Abstract: A magnesium-based thermoelectric conversion material includes a first layer formed of Mg2Si and a second layer formed of Mg2SixSn1-x (here, x is equal to or greater than 0 and less than 1), in which the first layer and the second layer are directly joined to each other, and within a junction surface with the first layer and in the vicinity of the junction surface, the second layer has a tin concentration transition region in which a tin concentration increases as a distance from the junction surface increases. The junction layer is regarded as a site in which a tin concentration is found to be equal to or lower than a detection limit by the measurement performed using EDX.

Abstract: An insulated heat transfer substrate includes a heat transfer layer formed of aluminum or an aluminum alloy, a conductive layer provided on one surface side of the heat transfer layer, and a glass layer formed between the conductive layer and the heat transfer layer, in which the conductive layer is formed of a sintered body of silver, and a thickness of the glass layer is in a range of 5 ?m or larger and 50 ?m or smaller.

Abstract: A thermoelectric conversion module is a thermoelectric conversion module in which a plurality of thermoelectric conversion elements are electrically connected to each other via a first electrode portion disposed on first end side of the thermoelectric conversion elements and a second electrode portion disposed on the second end side of the thermoelectric conversion elements; a first insulating circuit board provided with a first insulating layer of which at least one surface is made of alumina and the first electrode portion formed of a sintered body of Ag formed on the one surface of the first insulating layer is disposed on the first end side of the thermoelectric conversion elements; and a glass component is present at an interface between the first electrode portion and the first insulating layer.

Abstract: A thermoelectric conversion module includes: a plurality of thermoelectric conversion elements; a first electrode portion disposed on one end side of the plurality of thermoelectric conversion elements; and a second electrode portion disposed on the other end side of the plurality of thermoelectric conversion elements, a first insulating circuit board provided with a first insulating layer and the first electrode portion made of copper or a copper alloy formed on one surface of the first insulating layer is disposed on one end side of the thermoelectric conversion elements, a Ag plating layer is directly formed on a surface of the first electrode portion opposite to the first insulating layer, a Ni layer is not present between the first electrode portion and the Ag plating layer, and the Ag plating layer and the thermoelectric conversion element are bonded to each other via a sintered body of Ag.

Abstract: An insulated heat transfer substrate includes a heat transfer layer formed of aluminum or an aluminum alloy, a conductive layer provided on one surface side of the heat transfer layer, and a glass layer formed between the conductive layer and the heat transfer layer, in which the conductive layer is formed of a sintered body of silver, and a thickness of the glass layer is in a range of 5 ?m or larger and 50 ?m or smaller.

Abstract: A method of manufacturing a ceramics-metal bonded body according to the present invention is a method of manufacturing a ceramics-metal bonded body in which a metal layer is bonded to at least one surface of a ceramics substrate, and comprises: a groove-forming step of forming a groove extending across a bonding region of a ceramics substrate to which a metal layer is bonded; and a bonding step of, after the groove-forming step, forming a metal layer by stacking, in the bonding region of the ceramics substrate, a metal plate of an aluminum or aluminum alloy with a thickness of less than or equal to 0.4 mm, via an Al—Si based brazing material foil, and bonding the metal plate to the bonding region by heating while applying load in a stacking direction.

Abstract: A thermoelectric conversion module includes thermoelectric conversion elements, and a first insulating circuit board provided with a first insulating layer and a first electrode part formed on one surface of the first insulating layer is disposed on one end side of the thermoelectric conversion elements. The first electrode part includes a first aluminum layer made of aluminum or an aluminum alloy, and a first sintered silver layer which is formed on a surface of the first aluminum layer on a side opposite to the first insulating layer and is formed of a sintered body of silver. The first aluminum layer has a thickness in a range of 50 ?m or more and 2000 ?m or less. The first sintered silver layer has a thickness of 5 ?m or more and a porosity of less than 10% at least in a region where the thermoelectric conversion element is disposed.

