Abstract: A circuit device which can form terminal portions at narrow pitches a manufacturing method of the circuit device, and a connecting member are provided. A circuit device 10 includes: a first printed circuit board 11 and a second printed circuit board 15 which are arranged along the thickness direction of substrates 12, 16; and a connecting member 20 which is interposed between the first printed circuit board 11 and the second printed circuit board 15. The first printed circuit board 11 and the second printed circuit board 15 are electrically connected with each other by terminal portions 21 formed on the connecting member 20. The circuit device 10 integrally forms the terminal portions 21 on a frame body 25 by plating.

Abstract: It is intended to provide novel amine compounds which are efficacious against diseases such as infection with HIV virus, rheumatism and cancer metastasis. Namely, amine compounds represented by the following general formula (1): In a typical case, A1 and A2 represent each an optionally substituted monocyclic or polycyclic aromatic heterocycle; W represents cyclic C3-10 alkylene, an optionally substituted monocyclic or polycyclic aromatic heterocycle, a monocyclic or polycyclic aromatic ring or a partly saturated polycyclic aromatic ring; X represents O, CH2, C(?O) or NR11; and D is a group represented by the following general formula (4) or (6). In the formula (6), Q represents a single bond, S, O or NR12; and Y is a group represented by the following general formula (7). —(CR18R19)m3— Or —(CR20R21)m4-z-(CR22R23)m5??(7) z represents an optionally substituted monocyclic or polycyclic aromatic ring. In the formula (6), B represents NR25R26.

Abstract: A drill guide jig for guiding a drill orthogonally to a curved surface of a workpiece is disclosed. The jig is provided with a guide member having a guide hole for passing a drill and a holding member for holding the guide member. The holding member has a contact part for making contact with a curved surface of the workpiece on the lower side. The contact part has two contact points for making contact with the curved surface. The two contact points are symmetrical in relation to a center axis orthogonal to a midpoint of a line segment that connects the contact points. The drill is perpendicular in relation to the curved surface of the workpiece because the guide hole is disposed along the center axis.

Abstract: An object of the present invention is to provide technology in which an HA is capable of efficiently maintaining registration information of an MR, and communication efficiency in registration/update processing between the HA and the MR is improved. A mobile node has a representative home address, a subsidiary home address, and a care-of address, and registers information (joint information) showing the relation between the representative home address, and all subsidiary home addresses, and the care-of address with the home agent, each time the mobile node moves to other network and is assigned a new care-of address.

Abstract: A first circuit board (1) mounted with an electronic component (16) and a second circuit board (2) are vertically connected three-dimensionally through an interconnecting board (3) wherein the terminal portion (6) of the land electrode (5) on the interconnecting board (3) is buried in the termination material (9) of the interconnecting board (3). Consequently, the chance of peeling or cracking due to peeling stress or shearing stress acting between the upper/lower circuit boards and the land electrode by high density mounting, thermal shock or falling impact can be suppressed or buffered resulting in high reliability.

Abstract: It is intended to provide novel amine compounds which are efficacious against diseases such as infection with HIV virus, rheumatism and cancer metastasis. Namely, amine compounds represented by the following general formula (1): In a typical case, A1 and A2 represent each an optionally substituted monocyclic or polycyclic aromatic heterocycle; W represents cyclic C3-10 alkylene, an optionally substituted monocyclic or polycyclic aromatic heterocycle, a monocyclic or polycyclic aromatic ring or a partly saturated polycyclic aromatic ring; X represents O, CH2, C(?O) or NR11; and D is a group represented by the following general formula (4) or (6). In the formula (6), Q represents a single bond, S, O or NR12; and Y is a group represented by the following general formula (7). z represents an optionally substituted monocyclic or polycyclic aromatic ring. In the formula (6), B represents NR25R26. In the above formulae, R1 to R26 each represents hydrogen, alkyl, alkenyl or alkynyl.

Abstract: A connector has a base having an opening to be inserted with a tip portion of a flexible printed circuit board at a front surface, and having a plurality of insertion holes passing from the front surface to a rear surface juxtaposed at a predetermined pitch, a connection terminal arranged in a projecting manner with a substantially T-shaped operating piece having at one end a movable contacting point that comes into pressure contact with joints juxtaposed at the tip portion of the flexible printed circuit board, the connection terminal having one end that becomes a fixed contacting point inserted to the insertion hole from the rear surface side, and an operating lever in which a cam portion is fitted into a turning recessed portion arranged at an upper side of the connection terminal to act as a turning supporting point, the cam portion driving an operation receiving portion positioned at the other end of the operating piece.

Abstract: There is provided a composition comprising a compound represented by general formula (I), wherein Rl represents a 5-iodothiophen-2-yl group or the like, and R2 represents a 4-dimethylaminophenyl group or the like. This composition is useful for diagnosis of an amyloid-related disease such as Alzheimer's disease because the compound has high binding specificity to amyloid ? protein, high permeability through the blood-brain barrier, and a property of being rapidly eliminated from sites other than senile plaques in the brain.

Abstract: A module substrate has an interconnection electrode that is exposed at a side end face thereof. A semiconductor component including an IC chip is mounted on the module substrate. A molded part comprising a resin is formed so as to cover at least a part of the semiconductor component. A coating with higher heat conductivity than the molded part is formed on the surface of the molded part by applying a paste made of material with higher heat conductivity than the molded part. This improves heat dissipation. The coating can be formed such that it extends to the surface of the main substrate on which the module substrate with the semiconductor component is mounted and comes into contact with the interconnection electrode on the surface of the main substrate. This further improves heat dissipation.

