Abstract: A control device configured to control a supply condition of a gas which is supplied between two substrates that are to be bonded to each other by a substrate bonding device, is configured to control the supply condition based on a measurement result obtained by a measurement in relation to at least one of the substrate, another substrate bonded before the substrate is bonded, or the substrate bonding device, and the two substrates are bonded to each other by a contact region expanding after the contact region is formed in a center.

Abstract: Substrates are aligned and then bonded to each other. A substrate bonding apparatus includes a deformer that deforms at least a first one of two substrates that are to be bonded to each other in order to correct misalignment between the two substrates, a holder that holds the deformed first substrate in the deformed state achieved by the deformer, a transporter that transports the holder from a position at which the deformed first substrate is held by the holder while the first substrate remains deformed, and a bonder that bonds the first substrate that has been transported by the transporter to the second substrate.

Abstract: A substrate holder is reliably transported in a state of holding a substrate. There is provided a substrate holder for holding a substrate by means of electrostatic force generated by power supplied from an external source. The substrate holder is to be transported in a state of holding the substrate. The substrate holder includes a holder body that is to have the substrate placed thereon, and a connector terminal that is externally exposed through the holder body, where the connector terminal is attachable to and detachable from an external power supply terminal. There is also provided a substrate transport apparatus for transporting a substrate holder holding a substrate by means of electrostatic force generated by power supplied from an external source.

Abstract: A substrate separating method includes: holding, in a predetermined position, a substrate sandwiched between a first holder and a second holder opposed to each other; and relatively moving the first holder and the second holder while the substrate is held in the predetermined position. In holding the substrate, the substrate may be held in the predetermined position by effecting a pressurizing force or a suction force onto the substrate. Also in holding the substrate, the substrate may be held in contact with one of the first holder and the second holder.

Abstract: Substrates are aligned and then bonded to each other. A substrate bonding apparatus includes a deformer that deforms at least a first one of two substrates that are to be bonded to each other in order to correct misalignment between the two substrates, a holder that holds the deformed first substrate in the deformed state achieved by the deformer, a transporter that transports the holder from a position at which the deformed first substrate is held by the holder while the first substrate remains deformed, and a bonder that bonds the first substrate that has been transported by the transporter to the second substrate.

Abstract: A substrate holder is reliably transported in a state of holding a substrate. There is provided a substrate holder for holding a substrate by means of electrostatic force generated by power supplied from an external source. The substrate holder is to be transported in a state of holding the substrate. The substrate holder includes a holder body that is to have the substrate placed thereon, and a connector terminal that is externally exposed through the holder body, where the connector terminal is attachable to and detachable from an external power supply terminal. There is also provided a substrate transport apparatus for transporting a substrate holder holding a substrate by means of electrostatic force generated by power supplied from an external source.

Abstract: A substrate holder is reliably transported in a state of holding a substrate. There is provided a substrate holder for holding a substrate by means of electrostatic force generated by power supplied from an external source. The substrate holder is to be transported in a state of holding the substrate. The substrate holder includes a holder body that is to have the substrate placed thereon, and a connector terminal that is externally exposed through the holder body, where the connector terminal is attachable to and detachable from an external power supply terminal. There is also provided a substrate transport apparatus for transporting a substrate holder holding a substrate by means of electrostatic force generated by power supplied from an external source.

Abstract: A substrate separating method includes: holding, in a predetermined position, a substrate sandwiched between a first holder and a second holder opposed to each other; and relatively moving the first holder and the second holder while the substrate is held in the predetermined position. In holding the substrate, the substrate may be held in the predetermined position by effecting a pressurizing force or a suction force onto the substrate. Also in holding the substrate, the substrate may be held in contact with one of the first holder and the second holder.

Abstract: Management of the holding member that holds the semiconductor substrate is efficiently implemented. Provided is a holding member management apparatus that manages a substrate holding member that holds a semiconductor substrate in a manufacturing apparatus that manufactures a stacked semiconductor apparatus by joining a plurality of semiconductor substrates; comprising a history storing part that stores the usage history of the substrate holding member in association with identification information that specifies the substrate holding member and a holding member specifying part that specifies and outputs identification information of the substrate holding member whose usage is to be suspended based on the usage history stored in the history storing part.

Abstract: A substrate holder is reliably transported in a state of holding a substrate. There is provided a substrate holder for holding a substrate by means of electrostatic force generated by power supplied from an external source. The substrate holder is to be transported in a state of holding the substrate. The substrate holder includes a holder body that is to have the substrate placed thereon, and a connector terminal that is externally exposed through the holder body, where the connector terminal is attachable to and detachable from an external power supply terminal. There is also provided a substrate transport apparatus for transporting a substrate holder holding a substrate by means of electrostatic force generated by power supplied from an external source.

Abstract: A linear motion guiding apparatus comprises a guide rail provided with a ball running groove, and a movable block movably arranged along the guide rail through balls. The movable block is provided with a ball running counter-groove, a ball returning passage arranged away from the ball running counter-groove and direction changing passages for connecting these members. A resin-formed body for forming a ball circulation passage comprises a pair of ball passage forming portions, a returning passage forming portion and a pair of direction changing passage-inner guide forming portions. The resin-formed body is separately formed from a body of the movable block.

Abstract: A damping device receiving viscous fluid in an annular gap between a housing and a rotary member within the housing and converting a dynamic energy of the rotary member into a thermal energy is provided. The damping device is constructed to make it possible to move a sealing unit for sealing the annular gap in response to a pressure of the viscous fluid, to change the volume of the annular gap to suppress an adverse affect concomitant with the pressure increase of the viscous fluid to the sealing unit and to enhance reliability and durability of the damping device.

Abstract: A linear motion guiding apparatus comprises a guide rail provided with a ball running groove, and a movable block movably arranged along the guide rail through balls. The movable block is provided with a ball running counter-groove, a ball returning passage arranged away from the ball running counter-groove and direction changing passages for connecting these members. A resin-formed body for forming a ball circulation passage comprises a pair of ball passage forming portions, a returning passage forming portion and a pail of direction changing passage-inner guide forming portions. The resin-formed body is separately formed from a body of the movable block.

Abstract: A linear motion guiding apparatus comprises a guide rail provided with a ball running groove, and a movable block movably arranged along the guide rail through balls. The movable block is provided with a ball running counter-groove, a ball returning passage arranged away from the ball running counter-groove and direction changing passages for connecting these members. A resin-formed body for forming a ball circulation passage comprises a pair of ball passage forming portions, a returning passage forming portion and a pair of direction changing passage-inner guide forming portions. The resin-formed body is separately formed from a body of the movable block.

Abstract: A linear motion guiding apparatus comprises a guide rail provided with a ball running groove, and a movable block movably arranged along the guide rail through balls. The movable block is provided with a ball running counter-groove, a ball returning passage arranged away from the ball running counter-groove and direction changing passages for connecting these members. A resin-formed body for forming a ball circulation passage comprises a pair of ball passage forming portions, a returning passage forming portion and a pair of direction changing passage-inner guide forming portions. The resin-formed body is separately formed from a body of the movable block.