Patents by Inventor Masakazu Fukada

Masakazu Fukada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190140327
    Abstract: A power storage device includes a storage battery that stores electric power, a battery management unit that monitors and protects the storage battery, an inverter configured to convert DC power outputted from the storage battery into AC power and outputting the AC power, and convert externally supplied AC power into DC power and supplying the DC power to the storage battery, a liquid storage container that houses therein the storage battery, the battery management unit, and the inverter in a state where surroundings of the storage battery, the battery management unit, and the inverter are filled with a liquid, a temperature adjustment unit that performs heat transfer between the liquid and outside air to adjust a temperature of the liquid to a particular target temperature, and a heat insulating material arranged to surround the liquid storage container.
    Type: Application
    Filed: April 3, 2017
    Publication date: May 9, 2019
    Inventors: Masakazu FUKADA, Masashi SHIOTANI, Jiro KAMEDA, Kazuyuki KATO
  • Patent number: 10270365
    Abstract: A power conversion device includes an inverter which converts a DC power supplied thereto from a power supply device to an AC power using an operation of a switching element and outputs the AC power toward a load a current meter which measures an output current from the inverter, and a control unit which controls the operation of the switching element to change an output voltage waveform from the inverter. The control unit changes the output voltage waveform on the basis of the measured output current.
    Type: Grant
    Filed: February 5, 2016
    Date of Patent: April 23, 2019
    Assignee: DENSO CORPORATION
    Inventors: Tatsuya Murakami, Yuji Hayashi, Satoru Yoshikawa, Satoshi Takada, Masakazu Fukada
  • Publication number: 20180062497
    Abstract: A power conversion device includes an inverter which converts a DC power supplied thereto from a power supply device to an AC power using an operation of a switching element and outputs the AC power toward a load a current meter which measures an output current from the inverter, and a control unit which controls the operation of the switching element to change an output voltage waveform from the inverter. The control unit changes the output voltage waveform on the basis of the measured output current.
    Type: Application
    Filed: February 5, 2016
    Publication date: March 1, 2018
    Inventors: Tatsuya MURAKAMI, Yuji HAYASHI, Satoru YOSHIKAWA, Satoshi TAKADA, Masakazu FUKADA
  • Publication number: 20160118904
    Abstract: In a power conversion apparatus, an AC/DC conversion circuit part converts AC power supplied from an AC input and output part into DC power. A DC/DC conversion circuit part including a transformer converts the DC power supplied from the AC/DC conversion circuit part into AC power, converts converted AC power into DC power after voltage conversion by the transformer and outputs converted DC power to a DC input and output part. A smoothing capacitor is provided in a connection part between the AC/DC conversion circuit part and the DC/DC conversion circuit part to smooth a voltage at the connection part. A connection switchover part changes a maximum value of the AC voltage at the AC input and output part by switching over a connection state between the AC input and output part and an AC device.
    Type: Application
    Filed: October 20, 2015
    Publication date: April 28, 2016
    Inventors: Satoru Yoshikawa, Yuji Hayashi, Masakazu Fukada, Tatsuya Murakami
  • Patent number: 7081671
    Abstract: In a power module (111), a free-wheeling diode (1A), an IGBT (1B), and a capacitor (20) for smoothing direct current are disposed directly on a surface (2BS) of a conductive heat sink (2B) with through holes (2BH). The rear electrodes of the free wheeling diode (1A), the IGBT (1B), and the capacitor (20) are bonded to the heat sink (2B) for example with solder, whereby the diode (1A), the IGBT (1B), and the capacitor (20) are electrically connected with the heat sink (2B). The front electrodes of the diode (1A), the IGBT (1B), and the capacitor (20) are connected with each other for example by wires (7). In the heat sink (2B), a cooling medium flows through the through holes (2BH). Such a configuration allows miniaturization of the power module and improves the cooling performance and reliability of the power module.
    Type: Grant
    Filed: August 13, 2002
    Date of Patent: July 25, 2006
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Masakazu Fukada, Dai Nakajima, Ken Takanashi
  • Patent number: 6900986
    Abstract: A power module includes a first substrate with a power semiconductor device mounted thereon, a second substrate with a control circuit for controlling the power semiconductor device formed thereon, a smoothing capacitor electrically connected to the power semiconductor device for smoothing a voltage to be externally supplied to the power semiconductor device, and a case including a case frame and a case lid. The case has an interior in which the first substrate, the second substrate and the smoothing capacitor are disposed, and the smoothing capacitor is disposed in contact with a side surface of the case frame.
