Abstract: A semiconductor light emitting device includes a light emitting chip that includes a semiconductor layer at a first surface. A transparent film is provided on the semiconductor layer and forms an interface therewith. A phosphor resin layer, including a resin and a phosphor, is provided on the transparent film. A refractive index of the transparent film is greater than a refractive index of the semiconductor layer.

Abstract: A light-emitting device includes a semiconductor light-emitting element, for example, a light emitting diode. A first metal member includes a first metal plate and a first metal layer between the semiconductor light-emitting element and a first surface of the first metal plate. An insulating layer contacts a second surface of the first metal plate. The second surface is in a second plane that intersects a first plane of the first surface.

Abstract: A semiconductor light emitting device includes a light emitting chip that includes a semiconductor layer at a first surface. A transparent film is provided on the semiconductor layer and forms an interface therewith. A phosphor resin layer, including a resin and a phosphor, is provided on the transparent film. A refractive index of the transparent film is greater than a refractive index of the semiconductor layer.

Abstract: A video display device includes: a video display unit that displays video in accordance with a video signal; a switching detection signal input and output terminal that receives and outputs from and to another video display device a switching detection signal taking a first or second state; a display control unit that stops video display by the video display unit when a predetermined operation is instructed; a switching process signal output unit that outputs a predetermined switching process signal to change the switching detection signal to the first state when the predetermined operation is instructed, the switching process signal output unit stopping the output of the switching process signal when the predetermined operation is complete; and a switching detection signal input unit that releases the stoppage of the video display by the video display unit when the switching detection signal is in the second state.

Abstract: A light-emitting device includes a semiconductor light-emitting element, for example, a light emitting diode. A first metal member includes a first metal plate and a first metal layer between the semiconductor light-emitting element and a first surface of the first metal plate. An insulating layer contacts a second surface of the first metal plate. The second surface is in a second plane that intersects a first plane of the first surface.

Abstract: According to one embodiment, a semiconductor light emitting device includes a lead frame; a chip mounted on the lead frame, the chip including a substrate and a light emitting element provided on the substrate; a wall section including an inner wall facing to a side portion of the chip, and an outer wall on an opposite side to the inner wall; and a phosphor layer provided on at least the chip. A distance between the side portion of the chip and the inner wall of the wall section is smaller than a thickness of the chip. An angle between an upper surface of the lead frame and the inner wall is smaller than an angle between the upper surface of the lead frame and the outer wall.

Abstract: A semiconductor light-emitting device includes a light-emitting element provided on a lead frame, a phosphor-containing first resin provided on the light-emitting element and having a first surface facing the light-emitting element, a transparent resin that is provided between the light-emitting element and the phosphor-containing first resin and covering the entirety of the first surface of the phosphor-containing first resin, and a spherical lens provided on the phosphor-containing first resin.

Abstract: A light emitting device includes a first light emitting element on a substrate and a second light emitting element spaced from the first light emitting. A resin body is disposed between the first and second light emitting elements so as to surround the first and second light emitting elements in a plane parallel to the substrate. The resin body has a thickness in a direction orthogonal to the substrate that is greater than a thickness of each of the first and second light emitting elements. A translucent resin element is disposed on the resin body and the first and second light emitting elements. The resin body and the first and second light emitting elements are between the translucent resin element and the substrate in the first direction.

Abstract: A video display device includes: a video display unit that displays video in accordance with a video signal; a switching detection signal input and output terminal that receives and outputs from and to another video display device a switching detection signal taking a first or second state; a display control unit that stops video display by the video display unit when a predetermined operation is instructed; a switching process signal output unit that outputs a predetermined switching process signal to change the switching detection signal to the first state when the predetermined operation is instructed, the switching process signal output unit stopping the output of the switching process signal when the predetermined operation is complete; and a switching detection signal input unit that releases the stoppage of the video display by the video display unit when the switching detection signal is in the second state.

Abstract: According to an embodiment, equipment for manufacturing a semiconductor device includes a first block, a plurality of stamp pins, a second block and a plurality of springs. The first block includes a plurality of first through-holes penetrating from a first major surface to a second major surface. The stamp pins are inserted into each of the first through-holes from the first major surface, each of the stamp pins having an end projected from the second major surface and being capable of moving forward and backward in the insertion direction. The second block has a plurality of second through-holes with an inner diameter larger than an inner diameter of the first through-holes, the second through-holes being disposed so as to overlap with the first through-holes; and the springs are disposed in each of the second through-holes, for biasing the stamp pins in the insertion direction.

Abstract: According to an embodiment, equipment for manufacturing a semiconductor device includes a first block, a plurality of stamp pins, a second block and a plurality of springs. The first block includes a plurality of first through-holes penetrating from a first major surface to a second major surface. The stamp pins are inserted into each of the first through-holes from the first major surface, each of the stamp pins having an end projected from the second major surface and being capable of moving forward and backward in the insertion direction. The second block has a plurality of second through-holes with an inner diameter larger than an inner diameter of the first through-holes, the second through-holes being disposed so as to overlap with the first through-holes; and the springs are disposed in each of the second through-holes, for biasing the stamp pins in the insertion direction.