Patents by Inventor Masahiro Suguro

Masahiro Suguro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5393934
    Abstract: In making busbar conductors, this invention saves the material of busbars that form the circuits on the boards to lower the cost, and improves the workability of the busbars to be punched. In busbar conductors each having a plurality of busbars of desired patterns arranged on an insulating substrate, the busbars are punched out selectively from two or more conductive materials with different conductivities.
    Type: Grant
    Filed: February 28, 1994
    Date of Patent: February 28, 1995
    Assignee: Yazaki Corporation
    Inventors: Akio Mori, Akiyoshi Sato, Masahiro Suguro, Makota Nakayama
  • Patent number: 5362245
    Abstract: A frame-coupling-type connector includes a first connector, a second connector to be engaged with the first connector, a frame pivotably supported at a central portion thereof by the first connector and having an effect of a lever, and a coupling mechanism. The coupling mechanism includes a frame-side engaging portion provided at one end of the frame and a connector-side engaging portion provided at one side of the second connector. The frame-side engaging portion and the connector-side engaging portion are pivotably and slidably engaged with each other. The first connector is engaged with the second connector in a straight line by the effect of the lever of the frame and by the coupling mechanism.
    Type: Grant
    Filed: October 13, 1993
    Date of Patent: November 8, 1994
    Assignee: Yazaki Corporation
    Inventors: Masahiro Suguro, Yoshinori Ohumura, Minoru Imamura
  • Patent number: 4972295
    Abstract: An electrical junction box for connecting thereto a fuse, relay, unit, connector, etc., including a metal backed printed circuit board, which comprises a metal substrate such as aluminum; a heat conductive electrical insulating layer supported by the metal substrate; a plurality of circuits printed on the heat conductive electrical insulating layer, each of the plurality of circuits having a desired pattern.
    Type: Grant
    Filed: June 29, 1989
    Date of Patent: November 20, 1990
    Assignee: Yazaki Corporation
    Inventors: Masahiro Suguro, Tatsumi Kondo