Patents by Inventor Masakazu Hirobe

Masakazu Hirobe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230291371
    Abstract: A radio frequency module includes a first power amplifier, a second power amplifier, a filter, a switch, and a matching circuit. The first power amplifier outputs a first amplified signal. The second power amplifier outputs a second amplified signal. The filter allows the first amplified signal and the second amplified signal to pass through. The switch has a first terminal and a second terminal. The first terminal is connected to an output portion of the first power amplifier. The second terminal is connected to the filter. The switch changes over connection and disconnection of the first terminal and the second terminal. The matching circuit is connected between an output portion of the second power amplifier and a signal path between the second terminal of the switch and the filter.
    Type: Application
    Filed: May 18, 2023
    Publication date: September 14, 2023
    Inventor: Masakazu HIROBE
  • Patent number: 11757476
    Abstract: A radio frequency module includes a transmit filter that allows a transmit signal of a band A for FDD to pass through, a receive filter that allows a receive signal of the band A to pass through, a filter that allows a transmit/receive signal of a band B for TDD to pass through, power amplifiers, a low noise amplifier, a switch between connecting the receive filter to the low noise amplifier and connecting the filter to the low noise amplifier, a switch between connecting the filter to the power amplifier and connecting the filter to the low noise amplifier, a matching circuit connected between the power amplifier and the transmit filter, a matching circuit connected between the power amplifier and the switch, and a module board. On the module board, each of the power amplifiers and the switch is arranged in between the matching circuit and the matching circuit.
    Type: Grant
    Filed: January 20, 2023
    Date of Patent: September 12, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Masakazu Hirobe, Takanori Uejima, Yoshihiro Daimon, Nanami Yumura
  • Publication number: 20230179157
    Abstract: To provide a high-frequency circuit and a communication device by which a harmonic component in differential amplification can be attenuated. The high-frequency circuit includes a differential amplifier circuit. The differential amplifier circuit includes a first amplifying element, a second amplifying element, first wiring, second wiring, and a series circuit. The first amplifying element includes a first input terminal and a first output terminal. The second amplifying element includes a second input terminal and a second output terminal. The first wiring is connected to the first output terminal. The second wiring is connected to the second output terminal. The series circuit is connected between the first wiring and the second wiring. The series circuit includes a first inductor, a second inductor, and a capacitor.
    Type: Application
    Filed: February 1, 2023
    Publication date: June 8, 2023
    Inventors: Takahiro YAMASHITA, Masakazu HIROBE
  • Publication number: 20230155611
    Abstract: A radio frequency module includes a transmit filter that allows a transmit signal of a band A for FDD to pass through, a receive filter that allows a receive signal of the band A to pass through, a filter that allows a transmit/receive signal of a band B for TDD to pass through, power amplifiers, a low noise amplifier, a switch between connecting the receive filter to the low noise amplifier and connecting the filter to the low noise amplifier, a switch between connecting the filter to the power amplifier and connecting the filter to the low noise amplifier, a matching circuit connected between the power amplifier and the transmit filter, a matching circuit connected between the power amplifier and the switch, and a module board. On the module board, each of the power amplifiers and the switch is arranged in between the matching circuit and the matching circuit.
    Type: Application
    Filed: January 20, 2023
    Publication date: May 18, 2023
    Inventors: Masakazu HIROBE, Takanori UEJIMA, Yoshihiro DAIMON, Nanami YUMURA
  • Publication number: 20230073635
    Abstract: A radio-frequency circuit includes an amplifier circuit, a bias circuit, a bias control circuit, a comparing section, a signal input terminal, an antenna terminal, an attenuation circuit, and a control unit. The amplifier circuit includes a specific transistor. The bias circuit supplies a bias current or a bias voltage to the input terminal of the specific transistor. The bias control circuit supplies a control current or a control voltage to the bias circuit. The comparing section compares a threshold voltage with a power supply voltage of a power supply terminal connected to the output terminal of the specific transistor. The attenuation circuit is connected in a signal path between the signal input terminal and the antenna terminal and is capable of attenuating the radio-frequency signal. The control unit changes an attenuation of the attenuation circuit in accordance with a compared result of the comparing section.
    Type: Application
    Filed: November 14, 2022
    Publication date: March 9, 2023
    Inventor: Masakazu HIROBE
  • Publication number: 20230077189
    Abstract: A radio-frequency circuit includes an amplifier circuit, a bias circuit, a bias control circuit, a comparing section, a variable resistance circuit, and a control unit. The amplifier circuit includes a transistor that amplifies a radio-frequency signal input to an input terminal and outputs the radio-frequency signal from an output terminal. The bias circuit supplies a bias current or a bias voltage to the input terminal of the transistor. The comparing section compares a threshold voltage with a power supply voltage of a power supply terminal connected to the output terminal of the transistor. The variable resistance circuit is connected between the power supply terminal and the output terminal. The variable resistance circuit includes a parallel circuit made up of a resistive element and a switch element. The control unit changes a resistance value of the variable resistance circuit in accordance with a compared result of the comparing section.