Abstract: Provided is a method for manufacturing a metal-layer-joined ceramic base material board, in which at least one scribe line is formed, on each of the front and back surfaces of a ceramic base material board, along dividing lines for dividing the ceramic base material board into a plurality of ceramic boards, a metal board covering at least a portion of the dividing lines is joined to each of the front and back surface of the ceramic base material board, the metal boards are etched along the dividing lines to form a plurality of metal layers, and the plurality of metal layers are joined to each of the front and back surfaces of the ceramic base material board.

Abstract: A magnesium-based thermoelectric conversion material includes a first layer formed of Mg2Si and a second layer formed of Mg2SixSn1-x (here, x is equal to or greater than 0 and less than 1), in which the first layer and the second layer are directly joined to each other, and within a junction surface with the first layer and in the vicinity of the junction surface, the second layer has a tin concentration transition region in which a tin concentration increases as a distance from the junction surface increases. The junction layer is regarded as a site in which a tin concentration is found to be equal to or lower than a detection limit by the measurement performed using EDX.

Abstract: Provided is a method for manufacturing a metal-layer-joined ceramic base material board, in which at least one scribe line is formed, on each of the front and back surfaces of a ceramic base material board, along dividing lines for dividing the ceramic base material board into a plurality of ceramic boards, a metal board covering at least a portion of the dividing lines is joined to each of the front and back surface of the ceramic base material board, the metal boards are etched along the dividing lines to form a plurality of metal layers, and the plurality of metal layers are joined to each of the front and back surfaces of the ceramic base material board.

Abstract: A thermoelectric conversion module is a thermoelectric conversion module in which a plurality of thermoelectric conversion elements are electrically connected to each other via a first electrode portion disposed on first end side of the thermoelectric conversion elements and a second electrode portion disposed on the second end side of the thermoelectric conversion elements; a first insulating circuit board provided with a first insulating layer of which at least one surface is made of alumina and the first electrode portion formed of a sintered body of Ag formed on the one surface of the first insulating layer is disposed on the first end side of the thermoelectric conversion elements; and a glass component is present at an interface between the first electrode portion and the first insulating layer.

Abstract: A thermoelectric conversion module in which a plurality of P-type thermoelectric conversion elements and N-type thermoelectric conversion elements, which are combined in pairs, are connected in series between a pair of opposing wiring substrates via the wiring substrates: electrode parts to which the thermoelectric conversion elements are connected, are formed on surfaces of ceramic substrates of the wiring substrates: among the thermoelectric conversion elements, the thermoelectric conversion element having a larger thermal expansion coefficient has the length, in a direction in which the wiring substrates face each other, that is smaller than the length, in a direction in which the wiring substrates face each other, of the thermoelectric conversion element having a smaller thermal expansion coefficient: an electrically conductive spacer is interposed between at least one of the two ends of the thermoelectric conversion element having a larger thermal expansion coefficient and the ceramic substrate of the wi

Abstract: A thermoelectric conversion module has: a plurality of thermoelectric conversion elements including a P-type thermoelectric conversion element and an N-type thermoelectric conversion element having differing linear expansion coefficients; and a first wiring board arranged at one end side of the plurality of thermoelectric conversion elements, the first wiring board having: first wiring layers in which the adjacent P-type thermoelectric conversion element and N-type thermoelectric conversion element are joined; and first ceramic layers joined to the surface of the first wiring layers which are opposite to a joined surface to which the P-type thermoelectric conversion elements and the N-type thermoelectric conversion elements are joined, and multiply separated, the first ceramic layers being separated between any pair of the P-type thermoelectric conversion element and the N-type thermoelectric conversion element.

