Abstract: A hybrid sensor shift platform for an optical image stabilization (OIS) actuator mechanism in compact camera modules includes two or more substrates. A top substrate is composed of an organic material (e.g., a resin) to reduce mass, reduce magnetic interaction with permanent magnets, and improve reliability. One or more lower substrates of the hybrid sensor shift platform are ceramic substrates that provide the benefits of ceramics for connection to the image sensor. The organic substrate is connected via a solder bond process to the lower ceramic substrate(s). The connection between the substrates is reinforced with an under-fill of epoxy that surrounds the solder bonds, thus creating a full interface between the substrates within the overlap.

Abstract: A hybrid sensor shift platform for an optical image stabilization (OIS) actuator mechanism in compact camera modules includes two or more substrates. A top substrate is composed of an organic material (e.g., a resin) to reduce mass, reduce magnetic interaction with permanent magnets, and improve reliability. One or more lower substrates of the hybrid sensor shift platform are ceramic substrates that provide the benefits of ceramics for connection to the image sensor. The organic substrate is connected via a solder bond process to the lower ceramic substrate(s). The connection between the substrates is reinforced with an under-fill of epoxy that surrounds the solder bonds, thus creating a full interface between the substrates within the overlap.

Abstract: An apparatus includes a substrate, a first conductive pad and a second conductive pad, both disposed on the substrate, an electrically conductive trace, and a fusible alloy layer. The electrically conductive trace is laid out between the first and second pads, and is configured to conduct electrical current between the first and second pads, and has a serpentine pattern having multiple bends. The fusible alloy layer is disposed on the first pad and over a portion of the trace including no more than a predefined number of the bends.

Abstract: An apparatus includes a substrate, a first conductive pad and a second conductive pad, both disposed on the substrate, an electrically conductive trace, and a fusible alloy layer. The electrically conductive trace is laid out between the first and second pads, and is configured to conduct electrical current between the first and second pads, and has a serpentine pattern having multiple bends. The fusible alloy layer is disposed on the first pad and over a portion of the trace including no more than a predefined number of the bends.

Abstract: A light-emitting-element mounting package includes a substrate including front and back surfaces, a lead pin disposed at the back surface of the substrate, and a ceramic plate including an opposing front surface that opposes the back surface of the substrate and an opposing back surface. The substrate has a first through hole that extends therethrough. The ceramic plate has a second through hole that extends therethrough. Conductive portions extend continuously within the second through hole and around openings of the second through hole in the opposing front and back surfaces. A flange portion of the lead pin is joined to the conductive portion at the opposing back surface. A conductive member is joined to the conductive portion at the opposing front surface. The ceramic plate is joined to the back surface of the substrate with a portion of the conductive member disposed in the first through hole.

Abstract: A light-emitting-element mounting package includes a substrate and a frame that are each made of a metal. The substrate includes a front surface and a back surface that oppose each other, and is provided with a mounting portion for a light emitting element at the front surface. The frame stands on the front surface of the substrate and includes an inner side surface that surrounds the mounting portion and an outer side surface. A substrate-side end portion of the frame includes a curved inclined surface (inclined portion) in a region near the outer side surface. The curved inclined surface is inclined toward a center of the frame in a thickness direction. A silver solder (joining material) is provided between the front surface of the substrate and the frame.

Abstract: A light-emitting device mounting package includes a substrate, a frame extending upward from the substrate and surrounding a mounting portion, a lead plate supported on the frame, and a ceramic plate having a facing front surface and a facing back surface on the opposite side. The frame has a first through hole through which the lead terminal extends. The ceramic plate has a second through hole, and a metalized layer formed on the facing front surface such that the metalized layer is spaced from an opening of the second through hole. The lead plate penetrates the first and second through holes and is fixed, via a collar portion, to a region of the facing back surface around an opening of the second through hole on the facing back surface side. The insulating member is fixed to a region around the first through hole via the metalized layer.

Abstract: Disclosed is a wiring board having at least one insulating layer and at least one wiring layer arranged to overlap the insulating layer. The insulating layer includes: an arrangement portion at which the wiring layer is arranged; and a side wall portion which surrounds at least a part of the wiring layer arranged at the arrangement portion in a plane direction. The side wall portion has a planar shape that restricts movement and rotation of the wiring layer in the plane direction.

Abstract: Disclosed is a wiring board having: a plurality of insulating layers including a first insulating layer, a second insulating layer opposed to the first insulating layer and at least one intermediate insulating layer located between the first insulating layer and the second insulating layer; at least two wiring layers each located between adjacent two of the insulating layers; and a side surface insulating part covering at least a side surface of the at least one intermediate insulating layer and facing side surfaces of the at least two wiring layers. Each of the first and second insulating layers has an extension portion formed on at least a part of a periphery thereof and extending outwardly of the at least one intermediate insulating layer in a plane direction. The side surface insulating part is arranged between the extension portions of the first and second insulating layers.

Abstract: Disclosed is a wiring board having a plurality of insulating layers and at least one wiring layer each formed between adjacent two of the plurality of insulating layers such that, when a cross section of the wiring layer is taken in parallel to a thickness direction, at least one corner portion of the cross section of the wiring layer is rounded.