    Type: Application
    Filed: November 15, 2022
    Publication date: March 9, 2023
    Inventor: Masakazu HIROBE
  • Publication number: 20220166388
    Abstract: A power amplifier circuit includes an amplifier circuit, a bias circuit, a detector, and a control circuit. The amplifier circuit includes a first bipolar transistor. The bias circuit includes an emitter follower. The emitter follower includes a second bipolar transistor and supplies a bias current to the base of the first bipolar transistor. The detector detects the voltage of a power supply terminal connected to the collector of the first bipolar transistor. The control circuit includes a current limiting circuit disposed between a battery terminal and the collector of the second bipolar transistor. The control circuit changes an upper limit value of a control current to be supplied to the collector of the second bipolar transistor, based on the voltage detected by the detector.
    Type: Application
    Filed: February 11, 2022
    Publication date: May 26, 2022
    Inventor: Masakazu HIROBE
  • Patent number: 10804861
    Abstract: A power amplification module includes an amplification circuit, a biasing circuit, a constant voltage generation circuit, a constant current generation circuit, a switching unit, and a control unit for controlling a switching operation of the switching unit, and the control unit causes the switching unit to perform switching to connect the constant voltage generation circuit to an input end of the biasing circuit when an output mode is a first output mode in which a high-frequency signal having no less than a predetermined output power is outputted from the amplification circuit, and causes the switching unit to perform switching to connect the constant current generation circuit to the input end of the biasing circuit when the output mode is a second output mode in which a power less than the predetermined output power is outputted from the amplification circuit.
    Type: Grant
    Filed: July 23, 2019
    Date of Patent: October 13, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Masakazu Hirobe
  • Publication number: 20190348954
    Abstract: A power amplification module includes an amplification circuit, a biasing circuit, a constant voltage generation circuit, a constant current generation circuit, a switching unit, and a control unit for controlling a switching operation of the switching unit, and the control unit causes the switching unit to perform switching to connect the constant voltage generation circuit to an input end of the biasing circuit when an output mode is a first output mode in which a high-frequency signal having no less than a predetermined output power is outputted from the amplification circuit, and causes the switching unit to perform switching to connect the constant current generation circuit to the input end of the biasing circuit when the output mode is a second output mode in which a power less than the predetermined output power is outputted from the amplification circuit.
    Type: Application
    Filed: July 23, 2019
    Publication date: November 14, 2019
    Inventor: Masakazu HIROBE
  • Patent number: 10355739
    Abstract: A high-frequency front end circuit performs reception/transmission simultaneously, and includes a transmitter circuit and a receiver circuit. The transmitter circuit includes a transmit filter passing a signal in the transmit frequency band. The receiver circuit includes a receive filter, an LNA, and a filter circuit. The receive filter passes a signal in the receive frequency band different from the transmit frequency band. The LNA receives and amplifies a signal that has been output from the receive filter. The filter circuit is connected between the receive filter and the LNA. The filter circuit attenuates a component, which is included in the signal received by the LNA, of the frequency indicating the difference between the center frequency of the transmit frequency band and the center frequency of the receive frequency band.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: July 16, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Masakazu Hirobe
  • Publication number: 20190036566
    Abstract: A high-frequency front end circuit performs reception/transmission simultaneously, and includes a transmitter circuit and a receiver circuit. The transmitter circuit includes a transmit filter passing a signal in the transmit frequency band. The receiver circuit includes a receive filter, an LNA, and a filter circuit. The receive filter passes a signal in the receive frequency band different from the transmit frequency band. The LNA receives and amplifies a signal that has been output from the receive filter. The filter circuit is connected between the receive filter and the LNA. The filter circuit attenuates a component, which is included in the signal received by the LNA, of the frequency indicating the difference between the center frequency of the transmit frequency band and the center frequency of the receive frequency band.
    Type: Application
    Filed: July 24, 2018
    Publication date: January 31, 2019
    Inventor: Masakazu Hirobe
  • Patent number: 9257947
    Abstract: A semiconductor device includes a power amplifier for amplifying RF signals in multiple frequency bands, an output matching circuit connected to an output of the power amplifier, a first capacitor connected at a first end to an output of the output matching circuit, multiple output paths, a switch connected to a second end of the first capacitor and directing each of the RF signals to a respective one of the output paths in accordance with frequency band of the each of the RF signals, and multiple second capacitors. Each second capacitor is connected in series to a respective one of the output paths. The switch and either the first capacitor or the second capacitors, or both the first and second capacitors, are integrated as a single monolithic microwave integrated circuit.
    Type: Grant
    Filed: June 25, 2014
    Date of Patent: February 9, 2016
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kenichi Horiguchi, Masakazu Hirobe, Satoshi Miho, Yoshinobu Sasaki, Kazuya Yamamoto
  • Publication number: 20150091652
    Abstract: A semiconductor device includes a power amplifier for amplifying RF signals in multiple frequency bands, an output matching circuit connected to an output of the power amplifier, a first capacitor connected at a first end to an output of the output matching circuit, multiple output paths, a switch connected to a second end of the first capacitor and directing each of the RF signals to a respective one of the output paths in accordance with frequency band of the each of the RF signals, and multiple second capacitors. Each second capacitor is connected in series to a respective one of the output paths. The switch and either the first capacitor or the second capacitors, or both the first and second capacitors, are integrated as a single monolithic microwave integrated circuit.
    Type: Application
    Filed: June 25, 2014
    Publication date: April 2, 2015
    Inventors: Kenichi Horiguchi, Masakazu Hirobe, Satoshi Miho, Yoshinobu Sasaki, Kazuya Yamamoto