Abstract: A thermal head includes a heat insulating layer made up of an electrically-conductive multiple low oxide ceramic layer of low thermal conductivity made of a chemical compound of Si, plural transition metals and oxygen. A first insulating layer made up of an insulated multiple high nitride ceramic layer of low thermal conductivity made of a chemical compound of at least Si, plural transition metals and nitrogen is formed on the heat insulating layer, and a second insulating layer made up of an SiO2 layer of high insulation characteristics or an Al2O3 layer is formed on the first insulating layer.

Abstract: A thermal head includes a heat insulating layer made up of an electrically-conductive multiple low oxide ceramic layer of low thermal conductivity made of a chemical compound of Si, plural transition metals and oxygen. A first insulating layer made up of an insulated multiple high nitride ceramic layer of low thermal conductivity made of a chemical compound of at least Si, plural transition metals and nitrogen is formed on the heat insulating layer, and a second insulating layer made up of an SiO2 layer of high insulation characteristics or an Al2O3 layer is formed on the first insulating layer.

Abstract: A thermal head includes a heat insulating layer made up of an electrically-conductive multiple low oxide ceramic layer of low thermal conductivity made of a chemical compound of Si, plural transition metals and oxygen. A first insulating layer made up of an insulated multiple high nitride ceramic layer of low thermal conductivity made of a chemical compound of at least Si, plural transition metals and nitrogen is formed on the heat insulating layer, and a second insulating layer made up of an SiO2 layer of high insulation characteristics or an Al2O3 layer is formed on the first insulating layer.

Abstract: In the present invention, with an aim of providing a thermal head capable of being driven with reduced power requirements by preventing the thermal efficiency from being deteriorated due to thermal diffusion, the first embodiment is characterized in that on top of a substrate, there is formed a heat insulating layer made up of an electrically-conductive multiple low oxide ceramic layer of low thermal conductivity made of a chemical compound of Si, plural transition metals and oxygen; and that there are stacked and formed, on top of the heat insulating layer, a first insulating layer made up of an insulated multiple high nitride ceramic layer of low thermal conductivity made of a chemical compound of at least Si, plural transition metals and nitrogen, and on top of the first insulating layer, a second insulating layer made up of an SiO2 layer of high insulation characteristics or an Al2O3 layer.