    Type: Grant
    Filed: March 29, 2004
    Date of Patent: May 31, 2005
    Assignees: Mitsubishi Denki Kabushiki Kaisha, Ryoden Semiconductor System Engineering Corporation
    Inventors: Nobuyoshi Kimoto, Takanobu Yoshida, Naoki Yoshimatsu, Masuo Koga, Dai Nakajima, Gourab Majumdar, Masakazu Fukada
  • Publication number: 20040179341
    Abstract: A power module includes a box-shaped smoothing capacitor (20) for smoothing a DC supply voltage to be externally applied to a power semiconductor device (5). The smoothing capacitor (20) is in contact with a side surface of a case frame (6) including a side (along which an N-terminal (8N) and a P-terminal (8P) are arranged) of a top surface of the case frame (6), and has a top surface level with the top surface of the case frame (6). An N-electrode (21N) and a P-electrode (21P) of the smoothing capacitor (20) are disposed on the top surface of the smoothing capacitor (20) and in proximity to the N-terminal (8N) and the P-terminal (8P) of a power module body portion (99), respectively. The power module can reduce a circuit inductance, is reduced in size and weight, and has good resistance to vibration.
    Type: Application
    Filed: March 29, 2004
    Publication date: September 16, 2004
    Applicants: Mitsubishi Denki Kabushiki Kaisha, Ryoden Semiconductor System Engineering Corp.
    Inventors: Nobuyoshi Kimoto, Takanobu Yoshida, Naoki Yoshimatsu, Masuo Koga, Dai Nakajima, Gourab Majumdar, Masakazu Fukada
  • Patent number: 6762937
    Abstract: A power module includes a substrate with a power semiconductor device mounted thereon, a case having an interior in which the substrate is disposed, a cooling fin having a surface on which the substrate and the case are placed, and a smoothing capacitor disposed on an opposite surface of the cooling fin from the surface on which the substrate is placed, the smoothing capacitor being electrically connected to the power semiconductor device for smoothing a voltage to be externally supplied to the power semiconductor device.
    Type: Grant
    Filed: December 10, 2002
    Date of Patent: July 13, 2004
    Assignees: Mitsubishi Denki Kabushiki Kaisha, Ryoden Semiconductor System Engineering Corporation
    Inventors: Nobuyoshi Kimoto, Takanobu Yoshida, Naoki Yoshimatsu, Masuo Koga, Dai Nakajima, Gourab Majumdar, Masakazu Fukada
  • Patent number: 6580147
    Abstract: P-electrode 30a and N-electrode 31a of a semiconductor device 2, and capacitors 10 in a plate-like shape or a block-like shape respectively connected to U-phase 40, V-phase 41, and W-phase 42 having a switching element 20 and a diode 21 are built in a semiconductor device 2, and a single or a plurality of capacitors 10 are respectively connected to P-electrodes 30a and N-electrodes 31a in each of the phases, whereby the smoothing capacitors are built in the semiconductor device to reduce wiring inductances, the capacitors are miniaturized, and an entire electric power converting device, i.e. inverter, is miniaturized.
    Type: Grant
    Filed: March 14, 2001
    Date of Patent: June 17, 2003
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Toru Kimura, Dai Nakajima, Tatsuya Okuda, Takeshi Ohi, Takanobu Yoshida, Naoki Yoshimatsu, Yuuji Kuramoto, Toshinori Yamane, Masakazu Fukada, Majumdar Gourab
  • Patent number: 6563211
    Abstract: A semiconductor device for controlling electricity including a metal base plate and at least one insulating substrate. The insulating substrate includes an insulator plate, a back-side pattern on a back face of the insulator plate and bonded to the metal base plate, and two circuit patterns located on a front face of the insulator plate and above the back-side pattern. Each of the two circuit patterns has an “L” shape and extends along two sides of the insulator plate that are continued and perpendicular to each other. The two circuit patterns are also arranged at opposed corners of the insulator plate in a centrosymmetrical relation each other. Further, in each circuit pattern, a switching element is sandwiched between a free-wheel diode and an electrode area.
    Type: Grant
    Filed: February 26, 2001
    Date of Patent: May 13, 2003
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Masakazu Fukada, Hiroshi Nishibori, Takanobu Yoshida, Naoki Yoshimatsu, Nobuyoshi Kimoto, Haruo Takao
  • Publication number: 20030063442
    Abstract: A power module includes a box-shaped smoothing capacitor (20) for smoothing a DC supply voltage to be externally applied to a power semiconductor device (5). The smoothing capacitor (20) is in contact with a side surface of a case frame (6) including a side (along which an N-terminal (8N) and a P-terminal (8P) are arranged) of a top surface of the case frame (6), and has a top surface level with the top surface of the case frame (6). An N-electrode (21N) and a P-electrode (21P) of the smoothing capacitor (20) are disposed on the top surface of the smoothing capacitor (20) and in proximity to the N-terminal (8N) and the P-terminal (8P) of a power module body portion (99), respectively. The power module can reduce a circuit inductance, is reduced in size and weight, and has good resistance to vibration.
