Patents by Inventor Masakazu Ii

Masakazu Ii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Processes for laser beam machining of resin film for wiring boards and manufacture of wiring boards
    Patent number: 6492616
    Abstract: This invention relates to a process for machining resin film for a wiring board or double-sided carrier tape which comprises forming openings in the resin film by applying a continuous-wave carbon dioxide gas laser beam which is scanned in one or two ways to the resin film or a laminate containing a layer of the resin film placed on a worktable (5) moving in the direction nearly at a right angle to the scanning direction of the laser beam (7). As a continuous-wave carbon dioxide gas laser beam is used for drilling holes, the operation is highly efficient and accurate and gives rigid-flex wiring boards or double-sided carrier tapes of good quality in high yield.
    Type: Grant
    Filed: January 14, 2002
    Date of Patent: December 10, 2002
    Assignee: Nippon Steel Chemical Co., Ltd.
    Inventors: Takashi Tanaka, Mitsuru Kohno, Masakazu Ii, Keiji Yoshizawa