Abstract: A thermoelectric conversion cell is provided with: an insulating member having a through hole, a female threaded portions (insulation-side threaded portion) at both end parts, respectively, of the through hole in the through-direction; a thermoelectric conversion member which has a thermoelectric conversion element (P-type thermoelectric conversion element), and is accommodated within the through hole; and electrode members coupled at the end parts, respectively, of the insulating member, and which have male threaded portions (electrode-side threaded portion) corresponding to the female threaded portions, and electrode parts electrically connected to the end part of the thermoelectric conversion member inside the through hole.

Abstract: In an aluminum material that constitutes a bonding surface of a metal layer, and an aluminum material that constitutes a bonding surface of a heat sink, any one aluminum material is set to a high-purity aluminum material with high aluminum purity, and the other aluminum material is set to a low-purity aluminum material with low aluminum purity. The difference in a concentration of a contained element other than Al between the high-purity aluminum material and the low-purity aluminum material is set to 1 at % or greater, and the metal layer and the heat sink are subjected to solid-phase diffusion bonding.

Abstract: A thermoelectric conversion module which is obtained by connecting a plurality of thermoelectric conversion elements via a pair of wiring substrates facing each other in such a state that the thermoelectric conversion elements are combined with each other between the wiring substrates: each of the wiring substrates is obtained by forming an electrode layer on one surface of a ceramic substrate, the electrode layer being connected to the thermoelectric conversion elements and being formed of aluminum or an aluminum alloy: at least the electrode layer that is arranged on the high-temperature side is provided with a silver base layer, in which a glass layer and a silver layer are laminated in the surface; and the silver layer of the silver base layer is bonded to the thermoelectric conversion elements.

Abstract: A thermoelectric conversion module in which a plurality of P-type thermoelectric conversion elements and N-type thermoelectric conversion elements, which are combined in pairs, are connected in series between a pair of opposing wiring substrates via the wiring substrates: electrode parts to which the thermoelectric conversion elements are connected, are formed on surfaces of ceramic substrates of the wiring substrates: among the thermoelectric conversion elements, the thermoelectric conversion element having a larger thermal expansion coefficient has the length, in a direction in which the wiring substrates face each other, that is smaller than the length, in a direction in which the wiring substrates face each other, of the thermoelectric conversion element having a smaller thermal expansion coefficient: an electrically conductive spacer is interposed between at least one of the two ends of the thermoelectric conversion element having a larger thermal expansion coefficient and the ceramic substrate of the wi

Abstract: A thermoelectric conversion cell is provided with: an insulating member having a through hole, a female threaded portions (insulation-side threaded portion) at both end parts, respectively, of the through hole in the through-direction; a thermoelectric conversion member which has a thermoelectric conversion element (P-type thermoelectric conversion element), and is accommodated within the through hole; and electrode members coupled at the end parts, respectively, of the insulating member, and which have male threaded portions (electrode-side threaded portion) corresponding to the female threaded portions, and electrode parts electrically connected to the end part of the thermoelectric conversion member inside the through hole.

Abstract: The resistor includes a chip resistive element which includes a resistive element and metal electrodes and which is formed on first surface of a ceramic substrate, metal terminals electrically joined to the metal electrodes, and an Al member formed on the second surface side of the ceramic substrate, wherein the ceramic substrate and the Al member are joined using an Al—Si-based brazing filler metal, the metal electrodes and the metal terminals are joined to each other using a solder, and a degree of bending of an opposite surface of the Al member opposite to a surface on the ceramic substrate side is in a range of ?30 ?m/50 mm to 700 ?m/50 mm.

Abstract: A light-emitting module with a cooler of the present invention includes a circuit layer which is formed on one surface side of an insulating layer and in which a light-emitting element is mounted, and a metal layer and a cooler which are laminated in order on the other surface side of the insulating layer. The circuit layer is formed of Cu, Al, or an alloy thereof and has a thickness of 0.1 mm or less. The metal layer and the cooler are formed of Al or an Al alloy. The metal layer and the cooler are directly bonded to each other. The ratio of the area of the light-emitting element to the area of the one surface of the insulating layer is within a range from 1:20 to 1:400.