Patents by Inventor Masaji Komori
Masaji Komori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240132432Abstract: Provided is a compound represented by Formula (1A) below wherein the symbols are as defined in the description: Also disclosed are a composition containing at least one of the compound and a formed article of the compound.Type: ApplicationFiled: December 18, 2023Publication date: April 25, 2024Applicants: Kyoto University, DAIKIN INDUSTRIES, LTD.Inventors: Tomoki OGOSHI, Katsuto ONISHI, Shuhei YAMAGUCHI, Yuko SHIOTANI, Masaji KOMORI, Hirokazu AOYAMA, Yosuke KISHIKAWA, Akiyoshi YAMAUCHI
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Patent number: 11963297Abstract: A fluororesin composition containing a melt moldable fluororesin and a silica, wherein the fluororesin has 25 or more carbonyl group-containing functional groups per 106 main-chain carbon atoms; the silica is a spherical silica; and the fluororesin composition has a linear expansion coefficient of 100 ppm/° C. or lower. Also disclosed is a fluororesin sheet including the fluororesin composition, a laminate including a copper foil layer and a layer including the fluororesin composition and a substrate for circuits including a copper foil layer and a layer including the fluororesin composition.Type: GrantFiled: December 24, 2019Date of Patent: April 16, 2024Assignee: DAIKIN INDUSTRIES, LTD.Inventors: Hirokazu Komori, Hiroyuki Yoshimoto, Masaji Komori, Yuki Ueda, Junpei Terada
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Patent number: 11939450Abstract: A resin composition for a circuit board, containing a melt-fabricable fluororesin and a particulate boron nitride. The particulate boron nitride has a ratio (b)/(a) of 1.0 or higher, wherein (a) represents a proportion of particles having a particle size of 14.6 to 20.6 ?m and (b) represents a proportion of particles having a particle size of 24.6 to 29.4 ?m. Also disclosed is a molded article for a circuit board obtained from the resin composition, a laminate for a circuit board including a metal layer (A1) and a layer (B) obtained from the resin composition, and a circuit board including a metal layer (A2) and a layer (B) obtained from the resin composition.Type: GrantFiled: January 14, 2022Date of Patent: March 26, 2024Assignee: DAIKIN INDUSTRIES, LTD.Inventors: Hirofumi Mukae, Hirokazu Komori, Masaji Komori, Hideki Kono, Ayane Nakaue
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Publication number: 20230357553Abstract: A housing for a livestock sensor, the housing including: a resin having a coefficient of kinetic friction of 0.40 or lower and a coefficient of static friction of 0.10 or lower, and the resin being other than polytetrafluoroethylene. Also disclosed is a livestock sensor including the housing and a detector inside the housing.Type: ApplicationFiled: June 7, 2023Publication date: November 9, 2023Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Toshiyuki FUKUSHIMA, Hirofumi Mukae, Kenji Ishii, Yoshito Tanaka, Masaji Komori, Takumi Shimosuki, Akiyoshi Yamauchi, Yosuke Kishikawa, Hirokazu Aoyama
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Publication number: 20230312777Abstract: A seal for a livestock sensor containing a resin, or a rubber free from a chlorine atom. The seal is at least one selected from a packing, an O-ring, and a gasket, and the seal is configured to prevent a body fluid containing an organic acid in livestock from entering a space that contains a detecting portion or a substrate of the livestock sensor. Also disclosed is a livestock sensor including the seal.Type: ApplicationFiled: June 7, 2023Publication date: October 5, 2023Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Kenji ISHII, Yoshito TANAKA, Takumi SHIMOSUKI, Masaji KOMORI, Hirofumi MUKAE, Toshiyuki FUKUSHIMA, Akiyoshi YAMAUCHI, Yosuke KISHIKAWA, Hirokazu AOYAMA
