Abstract: A sensor unit according to an embodiment includes a piezoelectric sensor having a wire shape, and a measurement part including an abutting surface formed with a guide groove that holds a part of the piezoelectric sensor and abutting a measurement object at predetermined pressure.

Abstract: A rotating machine abnormality detection device of an embodiment includes a non-contact acoustic emission sensor, an analyzer, and a diagnoser. The non-contact acoustic emission sensor, arranged at a position spaced away by a predetermined distance from a measurement target acting as a rotating member or a measurement target rotatably supporting the rotating member, is configured to detect acoustic emission that occurs during rotation of the measurement target or the rotating member supported by the measurement target and propagates in an atmosphere. The analyzer is configured to perform time-frequency analysis on a detection signal of the non-contact acoustic emission sensor. The diagnoser is configured to detect occurrence of a rotation abnormality when a frequency component equal to or larger than a predetermined threshold value is present in a predetermined frequency band, based on an analysis result of the analyzer.

Abstract: A shape measurement method includes: acquiring first data of a change of a distance between a first probe and a calibration measurement object and acquiring second data of a change of a distance between a second probe and the calibration measurement object while moving the calibration measurement object in a first direction, the calibration measurement object being rotationally symmetric around an axis parallel to the first direction, the first probe and the second probe being arranged in a second direction orthogonal to the first direction; estimating an error of the movement included in the first data based on the first and second data; acquiring third data of a change of a distance between the first probe and a measurement object while moving the measurement object relative to the first probe in the first direction; and correcting the third data by using the error.

Abstract: A rotating machine abnormality detection device of an embodiment includes a non-contact acoustic emission sensor, an analyzer, and a diagnoser. The non-contact acoustic emission sensor, arranged at a position spaced away by a predetermined distance from a measurement target acting as a rotating member or a measurement target rotatably supporting the rotating member, is configured to detect acoustic emission that occurs during rotation of the measurement target or the rotating member supported by the measurement target and propagates in an atmosphere. The analyzer is configured to perform time-frequency analysis on a detection signal of the non-contact acoustic emission sensor. The diagnoser is configured to detect occurrence of a rotation abnormality when a frequency component equal to or larger than a predetermined threshold value is present in a predetermined frequency band, based on an analysis result of the analyzer.

Abstract: A shape measurement method includes: acquiring first data of a change of a distance between a first probe and a calibration measurement object and acquiring second data of a change of a distance between a second probe and the calibration measurement object while moving the calibration measurement object in a first direction, the calibration measurement object being rotationally symmetric around an axis parallel to the first direction, the first probe and the second probe being arranged in a second direction orthogonal to the first direction; estimating an error of the movement included in the first data based on the first and second data; acquiring third data of a change of a distance between the first probe and a measurement object while moving the measurement object relative to the first probe in the first direction; and correcting the third data by using the error.

Abstract: The machine tool 1 for machining a hole 3a of a desired size in a workpiece 3, includes: a main shaft 30 holding a tool 2; a spindle unit 40 including a spindle 41 which holds the shaft 30 rotatably on the axis r of rotation, and a housing 42 which covers the periphery of the spindle 41; a drive unit 50 for holding the unit 40 tiltably with respect to the workpiece 3 held by a holder 20, and for moving the unit 40 relative to the workpiece 3; a mount 70 extending from the housing 42 toward the periphery of the shaft 30; and a control section 90 which, based on the results of measurement by distance measurement sensors 82 held by the mount 70, controls the unit 50 so as to correct the inclination of the shaft 30 with respect to the workpiece 3.

Abstract: According to one embodiment, a substrate processing system includes a measuring unit, a data processing unit, and a processing unit. The measuring unit is configured to measure information relating to a thickness dimension of a substrate. The substrate includes a light emitting unit and a wavelength conversion unit. The wavelength conversion unit includes a phosphor. The data processing unit is configured to determine processing information relating to a thickness direction of the wavelength conversion unit based on the measured information relating to the thickness dimension of the substrate and based on information relating to a characteristic of light emitted from the light emitting unit. The processing unit is configured to perform processing of the wavelength conversion unit based on the determined processing information.

