which gives a coating film excellent in abrasion resistance. It is an aqueous polyurethane resin dispersion which comprises a polyurethane resin obtained by reacting (A) a polyurethane prepolymer which is obtained by reacting (a) a polyisocyanate compound, (b) a polyol compound containing a polycarbonate polyol having an alicyclic structure, and (c) a polyol compound having an acidic group, and (B) a chain elongating agent having a reactivity with the isocyanate group of (A) the polyurethane prepolymer, being dispersed in an aqueous medium, a content of an alicyclic structure is 26.0 to 60.0% by weight in terms of a solid component(s), and a sum of a content of an urethane boding and a content of a urea bonding is 17.7 to 30.0% by weight in terms of a solid component(s).

Abstract: Disclosed is an aqueous polyurethane resin dispersion which comprises a polyurethane resin which is obtained by reacting (A) a polyurethane prepolymer obtained by reacting (a) a polycarbonate polyol having an alicyclic structure in the main chain, (b) an acidic group-containing polyol compound and (d) a polyisocyanate, and (B) a chain-elongating agent, being dispersed in an aqueous medium, a carboxylic acid group content of the above-mentioned (A) polyurethane prepolymer based on a solid component of (A) the polyurethane prepolymer is 2.0 to 13.0% by weight, and a number of a hydroxyl equivalent of a mixture of the above-mentioned (a) polycarbonate polyol having an alicyclic structure in the main chain, the above-mentioned (b) acidic group-containing polyol compound, and, if necessary, (c) a polyol other than (a) and (b) is 70 to 270.

Abstract: The phosphorus-containing polycarbonate polyol disclosed herein has a structural unit (I) represented by a formula: —OCOO— and a structural unit (II) represented by a residue A, wherein A denotes a n-valent residue in which n of alcoholic hydroxyl groups are removed from a phosphorus compound having at least n of alcoholic hydroxyl groups, in which n is an integer of 2 or larger, and wherein a terminal group of the polyol is a alcoholic hydroxyl group. The novel phosphorus-containing polycarbonate polyol, as a reactive flame-retardant agent, can provide flame-retardant properties easily to polyurethane or the like.

Abstract: A curable polyimide resin composition containing a polyimide resin obtainable from by a reaction of a reaction mixture containing a diisocyanate compound, a carbonate group-containing diol compound and an imide compound having two terminal hydroxyhydrocarbyl groups gives a cured insulation film having improved characteristics.

Abstract: A modified polyimide resin favorably employable for manufacturing an insulation film of an electric-electronic device is composed of recurring units (I) derived from a biphenyltetracarboxylic acid compound, a diamine compound, and a monoamine compound having at least one hydroxyl group and recurring units (II) derived from diisocyanate and polybutadiene having hydroxyl group at each terminal, which optionally contains further recurring units (III) derived from diisocyanate and a compound having hydroxyl group at each terminal and further having a reactive substituent.

Abstract: A process for packaging an electronic device employs an insulating protective resin layer produced from one or more of the resin compositions: (1) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.5 to 30 parts of an epoxy compound having an epoxy equivalent of more than 800, and an organic solvent, (2) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 10 parts of an epoxy compound having an epoxy equivalent of 100 to 800, 2 to 30 weight parts of a polyvalent isocyanate compound, and an organic solvent; and (3) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 20 parts of an epoxy compound having an epoxy equivalent of more than 800, 2 to 30 parts of a polyvalent isocyanate compound, and an organic solvent.

Abstract: A flexible wiring board for a tape carrier package with reduced tackiness and a tape carrier package formed by using the flexible wiring board is disclosed. The flexible wiring board for a tape carrier package has an insulating film 1, a wiring pattern 3 formed on a surface of the insulating film, and an overcoat layer 9 containing a resin cured material and a porous fine particle, and protecting at least a region of said wiring pattern.

Abstract: A modified polyimide resin favorably employable for manufacturing an insulation film of an electric-electronic device is composed of recurring units (I) derived from a biphenyltetracarboxylic acid compound, a diamine compound, and a monoamine compound having at least one hydroxyl group and recurring units (II) derived from diisocyanate and polybutadiene having hydroxyl group at each terminal, which optionally contains further recurring units (III) derived from diisocyanate and a compound having hydroxyl group at each terminal and further having a reactive substituent.