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Publication number: 20230309514Abstract: A housing for a livestock sensor capable of constituting a livestock sensor that has excellent corrosion resistance, has a small size, and can easily be administered orally to livestock, and a livestock sensor including the same. The housing includes a metal housing including a metal surface covered with a thermoplastic resin. Also disclosed is a livestock sensor including the housing.Type: ApplicationFiled: June 7, 2023Publication date: October 5, 2023Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Hirofumi MUKAE, Masaji Komori, Kenji Ishii, Yoshito Tanaka, Toshiyuki Fukushima, Takumi Shimosuki, Yosuke Kishikawa, Akiyoshi Yamauchi, Hirokazu Aoyama
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Patent number: 11739206Abstract: A resin composition and a molded article. The resin composition contains a fluororesin and boron nitride particles, the fluororesin being present in an amount of 35 to 70% by mass and the boron nitride particles being present in an amount of 30 to 65% by mass, each relative to the resin composition, the resin composition having a melt flow rate of 5.0 g/10 min or more.Type: GrantFiled: August 23, 2019Date of Patent: August 29, 2023Assignee: DAIKIN INDUSTRIES, LTD.Inventors: Hirofumi Mukae, Hideki Kono, Masaji Komori, Hiroshi Ito
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Publication number: 20230016062Abstract: A resin composition containing: a melt-fabricable fluororesin containing at least one functional group selected from a carbonyl group-containing group and a hydroxy group; at least one fluorine-free resin selected from a liquid crystal polymer, a polyarylene sulfide, and an aromatic polyether ketone; and particulate boron nitride, wherein the particulate boron nitride is contained in an amount of 30 to 65% by volume.Type: ApplicationFiled: September 9, 2022Publication date: January 19, 2023Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Hirofumi MUKAE, Hideki KONO, Masaji KOMORI, Ayane NAKAUE, Hiroshi ITO
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Publication number: 20220332025Abstract: A composition containing a melt-moldable fluororesin having a 1% decomposition temperature of 300° C. or higher and a thermotropic liquid crystal polymer, 90 mol % or more of all repeating units of the thermotropic liquid crystal polymer having an aromatic structure. The fluororesin is contained in an amount of 99.99 to 97% by mass and the thermotropic liquid crystal polymer is contained in an amount of 0.01 to 3% by mass relative to the composition. Also disclosed is an injection-molded article and a molding aid for injection molding fluororesin.Type: ApplicationFiled: June 23, 2022Publication date: October 20, 2022Applicants: DAIKIN INDUSTRIES, LTD., TSINGHUA UNIVERSITYInventors: Xuming XIE, Yuki UEDA, Masaji KOMORI, Akiyoshi YAMAUCHI
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Patent number: 11472953Abstract: A resin composition containing a fluorine-containing polymer and a methacrylate resin. The fluorine-containing polymer and the methacrylate resin have a mass ratio of 35/65 to 95/5. The fluorine-containing polymer contains a vinylidene fluoride unit and a tetrafluoroethylene unit. The vinylidene fluoride unit and the tetrafluoroethylene unit have a mole ratio of 81/19 to 99/1. Also disclosed is a molded article containing the resin composition.Type: GrantFiled: April 11, 2018Date of Patent: October 18, 2022Assignee: DAIKIN INDUSTRIES, LTD.Inventors: Shuhei Yamaguchi, Ayane Nakaue, Masaji Komori, Hideki Kono
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Patent number: 11332614Abstract: The present invention provides a reinforced polycarbonate resin composition having all of excellent strength, impact resistance, heat resistance, flame retardancy and thermal stability. A reinforced polycarbonate resin composition which contains 100 parts by weight of a resin composition composed of (A) 50 to 95 parts by weight of a polycarbonate resin (component A) and (B) 5 to 50 parts by weight of a fibrous filler (component B) and (C) 2 to 45 parts by weight of a fluororesin (component C-I) or 2 to 45 parts by weight of a fluororesin (component C-II), wherein (I) the fluororesin (component C-I) is a copolymer containing polymerization units respectively represented by general formulae [1] and [2] and has a melting point of 200 to 280° C., and (II) the fluororesin (component C-II) is a copolymer containing polymerization units respectively represented by general formulae [1] and [2], has a melting point of 240 to 300° C., and has a 5% weight loss temperature of 470° C.Type: GrantFiled: June 25, 2018Date of Patent: May 17, 2022Assignees: TEIJIN LIMITED, DAIKIN INDUSTRIES, LTD.Inventors: Shunsuke Okuzawa, Toshiyuki Miyake, Koji Nakanishi, Masaji Komori, Hideki Kono
