Patents by Inventor Masakatsu Konno

Masakatsu Konno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10010453
    Abstract: An adhesive patch containing an adhesive patch main part containing a support and an adhesive layer laminated on the support, wherein the adhesive patch main part has a peripheral part, a central part, and an intermediate part between the peripheral part and the central part, the intermediate part of the adhesive patch main part has a thickness greater than that of the central part of the adhesive patch main part, and the central part of the adhesive patch main part has a thickness greater than that of the peripheral part of the adhesive patch main part, and a production method thereof.
    Type: Grant
    Filed: August 27, 2009
    Date of Patent: July 3, 2018
    Assignee: NITTO DENKO CORPORATION
    Inventors: Jun Harima, Masakatsu Konno, Ryo Hashino, Akira Numata
  • Publication number: 20140158571
    Abstract: A packaging structure (100) for a patch includes a first and second base materials (120, 130) which have a peripheral edge part laminated with each other, and the patch is included therein. The first and second base materials (120, 130) have a first to forth sides (121 to 124, 131-134). At least one of the first and second base materials (120, 130) has a first to third opening parts (125 to 127, 135 to 137). The first to third opening parts (125 to 127, 135 to 137) guides so as to open toward the inner peripheral edge (120c1, 120c2, 120c4, 130c1, 130c2, 130c4) of the sealing part (120c, 130c).
    Type: Application
    Filed: July 13, 2012
    Publication date: June 12, 2014
    Applicants: TOA EIYO LTD., NITTO DENKO CORPORATION
    Inventors: Kensuke Matsuoka, Yoshihiro Iwao, Jun Harima, Masakatsu Konno, Kazuhiro Aoyagi, Tomoya Tanaka, Mikio Toyota, Yasuhiko Akita, Tadashi Matsui
  • Patent number: 8388794
    Abstract: The invention provides a process for producing an adhesive patch, which includes a step of preparing a pressure-sensitive adhesive sheet including a backing, a pressure-sensitive adhesive layer formed on at least one side of the backing, and a release liner disposed on the pressure-sensitive adhesive layer; and a step of punching an adhesive patch including a backing, a pressure-sensitive adhesive layer formed on at least one side of the backing, and a release liner disposed on the pressure-sensitive adhesive layer out of the pressure-sensitive adhesive sheet with a protrudent push cutter blade, in which, at at least an edge part of the protrudent push cutter blade, a cross-sectional shape of the protrudent push cutter blade, which is in a direction perpendicular to the direction in which the protrudent push cutter blade extends, has an angle a and an angle b, in which the angle a is larger than the angle b. The angle a and angle b in the sectional shape have the meanings described in the specification.
    Type: Grant
    Filed: July 15, 2009
    Date of Patent: March 5, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Ryo Hashino, Masakatsu Konno, Jun Harima
  • Publication number: 20130015092
    Abstract: The present invention relates to a patch package having a patch and a packaging film sandwiching the patch, wherein the packaging film is tightly sealed in two or more flat heat-sealed parts, and respective adjacent two or more flat heat-sealed parts are separated across a non-sealed part.
    Type: Application
    Filed: July 14, 2011
    Publication date: January 17, 2013
    Applicant: Nitto Denko Corporation
    Inventors: Minoru SUZUKI, Keiji YAMAMOTO, Masakatsu KONNO, Hiroyuki YAEGASHI, Toshiharu IZAKI, Ryohei SAKURABA
  • Patent number: 8349357
    Abstract: The present invention provides an adhesive patch comprising a support, an adhesive layer on at least one surface of the support, and a release liner on a surface of the adhesive layer opposite from the support, wherein (a) the lateral end of the adhesive layer is exposed, (b) in at least one lateral end, the lateral end of the adhesive layer is located toward the central part side of the adhesive patch from the lateral end of the support, and (c) when placed horizontally with the release liner facing down, a distance A between the upper end of the support and the lower end of the release liner at said lateral end of the adhesive patch is greater than a thickness B of the central part of the adhesive patch.
    Type: Grant
    Filed: September 1, 2011
    Date of Patent: January 8, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Jun Harima, Masakatsu Konno, Ryo Hashino, Akira Numata
  • Publication number: 20130006203
    Abstract: The invention is intended to provide an adhesive patch which effectively inhibits the occurrence of oozing out or sticking out of the adhesive layer components from the exposed area of the adhesive layer of the adhesive patch during storage as well as the occurrence of oozing of bisoprolol or a salt thereof from the adhesive layer thereby preventing the reduction in drug content. The support, the release liner and the adhesive layer constituting the adhesive patch each are formed to have a rectangular planar shape and the entire adhesive patch are formed to have a rectangular planar shape, and a protrudent part is formed on the support-side surface of the adhesive patch at a corner thereof. In addition, the adhesive patch may be formed to have a middle part and a peripheral part, and the protrudent part may be formed at a corner of the rectangular middle part.
