Abstract: A semiconductor light emitting device can be configured to maintain high luminance and to suppress the possibility of the occurrence of wire breakage with high quality and reliability. A method for producing such a semiconductor light emitting device with a high process yield is also disclosed. The semiconductor light emitting device can include a sealing member into which a reflective filler can be mixed in such an amount (concentration) range that luminous flux with a predetermined amount can be maintained and the possibility of the occurrence of wire breakage can be lowered. Various sealing members containing a reflective filler with a plurality of concentrations within this range can be prepared in advance.

Abstract: A semiconductor light-emitting device can include high heat dissipation properties and a high degree of mounting flexibility. Also a surface light source can be configured to use the above-noted semiconductor light-emitting device. The semiconductor light-emitting element can be mounted on a package obtained by insert-molding lead frames with a resin. One of the end portions of the lead frames can be connected to respective electrodes of the semiconductor light-emitting element, and other end portions thereof can protrude outward from a resin molded portion of the package. One of the lead frames can include a block body on which the semiconductor light-emitting element is disposed. The block body protrudes from the resin molded portion. The semiconductor light-emitting device having the above structure and a circuit substrate can be mounted on a metal base which can be brought into direct contact with the block body.

Abstract: A semiconductor light-emitting device can include high heat dissipation properties and a high degree of mounting flexibility. Also a surface light source can be configured to use the above-noted semiconductor light-emitting device. The semiconductor light-emitting element can be mounted on a package obtained by insert-molding lead frames with a resin. One of the end portions of the lead frames can be connected to respective electrodes of the semiconductor light-emitting element, and other end portions thereof can protrude outward from a resin molded portion of the package. One of the lead frames can include a block body on which the semiconductor light-emitting element is disposed. The block body protrudes from the resin molded portion. The semiconductor light-emitting device having the above structure and a circuit substrate can be mounted on a metal base which can be brought into direct contact with the block body.