Abstract: A transfer film includes a first substrate and a transfer layer, in which the transfer layer includes a hard coat layer and an adhesive layer in that order from the first substrate side, the hard coat layer has an elongation at 25° ° C. of 10% or more and 60% or less, and in which letting a thickness of the hard coat layer expressed in units of ?m be t, and letting the elongation of the hard coat layer expressed in units of % be E1, the value of t×E1/100 is 1.40 or more.

Abstract: A curable resin composition for silicon-containing resist including a polymerizable compound, and a polymerization initiator, wherein the polymerizable compound includes a siloxane bond in a molecule, and includes at least one polymerizable functional group; and a ratio of oxygen atoms bonded to a single silicon atom, among oxygen atoms bonded to a silicon atom included in the polymerizable compound, is 10 mol % or less; and the curable resin composition for silicon-containing resist does not contain a solvent, and a viscosity is 20 cPs or less.

Abstract: A photocurable resin composition for imprinting including a polymerizable compound, and a photopolymerization initiator, wherein the polymerizable compound includes a siloxane bond in a molecule, and includes at least one polymerizable functional group, and a ratio of oxygen atoms bonded to a single silicon atom, among oxygen atoms bonded to a silicon atom included in the polymerizable compound, is 10 mol % or less.