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Publication number: 20220135767Abstract: A resin composition for a circuit board, containing a melt-fabricable fluororesin and a particulate boron nitride. The particulate boron nitride has a ratio (b)/(a) of 1.0 or higher, wherein (a) represents a proportion of particles having a particle size of 14.6 to 20.6 ?m and (b) represents a proportion of particles having a particle size of 24.6 to 29.4 ?m. Also disclosed is a molded article for a circuit board obtained from the resin composition, a laminate for a circuit board including a metal layer (A1) and a layer (B) obtained from the resin composition, and a circuit board including a metal layer (A2) and a layer (B) obtained from the resin composition.Type: ApplicationFiled: January 14, 2022Publication date: May 5, 2022Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Hirofumi MUKAE, Hirokazu KOMORI, Masaji KOMORI, Hideki KONO, Ayane NAKAUE
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Patent number: 11261324Abstract: A resin composition containing a polycarbonate resin and a fluorine-containing copolymer. The fluorine-containing copolymer is a copolymer containing a polymerized unit based on tetrafluoroethylene in an amount of 75% by mass or more of all polymerized units and at least one selected from a polymerized unit based on hexafluoropropylene and a polymerized unit based on a perfluoro(alkyl vinyl ether) in an amount of 2% by mass or more. Also disclosed is a molded article formed from the resin composition, the polycarbonate resin constituting a continuous phase and the fluorine-containing copolymer constituting a dispersed phase having an average particle size of 0.01 to 2.5 ?m.Type: GrantFiled: June 25, 2018Date of Patent: March 1, 2022Assignees: DAIKIN INDUSTRIES, LTD., TEIJIN LIMITEDInventors: Koji Nakanishi, Masaji Komori, Hideki Kono, Shunsuke Okuzawa, Toshiyuki Miyake
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Publication number: 20210345485Abstract: A fluororesin composition containing a melt moldable fluororesin and a silica, wherein the fluororesin has 25 or more carbonyl group-containing functional groups per 106 main-chain carbon atoms; the silica is a spherical silica; and the fluororesin composition has a linear expansion coefficient of 100 ppm/° C. or lower. Also disclosed is a fluororesin sheet including the fluororesin composition, a laminate including a copper foil layer and a layer including the fluororesin composition and a substrate for circuits including a copper foil layer and a layer including the fluororesin composition.Type: ApplicationFiled: December 24, 2019Publication date: November 4, 2021Applicant: DAIKIN INSUSTRIES, LTD.Inventors: Hirokazu KOMORI, Hiroyuki YOSHIMOTO, Masaji KOMORI, Yuki UEDA, Junpei TERADA
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Publication number: 20210332229Abstract: Provided are a resin composition having excellent heat dissipation properties as well as excellent moldability, and a molded article. The resin composition contains a fluororesin and boron nitride particles, the fluororesin being present in an amount of 35 to 70% by mass and the boron nitride particles being present in an amount of 30 to 65% by mass, each relative to the resin composition, the resin composition having a melt flow rate of 5.0 g/10 min or more.Type: ApplicationFiled: August 23, 2019Publication date: October 28, 2021Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Hirofumi MUKAE, Hideki KONO, Masaji KOMORI, Hiroshi ITO
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Publication number: 20210253841Abstract: Provided are a fluororesin-containing composition having significantly improved fluidity and a method for producing the same. The fluororesin-containing composition contains 99.99 to 97% by mass of a fluororesin having a melting point of 205° C. to 225° C. and 0.01 to 2% by mass of a thermotropic liquid crystal polymer. The method for producing the fluororesin-containing composition includes kneading polychlorotrifluoroethylene and a thermotropic liquid crystal polymer at 285° C. to 320° C.Type: ApplicationFiled: June 24, 2019Publication date: August 19, 2021Applicants: TSINGHUA UNIVERSITY, DAIKIN INDUSTRIES, LTD.Inventors: Xuming XIE, Masaji KOMORI, Hideki KONO
