Patents by Inventor Masahiro SEIDOU

Masahiro SEIDOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090297841
    Abstract: A composite material with an electric contact layer includes a metal substrate, an adhesion layer formed-on a surface of the metal substrate, including an alloy including palladium (Pd) and a Y group metal as a main component selected from titanium (Ti), niobium (Nb), tantalum (Ta) and zirconium (Zr), and having an average thickness of not less than 5 nm and not more than 100 nm, and the electric contact layer formed on a surface of the adhesion layer, including a noble metal selected from gold (Au), platinum (Pt), rhodium (Rh), iridium (Ir) and silver (Ag), and having an average thickness of not less than 1 nm and not more than 20 nm.
    Type: Application
    Filed: January 13, 2009
    Publication date: December 3, 2009
    Applicant: Hitachi Cable, Ltd.
    Inventors: Takaaki Sasaoka, Masahiro Seidou, Mineo Washima
  • Publication number: 20090297918
    Abstract: A board material for a fuel cell metallic separator includes a metallic substrate, an intermediate layer formed on a surface of the metallic substrate, and including titanium (Ti), and a Au layer formed on a surface of the intermediate layer, including pure gold (Au), and having an average thickness of not less than 1 nm and not more than 9 nm. A fuel cell metallic separator includes the board material that includes a concavo-convex shape.
    Type: Application
    Filed: February 2, 2009
    Publication date: December 3, 2009
    Applicant: Hitachi Cable, Ltd.
    Inventors: Takaaki Sasaoka, Masahiro Seidou, Kazuhiko Nakagawa, Mineo Washima
  • Publication number: 20090263678
    Abstract: A metal material with electric contact layer includes a metal base made of metal containing chromium; an adhesive layer formed on a surface of the metal base, mainly containing chromium and having a thickness of 5 nm or more and 200 nm or less; and an electric contact layer formed on the surface of the adhesive layer, made of noble metal or an alloy of the noble metal, and having a thickness of 1 nm or more and 20 nm or less.
    Type: Application
    Filed: March 31, 2009
    Publication date: October 22, 2009
    Applicant: HITACHI CABLE, LTD.
    Inventors: Takaaki SASAOKA, Mineo WASHIMA, Masahiro SEIDOU