Abstract: The present disclosure provides a wiring board including at least one insulating layer that has a front surface and a back surface, a first wiring layer that is disposed on a front surface side of the at least one insulating layer, a second wiring layer that is disposed on a back surface side of the insulating layer where the first wiring layer is disposed, and a connection conductor that electrically connects the first wiring layer and the second wiring layer to each other. The insulating layer has a through hole that extends through the insulating layer in a thickness direction. The connection conductor includes a metal member that is disposed in the through hole, and a joining portion that covers at least a part of an outer surface of the metal member and that joins the metal member to the first wiring layer and to the second wiring layer.

Abstract: A wiring board includes at least one insulating layer that has a front surface and a back surface, a first wiring layer that is disposed on a front surface side of the at least one insulating layer, a second wiring layer that is disposed on a back surface side of the insulating layer where the first wiring layer is disposed, and a connection conductor that electrically connects the first wiring layer and the second wiring layer to each other. Of the first wiring layer and the second wiring layer, at least the first wiring layer includes an unfixing region that is not fixed to the insulating layer.

Abstract: A light-emitting-element mounting package includes a substrate and a frame that are each made of a metal. The substrate includes a front surface and a back surface that oppose each other, and is provided with a mounting portion for a light emitting element at the front surface. The frame stands on the front surface of the substrate and includes an inner side surface that surrounds the mounting portion and an outer side surface. A substrate-side end portion of the frame includes a curved inclined surface (inclined portion) in a region near the outer side surface. The curved inclined surface is inclined toward a center of the frame in a thickness direction. A silver solder (joining material) is provided between the front surface of the substrate and the frame.

Abstract: A light-emitting-element mounting package includes a substrate including front and back surfaces, a lead pin disposed at the back surface of the substrate, and a ceramic plate including an opposing front surface that opposes the back surface of the substrate and an opposing back surface. The substrate has a first through hole that extends therethrough. The ceramic plate has a second through hole that extends therethrough. Conductive portions extend continuously within the second through hole and around openings of the second through hole in the opposing front and back surfaces. A flange portion of the lead pin is joined to the conductive portion at the opposing back surface. A conductive member is joined to the conductive portion at the opposing front surface. The ceramic plate is joined to the back surface of the substrate with a portion of the conductive member disposed in the first through hole.

Abstract: A light-emitting device mounting package includes a substrate, a lead pin supported on the substrate, and an insulating member having a facing front surface which faces the front surface of the substrate and a facing back surface. The substrate has a first through hole and the ceramic plate has a second through hole. The lead pin has a shaft portion which penetrates the first and second through holes, a head portion provided at one end of the shaft portion, and a collar portion which extends from the shaft portion in the radial direction. The lead pin is fixed, via the collar portion, to a region of the facing back surface of the ceramic plate around an opening of the second through hole, and the ceramic plate is fixed to a region of the front surface of the substrate around an opening of the first through hole.

Abstract: A light-emitting device mounting package includes a substrate, a frame extending upward from the substrate and surrounding a mounting portion, a lead plate supported on the frame, and a ceramic plate having a facing front surface and a facing back surface on the opposite side. The frame has a first through hole through which the lead terminal extends. The ceramic plate has a second through hole, and a metalized layer formed on the facing front surface such that the metalized layer is spaced from an opening of the second through hole. The lead plate penetrates the first and second through holes and is fixed, via a collar portion, to a region of the facing back surface around an opening of the second through hole on the facing back surface side. The insulating member is fixed to a region around the first through hole via the metalized layer.

Abstract: A light-emitting device mounting package includes a substrate, a lead pin supported on the substrate, and an insulating member having a facing front surface which faces the front surface of the substrate and a facing back surface. The substrate has a first through hole and the ceramic plate has a second through hole. The lead pin has a shaft portion which penetrates the first and second through holes, a head portion provided at one end of the shaft portion, and a collar portion which extends from the shaft portion in the radial direction. The lead pin is fixed, via the collar portion, to a region of the facing back surface of the ceramic plate around an opening of the second through hole, and the ceramic plate is fixed to a region of the front surface of the substrate around an opening of the first through hole.

Abstract: There is provided molybdenum oxide for an active material of an electricity storage device having excellent rate characteristics and structural stability. A turbostratic material 1 has a turbostratic structure composed of a plurality of nanosheets 2, where the nanosheets have the composition MoO2.

Abstract: A wiring board including a board main body made of an insulating material and having a front surface and rear surface and side surfaces at four sides located between the front and the rear surfaces, and a wiring conductor for plating, an end surface of which is exposed on any side surface of the board main body, wherein the wiring board includes a first insulating layer formed on the side surface on which the end surface of the wiring conductor for plating is exposed to cover the end surface, and a conductor layer formed on the side surface of the board main body on which the first insulating layer is formed along a side direction of the side surface including a surface of the first insulating layer, and wherein the conductor layer is electrically connected to a ground layer formed inside the board main body.

Abstract: There is provided molybdenum oxide for an active material of an electricity storage device having excellent rate characteristics and structural stability. A turbostratic material 1 has a turbostratic structure composed of a plurality of nanosheets 2, where the nanosheets have the composition MoO2.