Abstract: An addition condensation product, i.e., an addition condensation product of an aromatic compound with a carbonyl compound, is obtained as a condensation reaction product in the state of uniform solution or the like, in which clumping caused by agglomeration of the condensation product of the aromatic compound with the carbonyl compound can be prevented by the presence of a surfactant at the time of the condensation reaction. In addition, a coating solution prepared by using an original solution or an adjusted solution whose viscosity is 2.0 mPa·s or greater exhibits an excellent polymer scale adhesion inhibition effect when applied to an inner wall and the like of a polymerization vessel; and in addition, a low-accumulative coating film is formed when the solution is applied to an inner wall and the like of a polymerization vessel.

Abstract: Provided is an addition condensation product of an aromatic compound and a carbonyl compound. The addition condensation product includes an aromatic compound dimer in which two composition units derived from the aromatic compounds are bonded via one composition unit derived from the carbonyl compound and an aromatic compound multimer in which each of three or more composition units derived from the aromatic compounds is bonded via one composition unit derived from the carbonyl compound. A ratio of the aromatic compound dimer to the aromatic compound multimer is in the range of 1:75 to 1:1,000.

Abstract: Provided is an addition condensation product of an aromatic compound and a carbonyl compound. The addition condensation product includes an aromatic compound dimer in which two composition units derived from the aromatic compounds are bonded via one composition unit derived from the carbonyl compound and an aromatic compound multimer in which each of three or more composition units derived from the aromatic compounds is bonded via one composition unit derived from the carbonyl compound. A ratio of the aromatic compound dimer to the aromatic compound multimer is in the range of 1:75 to 1:1,000.

Abstract: A production method of an addition condensation product includes a step at which an aromatic compound, a carbonyl compound, and a catalyst are mixed in a reaction solvent, and an addition condensation reaction of the aromatic compound and the carbonyl compound is conducted in the temperature range of 60 to 97° C., both inclusive, to obtain the addition condensation product of the aromatic compound and the carbonyl compound. At the step to obtain the addition condensation product, 1 mole of the aromatic compound is mixed with 0.1 to 0.999 mole, both inclusive, of the carbonyl compound as the mole ratio. A ratio of the aromatic compound dimer to the aromatic compound multimer is in the range of 1:75 to 1:1,000.

Abstract: A method of producing a flexible single-sided polyimide copper-clad laminate having excellent flex properties. The method comprises: (A) forming a polyamic acid coating by applying a polyamic acid to the surface of a copper foil starting material, (B) forming a laminate by bonding a polyimide film to the polyamic acid coating, and (C) heat treating the laminate, wherein the copper foil starting material is a material for which, if the copper foil starting material is subjected to a heat treatment for 30 minutes at 200° C. in a non-oxidizing atmosphere and the intensity of the (200) plane determined by X-ray diffraction following this heat treatment is termed I, and if the intensity of the (200) plane determined by X-ray diffraction of a copper powder that has not been subjected to heat treatment is termed I0, I and I0 satisfy a relationship represented by a formula (I) shown below: I/I0>20 ??(I).

Abstract: A flexible metal foil/polyimide laminate is prepared by applying a polyamic acid varnish onto a very thin copper foil on a carrier, semi-drying the varnish, laminating a polyimide film to the varnish-coated copper foil using a hot roll press, and heat treating the laminate for solvent removal and imidization in an atmosphere having a controlled oxygen concentration. A polyimide adhesive layer resulting from the imidization of polyamic acid has a thickness of up to 6 ?m, the sum of the thicknesses of the polyimide film and the polyimide adhesive layer is up to 25 ?m. The polyimide adhesive layer has a Tg>400° C.

Abstract: An adhesive sheet including a releasable base material, and an adhesive layer formed on one surface of the base material is provided. The adhesive layer includes an adhesive composition including (A) 100 parts by mass of a carboxyl group-containing urethane-modified polyester resin, (B) an epoxy resin, (C) a curing agent, and (D) an inorganic filler, and has a thickness within a range from 40 to 100 ?m. The adhesive sheet has a high degree of adhesiveness and excellent anti-migration properties, and is also effective as an interlayer insulating material.

Abstract: A method for preparing a flexible metal foil/polyimide laminate is characterized by laminating a metal foil and a polyimide film, with a heat resistant adhesive interleaved therebetween, on a heating roll press, and heat treating the laminate for removing the residual solvent from the adhesive layer and heat curing the adhesive layer.

Abstract: A flexible metal foil/polyimide laminate consists of all three layers, a polyimide film, a metal foil, and a polyimide resin layer disposed between the polyimide film and the metal foil.

Abstract: A polyimide precursor resin solution composition sheet having a solvent content of 1–50% by weight and a thickness of 1–10 microns has improved adhesion, forms a heat resistant polyimide layer when cured, and is advantageously used in the bonding of conductors to plastic films.

Abstract: A flexible metal foil/polyimide laminate is prepared by applying a polyamic acid varnish onto a very thin copper foil on a carrier, semi-drying the varnish, laminating a polyimide film to the varnish-coated copper foil using a hot roll press, and heat treating the laminate for solvent removal and imidization in an atmosphere having a controlled oxygen concentration. A polyimide adhesive layer resulting from the imidization of polyamic acid has a thickness of up to 6 ?m, the sum of the thicknesses of the polyimide film and the polyimide adhesive layer is up to 25 ?m. The polyimide adhesive layer has a Tg>400° C.