    Type: Application
    Filed: December 10, 2002
    Publication date: April 3, 2003
    Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA
    Inventors: Nobuyoshi Kimoto, Takanobu Yoshida, Naoki Yoshimatsu, Masuo Koga, Dai Nakajima, Gourab Majumdar, Masakazu Fukada
  • Patent number: 6541838
    Abstract: Provided is a power module capable of driving an SR motor, giving a small size and high versatility and reducing a manufacturing cost. A switching element 1a and a diode element 2b which are to be connected to a P power wiring 5 are provided to form a first line on the band-shaped P power wiring 5, a switching element 1b and a diode element 2a which are to be connected to an N power wiring 6 are provided to form a second line aligned with the first line, and first band-shaped portions 41 and 44 of output terminals 3 and 4 and a band-shaped portion 61 of the N power wiring 6 are provided therebetween. The first band-shaped portions 41 and 44 and the band-shaped portion 61 have a two-layer structure with an insulating layer interposed therebetween. The switching elements 1a and 1b and the diode elements 2a and 2b are arranged alternately.
    Type: Grant
    Filed: November 6, 2000
    Date of Patent: April 1, 2003
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Eiji Suetsugu, Masakazu Fukada
  • Patent number: 6522544
    Abstract: A power module includes a box-shaped smoothing capacitor (20) for smoothing a DC supply voltage to be externally applied to a power semiconductor device (5). The smoothing capacitor (20) is in contact with a side surface of a case frame (6) including a side (along which an N-terminal (8N) and a P-terminal (8P) are arranged) of a top surface of the case frame (6), and has a top surface level with the top surface of the case frame (6). An N-electrode (21N) and a P-electrode (21P) of the smoothing capacitor (20) are disposed on the top surface of the smoothing capacitor (20) and in proximity to the N-terminal (8N) and the P-terminal (8P) of a power module body portion (99), respectively. The power module can reduce a circuit inductance, is reduced in size and weight, and has good resistance to vibration.
    Type: Grant
    Filed: October 17, 2000
    Date of Patent: February 18, 2003
    Assignees: Mitsubishi Denki Kabushiki Kaisha, Ryoden Semiconductor System Engineering Corporation
    Inventors: Nobuyoshi Kimoto, Takanobu Yoshida, Naoki Yoshimatsu, Masuo Koga, Dai Nakajima, Gourab Majumdar, Masakazu Fukada
  • Patent number: 6501172
    Abstract: In a powder module (111), a free-wheeling diode (1A), an IGBH (1B), and a capacitor (20) for smoothing direct current are disposed directly on a surface (2BS) of a conductive heat sink (2B) with through holes (2BH). The rear electrodes of the free-wheeling diode (1A), the IGBT (1B), and the capacitor (20) are bonded to the heat sink (2B) for example with solder, whereby the diode (1A), the IGBT (1B), and the capacitor (20) are electrically connected with the heat sink (2B). The front electrodes of the diodes (1A), the IGBT (1B), and the capacitor (20) are connected with each other for example by wires (7). In the heat sink (2B), a cooling medium flows through the through holes (2BH). Such a configuration allows miniaturization of the power module and improves the cooling performance and reliability of the power module.
    Type: Grant
    Filed: September 28, 2000
    Date of Patent: December 31, 2002
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Masakazu Fukada, Dai Nakajima, Ken Takanashi
  • Publication number: 20020186545
    Abstract: In a power module (111), a free-wheeling diode (1A), an IGBT (1B), and a capacitor (20) for smoothing direct current are disposed directly on a surface (2BS) of a conductive heat sink (2B) with through holes (2BH). The rear electrodes of the freewheeling diode (1A), the IGBT (1B), and the capacitor (20) are bonded to the heat sink (2B) for example with solder, whereby the diode (1A), the IGBT (1B), and the capacitor (20) are electrically connected with the heat sink (2B). The front electrodes of the diode (1A), the IGBT (1B), and the capacitor (20) are connected with each other for example by wires (7). In the heat sink (2B), a cooling medium flows through the through holes (2BH). Such a configuration allows miniaturization of the power module and improves the cooling performance and reliability of the power module.
