Abstract: A semiconductor memory device includes first and second planes of memory cells, and a control circuit configured to perform a write operation on the memory cells to store first and second bits per memory cell, and to perform a first read operation using a first read voltage to read the first bits and a second read operation using second and third read voltages to read the second bits. In response to a first instruction, the control circuit performs the first and second read operations to read the first bits from the first plane and the second bits from the second plane, respectively. In response to a second read instruction, the control circuit performs the second and first read operations to read the second bits from the first plane and the first bits from the second plane, respectively.

Abstract: A storage system includes a controller and one or more storage devices, and the controller can compress data in different compression units, and collectively compresses data of one or a plurality of consecutive addresses in each compression unit of the different compression units. The controller receives write data, determines whether read of data stored in the one or more storage devices is necessary for compression of the write data by a first compression unit, determines compression of the write data in the first compression unit when read is not necessary, and determines compression in the first compression unit or compression in a second compression unit smaller than the first compression unit based on a remaining endurance of rewriting of the one or more storage devices when read is necessary.

Abstract: A semiconductor memory device includes plural planes each including plural blocks each including a memory cell, a voltage generator which supplies power to the plural planes, an input/output circuit which receives a command set sent from a memory controller to the semiconductor memory device, and a sequencer which executes an operation in response to the command set. Upon receiving a first command set instructing execution of a first operation, the sequencer executes the first operation. Upon receiving a command set instructing operation of a second operation during execution of the first operation, the sequencer executes the first and second operations in parallel. Upon receiving a third command set instructing execution of a third operation during execution of the first operation, the sequencer suspends the first operation, executes the third operation, and resumes the first operation upon completion of the third operation.

Abstract: A semiconductor memory device includes first and second planes of memory cells, and a control circuit configured to perform a write operation on the memory cells to store first and second bits per memory cell, and to perform a first read operation using a first read voltage to read the first bits and a second read operation using second and third read voltages to read the second bits. In response to a first instruction, the control circuit performs the first and second read operations to read the first bits from the first plane and the second bits from the second plane, respectively. In response to a second read instruction, the control circuit performs the second and first read operations to read the second bits from the first plane and the first bits from the second plane, respectively.

Abstract: A storage device includes a processor and an accelerator configured to compress and decompress data. The processor receives first replacement write data for a part of a first logical address region to update first data in the first logical address region that has been compressed by basic compression unit. The processor instructs the accelerator to compress the first replacement write data by a size smaller than the basic compression unit. The accelerator compresses the first replacement write data by the smaller size. The processor merges not-to-be-replaced data in the first logical address region and the first replacement data that are decompressed by the accelerator to generate uncompressed data having a size of the basic compression unit. The processor instructs the accelerator to compress the uncompressed data by the basic compression unit.

Abstract: A storage system with reduced power consumption includes a storage apparatus that saves data in accordance with a data input/output request from a host or outputs the saved data, the storage system including a plurality of components each configured to operate in a first power mode or at least one second lower power mode in a switchable manner, a condition monitoring module monitoring each of the plurality of components, and a power mode control module that determines a power mode of at least one component to be the second power mode, according to a processing load related to each of the plurality of components and which corresponds to a result of monitoring by the condition monitoring module, and operates the at least one particular component in the power saving mode, in which the plurality of components perform mutual control with the storage apparatus in accordance with the data input/output request.

Abstract: A semiconductor memory device according to an embodiment includes a plurality of planes each including a plurality of blocks each including a memory cell, an input/output circuit configured to receive a command set from an external controller, and a sequencer configured to execute an operation in response to the command set. Upon receiving a first command set that instructs execution of a first operation, the sequencer executes the first operation. Upon receiving a second command set that instructs execution of a second operation during execution of the first operation, the sequencer executes the second operation in parallel with the first operation. Upon receiving a third command set that instructs execution of a third operation during execution of the first operation, the sequencer suspends the first operation, executes the third operation, and resumes the first operation upon completion of the third operation.

Abstract: A memory structure including three-dimensional NOR memory strings and method of operation is disclosed. In some embodiments, the memory device implements partial polarization to provide a reference signal for read operation. The reference signal realizes a third logical state distinguishable from the first and second logical stages in the ferroelectric memory transistor, such as associated with the program and erase states. In another embodiment, the memory device provides a reference signal for read operation by averaging a first signal associated with a program state and a second signal associated with an erased state of the ferroelectric memory transistor. In some embodiments, the memory device implements one or more partial polarization states to provide a multi-level memory cell with more than one logical bit stored in each memory cell.

Abstract: A memory circuit includes an array of thin-film ferroelectric memory transistors formed by an array of NOR memory strings intersecting with local word line structures with global word lines arranged orthogonal to the array of NOR memory strings and aligned with a set of local word line structures provided across multiple stacks of NOR memory strings. The memory circuit includes a word line select transistor associated with each local word line structure to isolate each local word line structure from the associated global word line. The word line select transistor, when activated, selectively couples a selected local word line structure to the associated global word line. Remaining local word line structures associated with the same global word line remain disconnected and therefore not selected. In this manner, parasitic capacitance on the global word line is reduced and unintended disturb to other unselected memory transistors is also reduced.

Abstract: A semiconductor memory device includes first and second memory chips, each including a region of a core circuit, a first area adjacent to a first side of the region in a first direction, a second area adjacent to a second side of the region in a second direction, a third area adjacent to the first area in the first direction and to the second area in the second direction, a first pad in the first area, a second pad in the second area, and third pad in the third area. In each memory chip, a first bonding wire connects the first and third pads. In addition, a second bonding wire connects the second pads of the first and second memory chips. The second memory chip is stacked on the first memory chip to expose the first, second, and third areas of the first memory chip in a third direction.

