Patents by Inventor Masahisa Tonegawa

Masahisa Tonegawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Insulating resin composition for multi-layered printed circuit wiring board, multi-layerd printed circuit wiring board using the particular resin composition, and manufacturing the same
    Publication number: 20030044588
    Abstract: Disclosed is a resin composition comprising a thermosetting resin, a thermoplastic resin and a filler. The cured resin of the resin composition has a fine phase separated structure, and the filler is distributed in one of the thermosetting resin rich phase and the thermoplastic resin rich phase. The resin composition of the present invention permits obtaining an insulating layer, which has a high resistance to heat, has a high toughness, is small in thermal deformation, exhibits a high bonding strength with a copper wiring, and permits forming a fine pattern.
    Type: Application
    Filed: March 21, 2002
    Publication date: March 6, 2003
    Applicant: Toppan Printing Co., Ltd.
    Inventors: Kenji Komoto, Masahisa Tonegawa, Koji Murata, Masaaki Chino, Toshie Murai, Toshiaki Hayashi, Noriaki Saito, Satoshi Okamoto