    Type: Application
    Filed: August 13, 2002
    Publication date: December 12, 2002
    Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA
    Inventors: Masakazu Fukada, Dai Nakajima, Ken Takanashi
  • Publication number: 20020060356
    Abstract: It is an object to provide a power semiconductor device having a circuit pattern and a lower pattern made of an Al alloy for cost reduction and enabling reduction in heat resistance and improvement in resistance of a soldering layer to heat cycle. A substrate of semiconductor elements is mounted on a metal base plate made of a Cu alloy. The substrate of semiconductor elements includes an insulating substrate made of ceramics or the like. The circuit pattern and the lower pattern both made of an Al alloy are formed on an upper surface and a lower surface of the insulating substrate. The lower pattern is provided on an entire surface of the insulating substrate and joined onto the metal base plate through the soldering layer. Thicknesses of the metal base plate and the insulating substrate are respectively set to be 3.5 to 5.5 mm and 0.5 to 1 mm, for example. A thickness of the circuit pattern is set to be 0.4 to 0.6 mm and thicknesses of the lower pattern and the soldering layer are respectively set to be 0.
    Type: Application
    Filed: May 1, 2001
    Publication date: May 23, 2002
    Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA
    Inventors: Hiroshi Nishibori, Masakazu Fukada, Takanobu Yoshida, Naoki Yoshimatsu, Haruo Takao, Nobuyoshi Kimoto, Yasumi Uegai
  • Publication number: 20020047132
    Abstract: A semiconductor device for controlling electricity includes:
    Type: Application
    Filed: February 26, 2001
    Publication date: April 25, 2002
    Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA
    Inventors: Masakazu Fukada, Hiroshi Nishibori, Takanobu Yoshida, Naoki Yoshimatsu, Nobuyoshi Kimoto, Haruo Takao
  • Publication number: 20010035562
    Abstract: P-electrode 30a and N-electrode 31a of a semiconductor device 2, and capacitors 10 in a plate-like shape or a block-like shape respectively connected to U-phase 40, V-phase 41, and W-phase 42 having a switching element 20 and a diode 21 are built in a semiconductor device 2, and a single or a plurality of capacitors 10 are respectively connected to P-electrodes 30a and N-electrodes 31a in each of the phases, whereby the smoothing capacitors are built in the semiconductor device to reduce wiring inductances, the capacitors are miniaturized, and an entire electric power converting device, i.e. inverter, is miniaturized.
    Type: Application
    Filed: March 14, 2001
    Publication date: November 1, 2001
    Inventors: Toru Kimura, Dai Nakajima, Tatsuya Okuda, Takeshi Ohi, Takanobu Yoshida, Naoki Yoshimatsu, Yuuji Kuramoto, Toshinori Yamane, Masakazu Fukada, Majumdar Gourab
  • Patent number: 6304448
    Abstract: Obtained is a power module which is excellent in electromagnetic shielding effects, is rarely influenced by external noises and acts as an external noise source with difficulty. An insulating substrate (5) is bonded through a solder (4) to a top surface of a heat sink (3) fixed to a support plate (2). A DC capacitor (16) is fixed to a bottom face of the heat sink (3) by adhesion. A control substrate (11) having a control IC (13) mounted thereon is fixed to the support plate (2). Moreover, a plurality of electrodes (10), a DC side electrode and refrigerant inlet-outlet (9) and a control connector (15) are provided on the support plate (2). A case (1) is fixed to a peripheral portion of the support plate (2), and surrounds the insulating substrate (5), the control substrate (11), the heat sink (3) and the DC capacitor 16 together with the support plate (2). Both the case (1) and the support plate (2) have conducting property.
    Type: Grant
    Filed: September 7, 2000
    Date of Patent: October 16, 2001
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Masakazu Fukada, Dai Nakajima, Ken Takanashi
  • Patent number: 6051893
    Abstract: A fast changeover from one power system to another in the event of an irregularity in the power source system substantially reduces operating costs by minimizing a power loss in switches during conduction, dispenses with a cooling device for cooling a thyristor switch, and implements the thyristor switch in a compact and low-cost design. The power supply system for a load includes one switching apparatus for connecting a load to one power source system, and another switching apparatus for connecting the load to another power source system. Each of the switching apparatus includes a pair of thyristors connected in anti-parallel and a mechanical switch connected in parallel with the thyristor pair. The thyristor pairs and the mechanical switches are controlled so that the mechanical switches conduct a load current when the load is supplied with power from the one power source system in a steady power supply state.
    Type: Grant
    Filed: October 29, 1998
    Date of Patent: April 18, 2000
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hiroshi Yamamoto, Hiroyuki Sasao, Kenichi Koyama, Yukimori Kishida, Toshimasa Maruyama, Masakazu Fukada