Abstract: Electronic circuit device (100) is structured so that a substrate module unit that are formed by stacking substrate modules made of a first resin sheet with electronic component (190) embedded thereinto is inserted into housing (150) including connecting terminal (120), control circuit (130), and first wiring pattern (140), where the substrate modules are connected to each other electrically and mechanically. This electronic circuit device (100) dispenses with a mother substrate. Further, with slimming down of a substrate module, a substrate module unit with a large number of substrate modules stacked can be loaded in a limited packaging space, thus mounting greater storage capacity and higher functionality.

Abstract: This semiconductor device is a semiconductor device in which a semiconductor element is flip-chip mounted onto a circuit substrate and the semiconductor element is covered and sealed with a sealing resin. A recess portion is formed in the sealing resin on a surface opposite to the mounting surface of the semiconductor element. Warping of the semiconductor device is reduced by the action of this recess portion.

Abstract: A substrate connecting member connects two circuit boards connected together while maintaining high reliability of the junctions between itself and the circuit boards even if the circuit boards are warped by temperature change of an impact load. The substrate connecting member includes a frame member made of an insulating resin; slit grooves formed in at least one of the inner and outer surfaces of frame side portions composing the frame member, the slit grooves being formed throughout the entire length of the frame side portions in the direction perpendicular to the thickness direction of the frame side portions; and connection conductor portions having connection terminals provided on the top and bottom surfaces, respectively, of the frame side portions in the thickness direction and connecting conductors each connecting connection terminals.

Abstract: A 3D circuit module which is highly reliable, easily layered and able to mount electronic components in high density is obtained by providing a support member having a frame in the periphery thereof and a recess; a coating layer for coating the frame and filling in the recess, the coating layer being made of resin material which is adhesive and has a softening temperature lower than the softening temperature of the support member; a wiring pattern formed on the coating layer, the wiring pattern including a first land on the frame, a second land on the recess, and a wiring part for connecting between the first land and the second land; and an electronic component having a projecting electrode formed on a side thereof, the electronic component being bonded to the coating layer and accommodated in the recess, with the projecting electrode connected to the second land.

Abstract: The electrode junction structure includes: a glass substrate; a plurality of flexible substrates, in a planar view, arranged to cross over an edge of the glass substrate and arranged to have a space from each other along the edge; an adhesive for joining the glass substrate and each flexible substrate; and a sealing resin for covering junction portions between the glass substrate and each flexible substrate, wherein an edge of the sealing resin is formed so that the edge of the sealing resin has, in the planar view, a consecutive waveform portion in which a convex portion and a concave portion alternate with an imaginary line as a center axis, the imaginary line being parallel to the edge of the glass substrate and locating outer than the edge of the glass substrate, and wherein the convex portions are formed to be located on the flexible substrates.

Abstract: A mounting structure of the present invention includes: electronic components, a first substrate on which the electronic components are mounted, a first resin for molding at least a part of a surface of the first substrate with the electronic components mounted on the surface, a second substrate on which the first substrate is mounted, connecting members for connecting the first substrate and the second substrate, and a flat reinforcing member disposed on the opposite surface of the second substrate from a surface on which the first substrate is mounted. The reinforcing member is disposed such that the longitudinal direction of the reinforcing member is arranged along the longitudinal direction of the first substrate.

Abstract: In a packet repeater of a wireless base station, a packet analyzer receives uplink packets from mobile terminals and stores data indicating quality of each wireless link between the base station and each mobile terminal in a memory. A packet sorter receives downlink packets from a network and stores the received packets into buffers according to the destinations of downlink packets and their service classes. According to the data stored in the memory, packets in the buffers are into a first group of queues in which quality of service is not satisfied and a second group of queues in which quality of service is satisfied. A packet scheduler sequentially transmits all packets from the first-group queues to mobile terminals, and reorders the second-group queues in a descending order of their qualities of wireless links and sequentially transmits all packets from the reordered queues to the mobile terminals.

Abstract: A substrate structure whereby a resin part for coating a plurality of electronic components by one operation is given a shielding property and the mounting strength of electronic components with respect to the substrate is secured and an electronic device including the substrate structure are provided. A substrate structure 10 includes a substrate 11, a plurality of electronic components 12 mounted along the substrate 11, and a resin part 13 coating each electronic component 12 with a resin 18 while kept in close contact with the substrate 11. The substrate structure 10 includes a frame body 15 surrounding each electronic component 12 while kept in close contact with the substrate 11 and a lid part 17 closing an opening 16 in the frame body 15, and a resin 18 is filled inside the frame body 15.

Abstract: It is intended to provide a substrate structure ensuring a shielding property and a heat discharge property of a resin part that collectively covers a plurality of electronic components and capable of downsizing, thinning, and a reduction in number of components. The substrate structure 20 of the first embodiment is provided with a substrate 21, a plurality of electronic components 22 mounted along the substrate 21, and a resin part 25 that covers the electronic components 22 and is in close contact with the substrate 21. In the substrate structure 20, the resin part 25 is provided with a reinforcing heat discharge layer 26 covering the electronic components 22 and having a heat conductivity and a reinforcing property and a shield layer 27 covering the reinforcing heat discharge layer 26, and a surface o28 of the shield layer 27 is formed into a predetermined shape corresponding to a surface structure of the display device 30 adjacent to the resin part 25.

Abstract: A stereoscopically connected structure is made up of a first circuit board and a second circuit board which are mounted with other electronic components, and a relay board having a recess which is mounted with an electronic component and is provided with a lead-out wiring extending from the electronic component, and also having a land part to be connected with the lead-out wiring on one of the surfaces of the relay board that face the first circuit board and second circuit board. Thus the relay board can mount the electronic component thereon as well as connect the first circuit board and the second circuit board, thereby achieving high density mounting.