Abstract: The present invention is directed to a polyimide film with a uniform orientation angle in the transverse direction of the film. A polyimide film characterized by the fact that the width of the fabricated film is ?1.5 m, 2 points positioned inside by 200 mm from both ends of the width of the fabricated film are selected on a linear line in the vertical direction to the machine direction (MD) of the film, 1 point within center part ±200 mm, and 2 optional points are further selected on a linear line that includes said 2 points within the range of the linear line that connects said 2 points, and the orientation angle (?) is within a range of 90°±23° in at least all of these 8 points.

Abstract: The present invention is directed to a polyimide film with a uniform orientation angle in the transverse direction of the film. A polyimide film characterized by the fact that the width of the fabricated film is ?1.5 m, 2 points positioned inside by 200 mm from both ends of the width of the fabricated film are selected on a linear line in the vertical direction to the machine direction (MD) of the film, 1 point within center part ±200 mm, and 2 optional points are further selected on a linear line that includes said 2 points within the range of the linear line that connects said 2 points, and the orientation angle (?) is within a range of 90°±23° in at least all of these 8 points.

Abstract: The present invention relates to a circuit board including a flexible film provided with an extremely fine circuit pattern, a laminated member for a circuit board, and a method for making a laminated member for a circuit board with excellent productivity. A circuit board of the present invention includes a flexible film and a circuit pattern composed of a metal provided on the flexible film, and dimensional change rate of the circuit pattern is within ±0.01%. A laminated member for a circuit board of the present invention includes a reinforcing plate, a self-stick, removable organic layer, a flexible film, and a circuit pattern composed of a metal laminated in that order.

Abstract: A copper clad laminate that is suited to use in high-performance flexible printed circuit boards, which meets both dimensional change and heat resistance requisites, has a small percent dimensional change after etching, and has properties that are applicable to AOI, and which further has excellent slickness (slip) and adhesion is provided. A copper clad laminate that uses a polyimide film that primarily uses paraphenylenediamine and 4,4?-diaminodiphenylether as diamine ingredients, and pyromellitic dianhydride and 3,3?,4,4?-biphenyltetracarboxylic dianhydride as acid dianhydride ingredients, which further has slip caused by producing surface protrusions by adding inorganic particles. One copper foil is adhered to one side of the polyimide film using an adhesive; and a second copper layer is directly adhered to the second side of the polyimide film.

Abstract: The present invention relates to a circuit board including a flexible film provided with an extremely fine circuit pattern, a laminated member for a circuit board, and a method for making a laminated member for a circuit board with excellent productivity. A circuit board of the present invention includes a flexible film and a circuit pattern composed of a metal provided on the flexible film, and dimensional change rate of the circuit pattern is within ±0.01%. A laminated member for a circuit board of the present invention includes a reinforcing plate, a self-stick, removable organic layer, a flexible film, and a circuit pattern composed of a metal laminated in that order.

Abstract: The present invention relates to a circuit board including a flexible film provided with an extremely fine circuit pattern, a laminated member for a circuit board, and a method for making a laminated member for a circuit board with excellent productivity. A circuit board of the present invention includes a flexible film and a circuit pattern composed of a metal provided on the flexible film, and dimensional change rate of the circuit pattern is within ±0.01%. A laminated member for a circuit board of the present invention includes a reinforcing plate, a self-stick, removable organic layer, a flexible film, and a circuit pattern composed of a metal laminated in that order.

Abstract: The present invention relates to a circuit board including a flexible film provided with an extremely fine circuit pattern, a laminated member for a circuit board, and a method for making a laminated member for a circuit board with excellent productivity. A circuit board of the present invention includes a flexible film and a circuit pattern composed of a metal provided on the flexible film, and dimensional change rate of the circuit pattern is within ±0.01%. A laminated member for a circuit board of the present invention includes a reinforcing plate, a self-stick, removable organic layer, a flexible film, and a circuit pattern composed of a metal laminated in that order.

Abstract: The present invention provides a heat-resistant resin film with a metal layer strongly bonded to the heat-resistant resin film without deteriorating the physical properties possessed by the heat-resistant resin film, and a wiring board using the heat-resistant resin film with the metal layer.

Abstract: Provided is a non-processed plate for waterless lithographic printing plates, which comprises a photosensitive layer, an ink-repellent layer and a protective layer as laminated in that order on a support and in which the photosensitive layer contains a polymerizable compound as obtained by reacting a glycidyl ether of a polyalcohol, such as hexitol or pentitol, with acrylic acid and/or methacrylic acid. The plate has good image reproducibility and good storage stability. Processing the plate gives waterless lithographic printing plates having good printing durability.

Abstract: The present invention is a water-less lithographic printing plate, in which a photosensitive layer and a silicone rubber layer are laminated in this order on a substrate, characterized in that the photosensitive layer contains the reaction product between a compound with at least one each of phenolic hydroxyl groups and non-phenolic hydroxyl groups and a quinonediazide compound, or contains both the reaction product between a compound with at least one of phenolic hydroxyl groups and a quinonediazide compound, and the reaction product between a compound with at least one of non-phenolic hydroxyl groups and a quinonediazide compound.The water-less lithographic raw plate of the present invention is excellent in image reproducibility and printing durability, and so can be favorably and economically advantageously used also in the commercial web offset printing and the newspaper web offset printing where high printing durability is required.