Patents by Inventor Masaji Homma

Masaji Homma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for producing printed wiring board
    Patent number: 4790894
    Abstract: A base board having a plurality of semicircular through-holes filled with solder at side walls produced by filling through-holes with solder can be connected electrically to printed circuit boards with large connecting strength and high reliability.
    Type: Grant
    Filed: May 6, 1987
    Date of Patent: December 13, 1988
    Assignee: Hitachi Condenser Co., Ltd.
    Inventors: Masaji Homma, Hitoshi Yamauchi
  • Method of making printed circuit board
    Patent number: 4268614
    Abstract: A novel circuit board in which circuit portions including pad portions, through-hole portions and conductors are formed, at least at the pad portions and the through-hole portions of the circuit, in the vacant portions defined by a cured photopolymeric resin composition and the vacant portions are plated with electroless copper. When only the pad portions and through-hole portions are plated with electroless copper, the conductors are all covered with the resin composition, thereby enabling fears of mechanical and chemical damages to be eliminated. When all the circuit portions are plated with electroless copper, the amount of copper required can be considerably reduced.
    Type: Grant
    Filed: December 7, 1978
    Date of Patent: May 19, 1981
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Tamotsu Ueyama, Yukihiko Wada, Masaji Homma, Hitoshi Aisawa, Takayoshi Komatsu, Tatsuhisa Shibata, Hiroharu Kamiyama