Abstract: In a flexible metal foil/polyimide laminate comprising in sequence, a heat resistant polyimide film, an adhesive layer, and a metal foil, the adhesive layer is a polyimide adhesive layer with a Tg of at least 400° C., obtained by heat imidization of a polyamic acid varnish containing 5-200 ppm of a leveling agent, typically polyether-modified silicone. This laminate of the all polyimide type takes full advantage of the properties of heat resistant polyimide film, includes the adhesive layer having a smooth surface, and is free of thickness variations.

Abstract: A process is provided for producing a vinyl chloride-based polymer by polymerization of vinyl chloride or a monomer mixture containing it in a reaction vessel. Heat generated during polymerization is removed using a reflux condenser. When the polymerization rate is within a range from 30% to 50%, a copolymeric polyether, with a weight average molecular weight of 1,500,000 to 2,000,000, and an ethylene oxide to propylene oxide molar ratio within a range from 78/22 to 82/18, is added to the reaction mass. Foaming of the polymer slurry due to the use of the reflux condenser beyond the point where the polymerization rate reaches 60% is suppressed, and the polymer can be produced with no deleterious effects on the quality of the product polymer.

Abstract: A flexible metal foil-polyimide laminate is prepared by applying a dimethylacetamide solution of polyamic acid onto a metal foil, drying the applied solution to form a semi-dry adhesive layer, laminating a polyimide film thereto on a hot roll press, and heat curing for solvent removal and imidization. The polyimide film has a dimethylacetamide gas permeability of at least 0.1 kg/m2·hr at 5 Torr and 200° C. In the heat curing step, the residual solvent and the water formed upon imidization in the adhesive layer are removed through the polyimide film.

Abstract: A flexible metal foil-polyimide laminate is prepared by joining a polyimide film to a metal foil via an intervening adhesive layer. The adhesive is a mixture of polyamic acids: (A) the reaction product of 3,4,3?,4?-biphenyltetracarboxylic anhydride with p-phenylenediamine, (B) the reaction product of 3,4,3?,4?-biphenyltetracarboxylic anhydride with 4,4?-diaminodiphenyl ether, and (C) the reaction product of pyromellitic dianhydride with 4,4?-diaminodiphenyl ether, in a weight ratio (A+B)/C between 75/25 and 25/75. The method is simple and inexpensive, and yields a flexible metal foil-polyimide laminate that is improved in peel strength and curling resistance while maintaining the heat resistance of polyimide.

Abstract: A polyimide precursor resin solution composition sheet having a solvent content of 1-50% by weight and a thickness of 1-10 microns has improved adhesion, forms a heat resistant polyimide layer when cured, and is advantageously used in the bonding of conductors to plastic films.

Abstract: A method of producing a vinyl chloride-based polymer by suspension polymerization is provided, by which heat removal performed by a reflux condenser can be increased, but total heat removal performed by the jacket can be reduced, without affecting the quality of the product polymer. The method includes commencing heat removal when or after a polymerization conversion rate reaches 15%, and controlling said reflux condenser so as to remove a fixed quantity of heat per unit of time depending on the polymerization conversion rate as the polymerization process proceeds.

Abstract: A process is provided for producing a vinyl chloride-based polymer by polymerization of vinyl chloride or a monomer mixture containing it in a reaction vessel. Heat generated during polymerization is removed using a reflux condenser. When the polymerization rate is within a range from 30% to 50%, a copolymeric polyether, with a weight average molecular weight of 1,500,000 to 2,000,000, and an ethylene oxide to propylene oxide molar ratio within a range from 78/22 to 82/18, is added to the reaction mass. Foaming of the polymer slurry due to the use of the reflux condenser beyond the point where the polymerization rate reaches 60% is suppressed, and the polymer can be produced with no deleterious effects on the quality of the product polymer.

Abstract: A method of producing a vinyl chloride-based polymer by suspension polymerization is provided, by which heat removal performed by a reflux condenser can be increased, but total heat removal performed by the jacket can be reduced, without affecting the quality of the product polymer. The method includes commencing heat removal when or after a polymerization conversion rate reaches 15%, and controlling said reflux condenser so as to remove a fixed quantity of heat per unit of time depending on the polymerization conversion rate as the polymerization process proceeds.

Abstract: Vinyl chloride or a monomer mixture containing it transported over a long distance or stored for a long period usually contains a polymerization inhibitor and Fe ions. If this kind of vinyl chloride or monomer mixture is polymerized, stirring torque during the polymerization increases, and heat removal by the cooling jacket of a polymerization vessel tends to become insufficient, making the polymer quality subject to bad influences. In the present invention, a hydroxycarboxylic acid compound is added to the polymerization mixture in an amount of 50-1000 ppm relative to the monomer or monomer mixture. As a result, an increase in stirring torque during polymerization is suppressed, and heat removal by the cooling jacket of the polymerization vessel can be performed effectively, making it possible to obtain vinyl chloride of good quality.