Abstract: There is provided an electronic device manufacturing method capable of manufacturing a device having a preferable communication characteristic at a low cost with a high productivity. The manufacturing method is for manufacturing an electronic device including a plurality of IC chips 100, each having external electrodes formed on a pair of opposing surfaces. One 102 of the electrodes is arranged on an antenna circuit 201 in a transmission/reception antenna having a slit. Furthermore, a bridging plate 300 is arranged for separately and electrically connecting the other external electrode 103 to a predetermined position of the corresponding antenna circuit 301. The method is characterized in that by positioning at least one of the IC chips 100 with the predetermined position on the corresponding antenna circuit 201 to be mounted, it is possible to arrange the retraining IC chips 100 at the predetermined positions on the antenna circuit 201 all at once.

Abstract: There is provided an electronic device manufacturing method capable of manufacturing a device having a preferable communication characteristic at a low cost with a high productivity. The manufacturing method is for manufacturing an electronic device including a plurality of IC chips 100, each having external electrodes formed on a pair of opposing surfaces. One 102 of the electrodes is arranged on an antenna circuit 201 in a transmission/reception antenna having a slit. Furthermore, a bridging plate 300 is arranged for separately and electrically connecting the other external electrode 103 to a predetermined position of the corresponding antenna circuit 301. The method is characterized in that by positioning at least one of the IC chips 100 with the predetermined position on the corresponding antenna circuit 201 to be mounted, it is possible to arrange the retraining IC chips 100 at the predetermined positions on the antenna circuit 201 all at once.

Abstract: To provide a method of producing an electronic apparatus that is inexpensive, contributes to high productivity, and can achieve good communication characteristics. A method of producing an electronic apparatus composed of an IC chip (100) having an external electrode formed on each of a set of opposing surfaces of the IC chip; an antenna circuit (201) having a slit formed in it; and a short circuit plate (300) for electrically connecting the IC chip (100) and the antenna circuit (201). In the method, a disc-like conveyor (703) has hands (704) on its outer periphery, and each hand (704) is capable of holding a single IC chip (100). The hands (704) hold IC chips (100) individually, and the IC chips (100) are conveyed by rotation of the disc-like conveyor (703). As a result, a plurality of IC chips (100) whose maximum number is equal to the number of the hands (704) can be simultaneously conveyed.

Abstract: Disclosed is an electronic device comprising an IC element 10, a first circuit layer 20 on the surface of which is formed an antenna circuit 21 composed of a conductive layer, and a second circuit layer 30 on the surface of which is formed a conductive layer 31. The IC element 10 comprises a base substrate 11 composed of silicon, a semiconductor circuit layer 12 formed on one side of the base substrate 11 in which layer a semiconductor circuit is formed, and an electrode 13 formed on the semiconductor circuit layer 12. The first circuit layer 20 is connected to either the other side of the base substrate 11 or the electrode 13, and the second circuit layer 30 is electrically connected to either that same other side of the base substrate 11 or the electrode 13 which ever is not connected to the first circuit layer 20. Consequently the electronic device can be efficiently produced at low-cost while achieving good communications properties.

Abstract: To provide a method of producing an electronic apparatus that is inexpensive, contributes to high productivity, and can achieve good communication characteristics. A method of producing an electronic apparatus composed of an IC chip (100) having an external electrode formed on each of a set of opposing surfaces of the IC chip; an antenna circuit (201) having a slit formed in it; and a short circuit plate (300) for electrically connecting the IC chip (100) and the antenna circuit (201). In the method, a disc-like conveyor (703) has hands (704) on its outer periphery, and each hand (704) is capable of holding a single IC chip (100). The hands (704) hold IC chips (100) individually, and the IC chips (100) are conveyed by rotation of the disc-like conveyor (703). As a result, a plurality of IC chips (100) whose maximum number is equal to the number of the hands (704) can be simultaneously conveyed.

Abstract: A method of manufacturing an electronic device comprising IC elements 10, on a set of opposite faces of which a first electrode 12 and a second electrode 13 are formed, a first circuit layer 20 where an antenna circuit 21 having a slit 1 is formed, and a second circuit layer 30 for electrically connecting the IC elements 10 and the antenna circuit 21. The IC elements 10 are placed individually in cutouts 74, into each of which one IC element 10 can be inserted, the cutouts being formed in the outer circumference of a disk-like carrier 70. Thus, with the method, an electronic device that is inexpensive and is manufactured with high productivity, and has improved communication characteristics is manufactured.