Patents by Inventor Masahisa Otsuka

Masahisa Otsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Transfer apparatus and transfer method
    Publication number: 20070087279
    Abstract: There is provided a transfer apparatus 10 which transfers many chips C on a dicing tape DT stretched in a first ring frame 20 to a transfer sheet S stuck in a second ring frame 24. This transfer apparatus 10 is provided with a pressing member 15 which presses the transfer sheet S, and a moving device 16 which supports this pressing member 15. The pressing member 15 is subjected to movement control by the moving device 16 in such a manner that the pressing member 15 presses the transfer sheet S while moving in a circular pattern in a plane.
    Type: Application
    Filed: October 6, 2006
    Publication date: April 19, 2007
    Applicant: LINTEC CORPORATION
    Inventor: Masahisa Otsuka
  • Peeling device and peeling method
    Patent number: 7172673
    Abstract: A peeling device 11 includes an adsorber 15 having an adsorbing face 20A that adsorbs and retains a wafer W, and a peeling element 17 that holds a protective sheet H stuck to the wafer W, and peels off the protective sheet H from the wafer W through moving relatively to the adsorber 15. The adsorber 15 and the peeling element 17 are arranged so as to peel off the protective sheet H from the wafer W intermittently through moving relatively to each other while a peeling operation and a counter-peeling operation are performed alternately.
    Type: Grant
    Filed: January 21, 2005
    Date of Patent: February 6, 2007
    Assignees: Kabushiki Kaisha Toshiba
    Inventors: Tetsuya Kurosawa, Masahisa Otsuka
  • Peeling device and peeling method
    Publication number: 20050205204
    Abstract: A peeling device 11 comprises an adsorber 15 having an adsorbing face 20A that adsorbs and retains a wafer W, and a peeling means 17 that holds a protective sheet H stuck to the wafer W, and peels off the protective sheet H from the wafer W through moving relatively to the adsorber 15. The adsorber 15 and the peeling means 17 are arranged so as to peel off the protective sheet H from the wafer W intermittently through moving relatively to each other while a peeling operation and a counter-peeling operation are performed alternately.
    Type: Application
    Filed: January 21, 2005
    Publication date: September 22, 2005
    Applicants: KABUSHIKI KAISHA TOSHIBA, LINTEC CORPORATION
    Inventors: Tetsuya Kurosawa, Masahisa Otsuka