Patents by Inventor Masakazu Kamoshida

Masakazu Kamoshida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Carrier tape for electronic circuit elements and method of manufacturing an electronic circuit element series
    Patent number: 5089314
    Abstract: A carrier tape for electronic circuit elements adapted to be provisionally held on printed circuit boards prior to fixing of them on said printed circuit boards by soldering, comprises a flexible tape body extending in a longitudinal direction, and adhesive means applied with respect to the tape body and for serving the purpose of provisionally holding of electronic circuit elements on printed circuit boards, the adhesive means being formed of a material which exhibits adhesion upon being heated. The adhesive means is formed of a polymeric material which exhibits adhesion upon being heated. The carrier tape further includes electronic circuit elements held with respect to the tape body at equal intervals in a row in the longitudinal direction of the tape body through the adhesive means, thereby constituting an electronic circuit element series.
    Type: Grant
    Filed: February 15, 1990
    Date of Patent: February 18, 1992
    Assignee: TDK Corporation
    Inventors: Sho Masujima, Hiroshi Yagi, Atsuzo Tamashima, Masakazu Kamoshida
  • Method of mounting surface-mounted type electronic components on a printed circuit board
    Patent number: 4829663
    Abstract: A method of mounting surface-mounted type electronic components on a printed circuit board adapted to be carried out using an electronic component series which comprises a carrier tape formed with a plurality of tiny recess portions for receiving therein adhesives for use in temporary fixing of surface-mounted type electronic components on a printed circuit board, adhesives received in the respective recess portions, and a plurality of surface-mounted type electronic components held on the carrier tape through the adhesives.
    Type: Grant
    Filed: March 25, 1988
    Date of Patent: May 16, 1989
    Assignee: TDK Corporation
    Inventors: Sho Masujima, Hiroshi Yagi, Masakazu Kamoshida, Atsuzo Tamashima
  • Apparatus for storing and supplying parallel lead electronic circuit elements
    Patent number: 4174567
    Abstract: An apparatus for storing and supplying parallel lead circuit elements that are secured to an elongated web is provided. The apparatus is adapted to supply the parallel lead circuit elements to a mechanism particularly adapted to process and secure the parallel lead electronic circuit elements to a printed circuit board. Storage and supply of the electronic circuit elements is affected by winding each of the webs carrying the parallel lead circuit elements about a reel, which reel is enclosed in a case. The apparatus is adapted to support each of the cases at predetermined positions and further dispose appropriate guiding and feeding structure proximate to each of the cases to effect guiding and feeding of each of the webs to the mechanism for processing and securing the parallel lead electronic circuit elements to a printed circuit board.
    Type: Grant
    Filed: June 30, 1977
    Date of Patent: November 20, 1979
    Assignee: Tokyo Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Masakazu Kamoshida, Keiichi Ihara