Abstract: The machine tool 1 for machining a hole 3a of a desired size in a workpiece 3, includes: a main shaft 30 holding a tool 2; a spindle unit 40 including a spindle 41 which holds the shaft 30 rotatably on the axis r of rotation, and a housing 42 which covers the periphery of the spindle 41; a drive unit 50 for holding the unit 40 tiltably with respect to the workpiece 3 held by a holder 20, and for moving the unit 40 relative to the workpiece 3; a mount 70 extending from the housing 42 toward the periphery of the shaft 30; and a control section 90 which, based on the results of measurement by distance measurement sensors 82 held by the mount 70, controls the unit 50 so as to correct the inclination of the shaft 30 with respect to the workpiece 3.

Abstract: According to one embodiment, a semiconductor light emitting device includes a light emitting section and a wavelength conversion section. The light emitting section is configured to emit light. The wavelength conversion section is provided on one major surface side of the light emitting section. The wavelength conversion section contains a phosphor. The wavelength conversion section has a distribution of amount of the phosphor based on a distribution of wavelength of the light emitted from the light emitting section.

Abstract: A nozzle plate includes: a flow channel opening in a first surface of the nozzle plate; a liquid chamber communicating with the flow channel; and a nozzle hole communicating with the liquid chamber and opening in a second surface of the nozzle plate. The liquid chamber has a flat portion which is substantially parallel to the second surface. The nozzle hole communicates with the liquid chamber in the flat portion. A method for producing a nozzle plate includes: forming a liquid chamber which opens in a first surface of a plate-like body; forming a flat portion in a bottom of the liquid chamber; and forming a nozzle hole which communicates with the flat portion and opens in a second surface of the plate-like body.

Abstract: According to one embodiment, a substrate processing system includes a measuring unit, a data processing unit, and a processing unit. The measuring unit is configured to measure information relating to a thickness dimension of a substrate. The substrate includes a light emitting unit and a wavelength conversion unit. The wavelength conversion unit includes a phosphor. The data processing unit is configured to determine processing information relating to a thickness direction of the wavelength conversion unit based on the measured information relating to the thickness dimension of the substrate and based on information relating to a characteristic of light emitted from the light emitting unit. The processing unit is configured to perform processing of the wavelength conversion unit based on the determined processing information.

Abstract: According to one embodiment, a semiconductor light emitting device includes a light emitting section and a wavelength conversion section. The light emitting section is configured to emit light. The wavelength conversion section is provided on one major surface side of the light emitting section. The wavelength conversion section contains a phosphor. The wavelength conversion section has a distribution of amount of the phosphor based on a distribution of wavelength of the light emitted from the light emitting section.

Abstract: A diffraction optical element is provided to reduce harmful lights and also suppress deterioration in the optical characteristics of the element. The diffraction optical element 22 is formed with a plurality of diffraction gratings 17?, 18?, 19? and 20?. From these diffraction gratings, there are selected the diffraction gratings 18?, 19? and 20? whose groove apex angles are less than a predetermined angle. The diffraction gratings 18?, 19? and 20? has chamfer surfaces 18c?, 19c? and 20c? formed on the lower side of respective slanted surfaces 18a?, 19a? and 20a?. The chamfer surfaces 18c?, 19c? and 20c? are slanted to the slanted surfaces 18a?, 19a? and 20a?, respectively.

Abstract: A diffraction optical element is provided to reduce harmful lights and also suppress deterioration in the optical characteristics of the element. The diffraction optical element 22 is formed with a plurality of diffraction gratings 17?, 18?, 19? and 20?. From these diffraction gratings, there are selected the diffraction gratings 18?, 19? and 20? whose groove apex angles are less than a predetermined angle. The diffraction gratings 18?, 19? and 20? has chamfer surfaces 18c?, 19c? and 20c? formed on the lower side of respective slanted surfaces 18a?, 19a? and 20a?. The chamfer surfaces 18c?, 19c? and 20c? are slanted to the slanted surfaces 18a?, 19a? and 20a?, respectively.

Abstract: A nozzle plate includes: a flow channel opening in a first surface of the nozzle plate; a liquid chamber communicating with the flow channel; and a nozzle hole communicating with the liquid chamber and opening in a second surface of the nozzle plate. The liquid chamber has a flat portion which is substantially parallel to the second surface. The nozzle hole communicates with the liquid chamber in the flat portion. A method for producing a nozzle plate includes: forming a liquid chamber which opens in a first surface of a plate-like body; forming a flat portion in a bottom of the liquid chamber; and forming a nozzle hole which communicates with the flat portion and opens in a second surface of the plate-like body.