    Type: Application
    Filed: February 23, 2011
    Publication date: January 3, 2013
    Applicants: TOA EIYO LTD., NITTO DENKO CORPORATION
    Inventors: Yoshihiro Iwao, Kensuke Matsuoka, Kazuhiro Aoyagi, Jun Harima, Masakatsu Konno
  • Patent number: 8273370
    Abstract: An adhesive patch has a support and an adhesive layer formed on at least one surface of the support. The adhesive patch has a peripheral part and a central part 21. The adhesive layer has voids localized in the peripheral part, with the adhesive layer in the central part being substantially free of voids. The peripheral part preferably contains voids at 2.0-100 voids/mm3 on average. Since time-course changes of adhesive layer components such as additives are reduced, the adhesive patch is highly resistant to detachment from the skin, the components do not easily protrude from the edge of the adhesive patch during preservation in a package, adhesion to the inner surface of the package is suppressed, the adhesive patch can be easily removed from the package and edge lifting by cold flow is suppressed during adhesion to the skin.
    Type: Grant
    Filed: August 27, 2009
    Date of Patent: September 25, 2012
    Assignee: Nitto Denko Corporation
    Inventors: Jun Harima, Masakatsu Konno, Ryo Hashino, Akira Numata
  • Publication number: 20100056972
    Abstract: An adhesive patch containing an adhesive patch main part containing a support and an adhesive layer laminated on the support, wherein the adhesive patch main part comprises a peripheral part, a central part, and an intermediate part between the peripheral part and the central part, the intermediate part of the adhesive patch main part has a thickness greater than that of the central part of the adhesive patch main part, and the central part of the adhesive patch main part has a thickness greater than that of the peripheral part of the adhesive patch main part, and a production method thereof.
    Type: Application
    Filed: August 27, 2009
    Publication date: March 4, 2010
    Inventors: Jun HARIMA, Masakatsu Konno, Ryo Hashino, Akira Numata
  • Publication number: 20100055162
    Abstract: An adhesive patch having a support 10 and an adhesive layer 11 formed on at least one surface of the support 10, wherein the adhesive patch has a peripheral part 22 and a central part 21, the adhesive layer 11 has voids 31, the voids 31 in the adhesive layer 11 are localized in the peripheral part 22, the adhesive layer 11 in the central part 21 is substantially free of voids, and the peripheral part 22 of the adhesive layer 11 preferably contains voids 31 at 2.0-100 voids/mm3 on average.
    Type: Application
    Filed: August 27, 2009
    Publication date: March 4, 2010
    Inventors: Jun Harima, Masakatsu Konno, Ryo Hashino, Akira Numata
  • Publication number: 20100012266
    Abstract: The invention provides a process for producing an adhesive patch, which includes a step of preparing a pressure-sensitive adhesive sheet including a backing, a pressure-sensitive adhesive layer formed on at least one side of the backing, and a release liner disposed on the pressure-sensitive adhesive layer; and a step of punching an adhesive patch including a backing, a pressure-sensitive adhesive layer formed on at least one side of the backing, and a release liner disposed on the pressure-sensitive adhesive layer out of the pressure-sensitive adhesive sheet with a protrudent push cutter blade, in which, at at least an edge part of the protrudent push cutter blade, a cross-sectional shape of the protrudent push cutter blade, which is in a direction perpendicular to the direction in which the protrudent push cutter blade extends, has an angle a and an angle b, in which the angle a is larger than the angle b. The angle a and angle b in the sectional shape have the meanings described in the specification.
    Type: Application
    Filed: July 15, 2009
    Publication date: January 21, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Ryo HASHINO, Masakatsu KONNO, Jun HARIMA
  • Publication number: 20090022987
    Abstract: The invention relates to a patch including a backing, a pressure-sensitive adhesive layer, and a release liner, the patch at an edge part thereof having such a sectional shape that, when a perpendicular segment is drawn from an edge of the backing at the edge part of the patch to the release liner, at least a part of an edge of the pressure-sensitive adhesive layer at the edge part of the patch is located on the center side of the patch with respect to the segment, and the edge of the pressure-sensitive adhesive layer being exposed. According to the invention, a patch and an adhesive preparation in each of which the pressure-sensitive adhesive is less apt to protrude or flow out from the edges thereof can be provided.
    Type: Application
    Filed: July 17, 2008
    Publication date: January 22, 2009
    Applicant: NITTO DENKO CORPORATION
    Inventors: Ryo HASHINO, Masakatsu KONNO, Jun HARIMA