Abstract: In an electronic device, A heat spreader is adhered to a surface of the substrate on a side opposite to the lower surface of the substrate (hereinafter referred to as “upper surface”) by an adhesive sheet. The heat spreader supports a power transistor cooperatively with the substrate. The power transistor which is an electrical element and the heat spreader are adhered to each other by an adhesive sheet on an adhering surface on a side opposite to an adhering surface where the heat spreader is adhered to the substrate. A bus bar and the power transistor are adhered to each other by an adhesive sheet on an adhering surface on a side opposite to an adhering surface where the power transistor is adhered to the heat spreader. The thermistor is connected to a lead which is a conductive line, and is disposed on an upper surface side of substrate.

Abstract: A semiconductor device includes a substrate made of metal, a first metal wiring disposed above the substrate, a first semiconductor element and a second semiconductor element disposed above the first metal wiring, and a second metal wiring disposed above the first semiconductor element and the second semiconductor element. Furthermore, the semiconductor device includes a plurality of projections disposed in at least one of a space between each of the first semiconductor element and the second semiconductor element, and the first metal wiring, and a space between each of the first semiconductor element and the second semiconductor element, and the second metal wiring.

Abstract: In a method of manufacturing a high-frequency module, a resin substrate with a high frequency circuit including an electronic component mounted thereon is placed so that the electronic component faces a resin bath. A resin which is in a non-flowable state in the resin bath is softened until the resin becomes flowable, and air in space formed between the resin substrate and the resin is sucked. The resin substrate is brought into contact with a liquid surface of the resin. The resin is pressurized and allowed to flow into a gap between the resin substrate and the electronic component. The resin is cured so that a resin portion is formed on the resin substrate. A shield metal film is formed on a surface of the resin portion.

Abstract: In a method for manufacturing a module, a substrate is placed above a resin bath while a electronic component is directed downward. In addition, a resin thrown into the resin bath is softened until it becomes flowable. Then, a first surface of the substrate is brought into contact with a liquid surface of the softened resin. The softened resin is allowed to flow forcibly into a gap between the substrate and the electronic component. Then, the resin cures, and a resin portion is formed. Further, a metal thin film is formed on the surface of the resin portion by sputtering to form the shield metal film.

Abstract: A dielectric filter including a dielectric block having two through bores, an outer conductor covering an outer peripheral surface of the block and one end face of the block, an inner conductor covering an inner periphery of the block, and a pair of input and output electrodes formed on the surface of the block, the other end face of the block being in the form of an open end face having no conductor layer. The pair of input and output electrodes are opposed to each other on one plane, and a dielectric block exposing portion having no conductor layer thereon is formed between the two electrodes. The block is provided in the other end face thereof with one groove dividing the open end face, and an inner surface defining the groove is provided with a conductor layer joined to the outer conductor.

Abstract: The invention provides a dielectric filter comprising a dielectric block having two through bores, an outer conductor covering an outer peripheral surface of the block and one end face of the block, an inner conductor covering an inner periphery of the block, and a pair of input and output electrodes formed on the surface of the block, the other end face of the block being in the form of an open end face having no conductor layer. The pair of input and output electrodes are opposed to each other on one plane, and a dielectric block exposing portion having no conductor layer thereon is formed between the two electrodes. The block is provided in the other end face thereof with one groove dividing the open end face, and an inner surface defining the groove is provided with a conductor layer joined to the outer conductor.

Abstract: The invention provides a dielectric resonator device comprising a coaxial dielectric resonator 2 which comprises a dielectric block 21 having a bore 22 extending therethrough, an outer conductor layer 24 formed on an outer peripheral surface of the dielectric block 21, an inner conductor layer 23 formed on the dielectric block 21 over an inner peripheral surface thereof defining the bore 22, a short-circuiting conductor layer 25 providing a short circuit between the outer conductor layer 24 and the inner conductor layer 23, and a separated conductor layer 3 formed on the outer peripheral surface of the dielectric block 21 and electrically separated from the outer conductor layer 24. The separated conductor layer 3 is connected to the ground by a switch SW, which varies the capacity of the resonator 2 upon switching to alter the resonance frequency thereof.

Abstract: A coaxial resonator which can be electrically connected to an inductance or similar electric element easily to reduce the number of work steps for mounting and the number of parts, and a dielectric filter and a dielectric duplexer which include a resonator and which can be more compact and installed in a diminished space. The coaxial resonator includes a dielectric block having a through-bore extending through opposite end faces thereof, and a conductor layer formed over an outer peripheral surface of the block except one end face thereof and over a block inner surface defining the through-bore for causing electromagnetic waves to resonate within the dielectric block. A lead-equipped electric element has its lead inserted in and fixed in the through-bore and electrically connected to the conductor layer over the bore-defining inner surface with a braze filler metal or electrically conductive adhesive.

Abstract: The invention provides a dielectric resonator device comprising a coaxial dielectric resonator 2 which comprises a dielectric block 21 having a bore 22 extending therethrough, an outer conductor layer 24 formed on an outer peripheral surface of the dielectric block 21, an inner conductor layer 23 formed on the dielectric block 21 over an inner peripheral surface thereof defining the bore 22, a short-circuiting conductor layer 25 providing a short circuit between the outer conductor layer 24 and the inner conductor layer 23, and a separated conductor layer 3 formed on the outer peripheral surface of the dielectric block 21 and electrically separated from the outer conductor layer 24. The separated conductor layer 3 is connected to the ground by a switch SW, which varies the capacity of the resonator 2 upon switching to alter the resonance frequency thereof.

Abstract: The invention provides a coaxial resonator which can be electrically connected to an inductance or like electric element easily to reduce the number of work steps for mounting and the number of parts, and a dielectric filter and a dielectric duplexer which comprise the resonator and which can be compacted and installed in a diminished space. The coaxial resonator comprises a dielectric block having a through bore extending through opposite end faces thereof, and a conductor layer formed over an outer peripheral surface of the block except one end face thereof and over a block inner surface defining the through bore for causing electromagnetic waves to resonate within the dielectric block. A lead-equipped electric element has its lead inserted in the through bore and electrically connected to the conductor layer over the bore-defining inner surface with a braze filler metal or electrically conductive adhesive, the lead being fixed in the through bore.

Abstract: A polar band-pass dielectric filter including three coaxial dielectric resonators each including a main body in the form of a dielectric member, the main body being formed with a through bore extending through opposite end faces thereof, the main body having an outer conductor layer provided over an outer peripheral surface thereof and an inner conductor layer over an inner surface thereof defining the through bore. The resonators are joined to one another with one side of an outer periphery surface of each resonator serving as a joint surface. Each of the resonators has an electrode insulated from the outer conductor layer and provided at a portion of the outer peripheral surface thereof other than the joint surface. The electrodes of the resonators are connected together by a substantially straight conductor member.