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Publication number: 20200140682Abstract: The present invention provides a reinforced polycarbonate resin composition having all of excellent strength, impact resistance, heat resistance, flame retardancy and thermal stability. A reinforced polycarbonate resin composition which contains 100 parts by weight of a resin composition composed of (A) 50 to 95 parts by weight of a polycarbonate resin (component A) and (B) 5 to 50 parts by weight of a fibrous filler (component B) and (C) 2 to 45 parts by weight of a fluororesin (component C-I) or 2 to 45 parts by weight of a fluororesin (component C-II), wherein (I) the fluororesin (component C-I) is a copolymer containing polymerization units respectively represented by general formulae [1] and [2] and has a melting point of 200 to 280° C., and (II) the fluororesin (component C-II) is a copolymer containing polymerization units respectively represented by general formulae [1] and [2], has a melting point of 240 to 300° C., and has a 5% weight loss temperature of 470° C.Type: ApplicationFiled: June 25, 2018Publication date: May 7, 2020Applicants: TEIJIN LIMITED, Daikin Industries, Ltd.Inventors: Shunsuke OKUZAWA, Toshiyuki MIYAKE, Koji NAKANISHI, Masaji KOMORI, Hideki KONO
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Publication number: 20200123368Abstract: A resin composition containing a fluorine-containing polymer and a methacrylate resin. The fluorine-containing polymer and the methacrylate resin have a mass ratio of 35/65 to 95/5. The fluorine-containing polymer contains a vinylidene fluoride unit and a tetrafluoroethylene unit. The vinylidene fluoride unit and the tetrafluoroethylene unit have a mole ratio of 81/19 to 99/1. Also disclosed is a molded article containing the resin composition.Type: ApplicationFiled: April 11, 2018Publication date: April 23, 2020Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Shuhei YAMAGUCHI, Ayane NAKAUE, Masaji KOMORI, Hideki KONO
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Publication number: 20200123377Abstract: A resin composition containing a polycarbonate resin and a fluorine-containing copolymer. The fluorine-containing copolymer is a copolymer containing a polymerized unit based on tetrafluoroethylene in an amount of 75% by mass or more of all polymerized units and at least one selected from a polymerized unit based on hexafluoropropylene and a polymerized unit based on a perfluoro(alkyl vinyl ether) in an amount of 2% by mass or more. Aso disclosed is a molded article formed from the resin composition, the polycarbonate resin constituting a continuous phase and the fluorine-containing copolymer constituting a dispersed phase having an average particle size of 0.01 to 2.5 ?m.Type: ApplicationFiled: June 25, 2018Publication date: April 23, 2020Applicants: DAIKIN INDUSTRIES, LTD, TEIJIN LIMITEDInventors: Koji NAKANISHI, Masaji KOMORI, Hideki KONO, Shunsuke OKUZAWA, Toshiyuki MIYAKE
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Publication number: 20100313946Abstract: Provided is a solar cell module which has a PCTFE film as the light-transmitting surface layer and/or back side protective sheet and is excellent in interlayer adhesion. The invention consists in a solar cell module comprising a light-transmitting surface layer, a solar cell element embedded in a filler and a back side protective sheet, wherein at least one of the light-transmitting surface layer and back side protective sheet is a polychlorotrifluoroethylene film (A) having a treated surface layer obtained by electric discharge treatment in an inert gas containing a reactive organic compound and the treated surface layer is disposed on the solar cell element side.Type: ApplicationFiled: October 15, 2007Publication date: December 16, 2010Inventors: Tatsuya Higuchi, Kenji Kawasaki, Masaji Komori, Takayuki Araki