Abstract: A manufacturing method of a coil component including the steps of: holding a plurality of semi-finished products, each of which includes a base and a coil before forming the coil component, with a jig having a holding portion; setting the plurality of semi-finished products held by the jig to the setting positions of the jig in a mold; and sealing at least a portion within the base and the coil with resin by filling the resin into a cavity of the mold.

Abstract: An antenna device includes a core, a terminal mounting unit, a coil, a plurality of elongated terminals, and an electronic component provided on the terminal mounting unit. The core is formed from a magnetic material. The terminal mounting unit is arranged adjacent to one side of the core. The coil, which is a wound conductive wire, is arranged on an outer circumference of the core. A sidewall of the terminal mounting unit includes a plurality of through holes into which the elongated terminals are inserted.

Abstract: A manufacturing method of a coil component including the steps of: holding a plurality of semi-finished products, each of which includes a base and a coil before forming the coil component, with a jig having a holding portion; setting the plurality of semi-finished products held by the jig to the setting positions of the jig in a mold; and sealing at least a portion within the base and the coil with resin by filling the resin into a cavity of the mold.

Abstract: A manufacturing method of a coil component including the steps of: holding a plurality of semi-finished products, each of which includes a base and a coil before forming the coil component, with a jig having a holding portion; setting the plurality of semi-finished products held by the jig to the setting positions of the jig in a mold; and sealing at least a portion within the base and the coil with resin by filling the resin into a cavity of the mold.

Abstract: An antenna device includes a core, a terminal mounting unit, a coil, a plurality of elongated terminals, and an electronic component provided on the terminal mounting unit. The core is formed from a magnetic material. The terminal mounting unit is arranged adjacent to one side of the core. The coil, which is a wound conductive wire, is arranged on an outer circumference of the core. A sidewall of the terminal mounting unit includes a plurality of through holes into which the elongated terminals are inserted.

Abstract: There are included a core 20 formed from a magnetic material; a terminal mounting unit 80 arranged on one end portion side of core 20; a coil 40 which is arranged on the outer circumferential side of core 20 and concurrently which is formed by winding a conductive wire 41; and a plurality of terminal members 70 which are mounted on terminal mounting unit and concurrently which are electrically connected with a terminal end of conductive wire 41 or with an electronic component at any position, wherein at terminal mounting unit 80, there are provided a plurality of mounting grooves 81 for plugging-in terminal members 70.

Abstract: An electronic component comprises: a resin frame; a semiconductor substrate housed in the resin frame; a plate shape metal member having at least one end fixed in the resin frame at a position spaced apart from the semiconductor substrate; an electrical connection region portion formed on the surface on the side of the plate shape metal member of the semiconductor substrate with an electrically conductive material; and a solder layer formed on the surface on the side of the plate shape metal member of the electrical connection region portion, wherein the plate shape metal member supports the semiconductor substrate without contact through the solder layer and the electrical connection region portion, and is electrically connected to the electrical connection region portion.

Abstract: A manufacturing method of a coil component including the steps of: holding a plurality of semi-finished products, each of which includes a base and a coil before forming the coil component, with a jig having a holding portion; setting the plurality of semi-finished products held by the jig to the setting positions of the jig in a mold; and sealing at least a portion within the base and the coil with resin by filling the resin into a cavity of the mold.

Abstract: An electronic component comprises: a resin frame; a semiconductor substrate housed in the resin frame; a plate shape metal member having at least one end fixed in the resin frame at a position spaced apart from the semiconductor substrate; an electrical connection region portion formed on the surface on the side of the plate shape metal member of the semiconductor substrate with an electrically conductive material; and a solder layer formed on the surface on the side of the plate shape metal member of the electrical connection region portion, wherein the plate shape metal member supports the semiconductor substrate without contact through the solder layer and the electrical connection region portion, and is electrically connected to the electrical connection region portion.

Abstract: An electronic component comprises: a resin frame; a semiconductor substrate housed in the resin frame; a plate shape metal member having at least one end fixed in the resin frame at a position spaced apart from the semiconductor substrate; an electrical connection region portion formed on the surface on the side of the plate shape metal member of the semiconductor substrate with an electrically conductive material; and a solder layer formed on the surface on the side of the plate shape metal member of the electrical connection region portion, wherein the plate shape metal member supports the semiconductor substrate without contact through the solder layer and the electrical connection region portion, and is electrically connected to the electrical connection region portion.

Abstract: There are included a core 20 formed from a magnetic material; a terminal mounting unit 80 arranged on one end portion side of core 20; a coil 40 which is arranged on the outer circumferential side of core 20 and concurrently which is formed by winding a conductive wire 41; and a plurality of terminal members 70 which are mounted on terminal mounting unit and concurrently which are electrically connected with a terminal end of conductive wire 41 or with an electronic component at any position, wherein at terminal mounting unit 80, there are provided a plurality of mounting grooves 81 for plugging-in terminal members 70.

Abstract: An electronic component comprises: a resin frame; a semicionductor substrate housed in the resin frame; a plate shape metal member having at least one end fixed in the resin frame at a position spaced apart from the semiconductor substrate; an electrical connection region portion formed on the surface on the side of the plate shape metal member of the semiconductor substrate with an electrically conductive material; and a solder layer formed on the surface on the side of the plate shape metal member of the electrical connection region portion, wherein the plate shape metal member supports the semiconductor substrate without contact through the solder layer and the electrical connection region portion, and is electrically connected to the electrical connection region portion.

Abstract: A coil component includes: a bar-like core; and a winding part formed of a conducting wire that is wound in a plurality of layers around the outer periphery of the core according to a solenoidal winding method. Winding collapse preventing shifts D1 to D4 each corresponding to a plurality of turns between an end part of a lower winding layer and an end part of an upper winding layer are respectively set to both end parts in the winding width direction of winding layers of the winding part. In transitioning from the lower winding layer to the upper winding layer, the conducting wire is turned back from the end part of the lower winding layer, and is obliquely wound in a small number of turns across each winding collapse preventing shift corresponding to the plurality of turns, and dense winding of the upper winding layer is started.

Abstract: A data collection system is connected to a data analysis system that carries out analysis processing based on data collected by the data collection system via communication. The data collection system includes collection-side communication, image capturing for capturing an ultra-high resolution digital image that allows an analysis of a skin texture condition, collection-side image data compression for compressing image data by a high compression method with block noises suppressed, and collection-side data display. The data analysis system includes analysis side communication, data analysis for analyzing image data, and analysis-side data compression for compressing the data by a high compression method with block noises suppressed.

Abstract: [Problem] To provide a system which can simplify operations at the time of diagnosis at the store, which enables even a beginner to diagnose a customer's skin condition, thereby achieving higher precision diagnostic results. [Solving Means] A data collection system 1 is connected to a data analysis system 11 that carries out analysis processing based on data collected by the data collection system 1 via communication means. The data collection system 1 includes collection-side communication means 7, image capturing means 2 for capturing an ultra-high resolution digital image that allows an analysis of a skin texture conditions collection-side image data compression means 6 for compressing image data by a high compression method with block noises suppressed, and collection-side data display means 3.