Abstract: A polyimide film having enhanced surface activity and improved surface adhesion, and a polyimide film having a metal film in which the metal film is bonded to the polyimide film with practically accepted high bonding strength are provided by a polyimide film having, at least on one surface, a coated particle layer comprising inorganic particles having a mean particle size of 1,000 nm or less which are coated with a metal oxide layer via an intervening layer comprising a mixture of the same metal oxide as above and polyimide, and the polyimide film having a metal film placed on the coated particle layer.

Abstract: A flexible wiring board for tape carrier package having improved flame resistance is disclosed. The flexible wiring board has an insulating film having a bending slit, a wiring pattern formed thereon and crossing the bending slit, an adhesive layer adhering the wiring pattern to the insulating film, a flex resin layer protecting the wiring pattern at the bending slit, and an overcoat layer protecting the wiring pattern, in which the overcoat layer is obtained from a curable resin composition, when cured into a form of film, the film has an initial modulus of 10 to 1,500 MPa at 25° C., an electrical insulation of sufficient level, a soldering resistance of 10 seconds at 260° C., and an oxygen index exceeding 22.0.

Abstract: A flexible wiring board for tape carrier package having improved flame resistance is disclosed. The flexible wiring board has an insulating film having a bending slit, a wiring pattern formed thereon and crossing the bending slit, an adhesive layer adhering the wiring pattern to the insulating film, a flex resin layer protecting the wiring pattern at the bending slit, and an overcoat layer protecting the wiring pattern, in which the overcoat layer is obtained from a curable resin composition, when cured into a form of film, the film has an initial modulus of 10 to 1,500 MPa at 25° C., an electrical insulation of sufficient level, a soldering resistance of 10 seconds at 260° C., and an oxygen index exceeding 22.0.

Abstract: A polyimide complex sheet is composed of an aromatic polyimide film, an intervening layer and a thin metal oxide layer in which the intervening layer is formed of a mixture of the metal oxide and the aromatic polyimide under such condition that a ratio of the metal oxide to the aromatic polyimide increases from a side facing the polyimide film to a side facing the metal oxide layer and the intervening layer is united to the polyimide film and the metal oxide layer under such condition that the metal oxide layer is not peelable from the polyimide film without breakage of the metal oxide layer.

Abstract: A process for packaging an electronic device employs an insulating protective resin layer produced from one or more of the resin compositions: (1) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.5 to 30 parts of an epoxy compound having an epoxy equivalent of more than 800, and an organic solvent; (2) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 10 parts of an epoxy compound having an epoxy equivalent of 100 to 800, 2 to 30 weight parts of a polyvalent isocyanate compound, and an organic solvent; and (3) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 20 parts of an epoxy compound having an epoxy equivalent of more than 800, 2 to 30 parts of a polyvalent isocyanate compound, and an organic solvent.

Abstract: An object of the present invention is to provide an ink which can dispense with complicated and highly expensive steps, as required in the case of using a photosensitive resin composition, such as coating step, exposure step, development step, washing step and drying or heat-treatment step, and can produce printed matter comprising a cured coating film having a fine pattern on a substrate by a simple method of printing the ink by screen printing and then heat-treating it, without generating a large amount of waste solutions, including an alkali solution, accompanying the development or washing.

Abstract: A polypropylene resin composition comprising an isotactic polypropylene component, a rubber component, and an inorganic filler component, wherein (a) the melt flow rate, according to ASTM D1238, is 20 g/10 min or more, (b) the flexural modulus, according to ASTM D790, is 2300 MPa or more, (c) the Izod impact strength, according to ASTM D256, is 180 J/m or more at 23.degree. C. and 45 J/m or more at -30.degree. C., (d) the heat deformation temperature, according to ASTM D648, is 130.degree. C. or more, and (e) there is a diffraction peak unique to polypropylene of space group P21/c in the diffraction pattern measured by the wide angle X-ray diffraction method in an injection molded article of the composition formed under a quenching condition.