Abstract: In a vacuum heat insulating double walled container 1, adsorbent blocks 30 are formed in block, and each of the adsorbent blocks 30 disposed on the peripheral surface of a sample storage container 25 is placed on a partition plate 27. Moreover, an inner container 10 is hang in an outer container 3 using a connecting tube 20 formed of a thin material having an uneven outer peripheral surface, and a heat insulating tube 40 is disposed on the inner surface of the connecting tube 20. Further, as to a workpiece carrier 50 as a fixing device, a carrier guide 52 is in close contact with the heat insulating tube 40, and a plate-like portion 54 and a workpiece storage portion 51 are disposed in a non-contact state with respect to the sample storage container 25.

Abstract: To provide a stack-type wire mount wafer connector and a connector assembly that can reduce the number of components and the size, and can enhance operability of insertion and removal. A latch portion 25 that is integrally formed with a wafer 40 and extends along a second side surface 46a of the wafer 40, at least one protrusion 47b extending outward along a Z-axis direction of the wafer 40 from a first base portion 47 of the wafer, and at least one opening portion into which the protrusion 47b of another stack-type wire mount wafer connector 20 is to be inserted are included. When the protrusion 47b of another stack-type wire mount wafer connector 20 is inserted into the opening portion of the stack-type wire mount wafer connector 20, shifting between the stack-type wire mount wafer connector 20 and another stack-type wire mount wafer connector 20 in a fitting direction (X-axis direction) of a fitting connector is prevented.

Abstract: To provide a stack-type wire mount wafer connector and a connector assembly that can reduce the number of components and the size, and can enhance operability of insertion and removal. A latch portion 25 that is integrally formed with a wafer 40 and extends along a second side surface 46a of the wafer 40, at least one protrusion 47b extending outward along a Z-axis direction of the wafer 40 from a first base portion 47 of the wafer, and at least one opening portion into which the protrusion 47b of another stack-type wire mount wafer connector 20 is to be inserted are included. When the protrusion 47b of another stack-type wire mount wafer connector 20 is inserted into the opening portion of the stack-type wire mount wafer connector 20, shifting between the stack-type wire mount wafer connector 20 and another stack-type wire mount wafer connector 20 in a fitting direction (X-axis direction) of a fitting connector is prevented.

Abstract: A simple structure socket 10 for connecting a ball grid array integrated circuit device to a test circuit has a base 14, contacts 26 arranged corresponding to the ball grid array, a nest assembly 16 of two comb structures 70 and a lever assembly 18 for spacing opposed tip portions of each contact away from each other to define a gap for receiving a ball. The lever assembly has two rectangular frames 86 each made of a distal cross piece 94, a proximal cross piece and two side pieces connecting the distal and proximal cross pieces. The two rectangular frames are arranged so that the side pieces are intersected at substantially mid portions thereof. This allows that, by depressing the proximal cross pieces toward the base, the distal cross pieces forces the comb structures toward each other.

Abstract: A simple structure socket 10 for connecting a ball grid array integrated circuit device to a test circuit has a base 14, contacts 26 arranged corresponding to the ball grid array, a nest assembly 16 of two comb structures 70 and a lever assembly 18 for spacing opposed tip portions of each contact away from each other to define a gap for receiving a ball. The lever assembly has two rectangular frames 86 each made of a distal cross piece 94, a proximal cross piece and two side pieces connecting the distal and proximal cross pieces. The two rectangular frames are arranged so that the side pieces are intersected at substantially mid portions thereof. This allows that, by depressing the proximal cross pieces toward the base, the distal cross pieces forces the comb structures toward each other.

Abstract: A simple structure socket 10 for connecting a ball grid array integrated circuit device to a test circuit has a base 14, contacts 26 arranged corresponding to the ball grid array, a nest assembly 16 of two comb structures 70 and a lever assembly 18 for spacing opposed tip portions of each contact away from each other to define a gap for receiving a ball. The lever assembly has two rectangular frames 86 each made of a distal cross piece 94, a proximal cross piece and two side pieces connecting the distal and proximal cross pieces. The two rectangular frames are arranged so that the side pieces are intersected at substantially mid portions thereof. This allows that, by depressing the proximal cross pieces toward the base, the distal cross pieces forces the comb structures toward each other.

Abstract: It is an object of the present invention to provide an IC socket that has a configuration to promote heat dissipation from an IC device in a simple configuration, and prevent overheating of the IC device under test. Contact pins 6c, similar to the contact pins 6a and 6b, are disposed in regions not corresponding to the signal balls 51 and the thermal balls 52 of the BGA device 5. Further, the contact pins 6c and the second contact pins 6b that are contacted to the thermal balls 52 are thermally connected to each other via a heat spreader.

Abstract: A simple structure socket 10 for connecting a ball grid array integrated circuit device to a test circuit has a base 14, contacts 26 arranged corresponding to the ball grid array, a nest assembly 16 of two comb structures 70 and a lever assembly 18 for spacing opposed tip portions of each contact away from each other to define a gap for receiving a ball. The lever assembly has two rectangular frames 86 each made of a distal cross piece 94, a proximal cross piece and two side pieces connecting the distal and proximal cross pieces. The two rectangular frames are arranged so that the side pieces are intersected at substantially mid portions thereof. This allows that, by depressing the proximal cross pieces toward the base, the distal cross pieces forces the comb structures toward each other.

Abstract: A control apparatus for an air conditioning system has an outdoor unit with a compressor, a condenser and a plurality of motorized valves installed to a plurality of branch pipings. A plurality of indoor units having, a plurality of indoor thermoswitches, a microcomputer, and a drive circuit for driving the motorized valves according to the output from the microcomputer are also provided for the control apparatus. The microcomputer counts the number of indoor units required for operation by receiving the output from the indoor thermoswitch. The microcomputer also controls the opening of the motorized valves by predetermined opening steps, according to the result of the counting and with reference to an opening table. The opening table relates the number of indoor units required for operation with the opening of each of the motorized valves. The control apparatus thus permits an optimum distribution of refrigerant to the indoor units to be set quickly.