Abstract: A semiconductor memory device according to an embodiment includes a plurality of planes including a plurality of blocks each being a set of memory cells, and a sequencer configured to execute a first operation and a second operation shorter than the first operation. Upon receiving a first command set that instructs execution of the first operation, the sequencer is configured to execute the first operation. Upon receiving a second command set that instructs execution of the second operation while the first operation is being executed, the sequencer is configured to suspend the first operation and execute the second operation or execute the second operation in parallel with the first operation, based on an address of a block that is a target of the first operation and an address of a block that is a target of the second operation.

Abstract: A memory device includes a stacked body of alternately arranged conductor-including layers and insulating films in the first direction and pillar bodies within the stacked body. Each pillar body includes first and second conductive pillars and an insulator pillar located between the first conductive pillar and the second conductive pillar. Each conductor-including layer includes a semiconductor member, an electrode film and a ferroelectric layer provided between the semiconductor member and the electrode film. The semiconductor members in the multiple conductor-including layers are separated from each other in the first direction.

Abstract: A semiconductor memory device according to an embodiment includes a plurality of planes including a plurality of blocks each being a set of memory cells, and a sequencer configured to execute a first operation and a second operation shorter than the first operation. Upon receiving a first command set that instructs execution of the first operation, the sequencer is configured to execute the first operation. Upon receiving a second command set that instructs execution of the second operation while the first operation is being executed, the sequencer is configured to suspend the first operation and execute the second operation or execute the second operation in parallel with the first operation, based on an address of a block that is a target of the first operation and an address of a block that is a target of the second operation.

Abstract: A semiconductor memory device includes first and second planes of memory cells, and a control circuit configured to perform a write operation on the memory cells to store first and second bits per memory cell, and to perform a first read operation using a first read voltage to read the first bits and a second read operation using second and third read voltages to read the second bits. In response to a first instruction, the control circuit performs the first and second read operations to read the first bits from the first plane and the second bits from the second plane, respectively. In response to a second read instruction, the control circuit performs the second and first read operations to read the second bits from the first plane and the first bits from the second plane, respectively.

Abstract: A semiconductor memory device includes first and second planes of memory cells, and a control circuit configured to perform a write operation on the memory cells to store first and second bits per memory cell, and to perform a first read operation using a first read voltage to read the first bits and a second read operation using second and third read voltages to read the second bits. In response to a first instruction, the control circuit performs the first and second read operations to read the first bits from the first plane and the second bits from the second plane, respectively. In response to a second read instruction, the control circuit performs the second and first read operations to read the second bits from the first plane and the first bits from the second plane, respectively.

Abstract: A memory system including a memory device of storage transistors organized in multiple memory banks where the memory device interacts with a controller device to perform read and write operations. In some embodiments, the controller device is configured to issue to the memory device a write command and a write termination command, where the write command causing the memory device to initiate a write operation in the memory device and the write termination command causing the memory device to terminate the write operation. In one embodiment, the controller device issues a write abort command as the write termination command to terminate a write operation in progress at a certain memory bank of the memory device in order to issue a read command to read data from the same memory bank. The terminated write operation can resume after the completion of the read operation.

Abstract: In some embodiments, a memory device implements a tile-based architecture including an arrangement of independently and concurrently operable arrays or tiles of memory transistors where each tile includes memory transistors that are arranged in a three-dimensional array and a localized modular control circuit operating the memory transistors in the tile. The tile-based architecture of the memory device enables concurrent memory access to multiple tiles, which enables independent and concurrent memory operations to be carried out across multiple tiles. The tile-based concurrent access to the memory device has the benefits of increasing the memory bandwidth and lowering the tail latency of the memory device by ensuring high availability of storage transistors.

Abstract: A semiconductor memory device according to an embodiment includes a plurality of planes including a plurality of blocks each being a set of memory cells, and a sequencer configured to execute a first operation and a second operation shorter than the first operation. Upon receiving a first command set that instructs execution of the first operation, the sequencer is configured to execute the first operation. Upon receiving a second command set that instructs execution of the second operation while the first operation is being executed, the sequencer is configured to suspend the first operation and execute the second operation or execute the second operation in parallel with the first operation, based on an address of a block that is a target of the first operation and an address of a block that is a target of the second operation.

Abstract: A semiconductor memory device according to an embodiment includes a plurality of planes including a plurality of blocks each being a set of memory cells, and a sequencer configured to execute a first operation, and a second operation shorter than the first operation. Upon receiving a first command set that instructs execution of the first operation, the sequencer is configured to execute the first operation. Upon receiving a second command set that instructs execution of the second operation while the first operation is being executed, the sequencer is configured to suspend the first operation and execute the second operation or execute the second operation in parallel with the first operation, based on an address of a block that is a target of the first operation and an address of a block that is a target of the second operation.

Abstract: A semiconductor memory device includes first and second memory chips, each including a region of a core circuit, a first area adjacent to a first side of the region in a first direction, a second area adjacent to a second side of the region in a second direction, a third area adjacent to the first area in the first direction and to the second area in the second direction, a first pad in the first area, a second pad in the second area, and third pad in the third area. In each memory chip, a first bonding wire connects the first and third pads. In addition, a second bonding wire connects the second pads of the first and second memory chips. The second memory chip is stacked on the first memory chip to expose the first, second, and third areas of the first memory chip in a third direction.