Patents by Inventor Masakazu Hidaka

Masakazu Hidaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145780
    Abstract: An electrolyte solution capable of reducing the initial resistance of an electrochemical device, and an electrochemical device including the electrolyte solution. The electrolyte solution contains a compound represented by formula (I-1): wherein R111 to R113 are each individually a C1-C4 linear alkyl group, and wherein the compound (1-1) is present in an amount of 0.01-1000 mass ppm relative to the electrolyte solution.
    Type: Application
    Filed: November 30, 2023
    Publication date: May 2, 2024
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Tomoya HIDAKA, Masakazu KINOSHITA, Yoshiko KUWAJIMA, Takaya YAMADA, Shigeaki YAMAZAKI, Yuuki SUZUKI, Kenzou TAKAHASHI
  • Patent number: 11916195
    Abstract: An electrolyte solution containing a compound (1) represented by the formula (1), (wherein R101 and R102 are each individually a substituent such as a C1-C7 alkyl group, and the substituent optionally contains at least one divalent to hexavalent hetero atom in a structure or optionally has a structure obtained by replacing at least one hydrogen atom by a fluorine atom or a C0-C7 functional group) and at least one compound (11) selected from compounds such as a compound represented by formula (11-1) (wherein R111 and R112 are the same as or different from each other and are each a hydrogen atom or the like, and R113 is an alkyl group free from a fluorine atom or the like):
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: February 27, 2024
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Masakazu Kinoshita, Tomoya Hidaka, Toshiharu Shimooka, Shigeaki Yamazaki, Hisako Nakamura, Takaya Yamada, Yuuki Suzuki, Yoshiko Kuwajima, Kenzou Takahashi, Akiyoshi Yamauchi, Kotaro Hayashi
  • Patent number: 7648307
    Abstract: An underground structure cover comprises a cover body (10) and a receiving frame (20) arranged so that the cover body is fitted in and supported by the receiving frame in the manner that an inclined surface (11) of the outer circumference of the body meets an inclined surface (21) of the inner circumference of the frame. The inclined surfaces (11, 21) each have an upper inclined surface (11a, 21a) and a lower inclined surface (11b, 21b), and the lower inclined surfaces (11b, 21b) are steeper than the upper inclined surfaces (11a, 21a). The body (10) is fitted in and supported by the part (20) at the upper inclined surfaces (11a, 21a) and the lower inclined surfaces (11b, 21b). By this, the body is prevented from being wedged into the frame too deeply and also from becoming inclined with respect to the frame or riding up.
    Type: Grant
    Filed: May 12, 2004
    Date of Patent: January 19, 2010
    Assignee: Hinode Inc.
    Inventors: Yukinori Gondou, Tomokazu Hasegawa, Masakazu Hidaka, Norio Shinohara, Kenichi Koga, Kazumi Tanaka
  • Publication number: 20070062125
    Abstract: An underground structure cover comprises a cover body (10) and a receiving frame (20) arranged so that the cover body is fitted in and supported by the receiving frame in the manner that an inclined surface (11) of the outer circumference of the body meets an inclined surface (21) of the inner circumference of the frame. The inclined surfaces (11, 21) each have an upper inclined surface (11a, 21a) and a lower inclined surface (11b, 21b), and the lower inclined surfaces (11b, 21b) are steeper than the upper inclined surfaces (11a, 21a). The body (10) is fitted in and supported by the part (20) at the upper inclined surfaces (11a, 21a) and the lower inclined surfaces (11b, 21b). By this, the body is prevented from being wedged into the frame too deeply and also from becoming inclined with respect to the frame or riding up.
    Type: Application
    Filed: May 12, 2004
    Publication date: March 22, 2007
    Applicant: HINODE, LTD.
    Inventors: Yukinori Gondou, Tomokazu Hasegawa, Masakazu Hidaka, Norio Shinohara, Kenichi Koga
  • Patent number: 6953301
    Abstract: A cover assembly includes a support frame (20) fixed to a utility access hole and a rounded cover (10) fitted into the support frame. The support frame is provided in its upper portion with an S-curved inner peripheral surface (20b) having a convex curved surface portion (21) and a concave curved surface portion (22) that continues to the convex curved surface portion and is formed thereabove. The cover has an S-curved peripheral surface (10b) that is substantially complementary in shape to the S-curved inner peripheral surface of the support frame. When the access hole is closed by the cover, the cover is smoothly fitted into the support frame due to a guide function of the S-curved inner peripheral surface of the support frame.
    Type: Grant
    Filed: February 13, 2003
    Date of Patent: October 11, 2005
    Assignee: Hinode, Ltd.
    Inventors: Kenichi Koga, Yukinori Gondou, Kazumi Tanaka, Masakazu Hidaka
  • Publication number: 20050115157
    Abstract: A cover assembly includes a support frame (20) fixed to a utility access hole and a rounded cover (10) fitted into the support frame. The support frame is provided in its upper portion with an S-curved inner peripheral surface (20b) having a convex curved surface portion (21) and a concave curved surface portion (22) that continues to the convex curved surface portion and is formed thereabove. The cover has an S-curved peripheral surface (10b) that is substantially complementary in shape to the S-curved inner peripheral surface of the support frame. When the access hole is closed by the cover, the cover is smoothly fitted into the support frame due to a guide function of the S-curved inner peripheral surface of the support frame.
    Type: Application
    Filed: February 13, 2003
    Publication date: June 2, 2005
    Applicant: HINODE, LTD
    Inventors: Kenichi Koga, Yukinori Gondou, Kazumi Tanaka, Masakazu Hidaka