Abstract: A manufacturing method of a semiconductor device includes: forming a plurality of element structures in a form of matrix on a first surface of a semiconductor wafer; forming a crack extending in a thickness direction of the semiconductor wafer along a boundary between the element structures adjacent to each other by pressing a pressing member against a second surface of the semiconductor wafer opposite to the first surface along the boundary; and dividing the semiconductor wafer along the boundary by pressing a dividing member against the semiconductor wafer on a first surface side along the boundary.

Abstract: An acoustic system includes: a first customer-side microphone; a first counselor-side microphone; a first sound changing unit; a first loudspeaker; a second customer-side microphone; a second counselor-side microphone; and a second loudspeaker. Between the second loudspeaker and the first customer-side microphone, a first sound transmission path is provided. Also, between the second loudspeaker and the first counselor-side microphone, a second sound transmission path is provided. These sound transmission paths have substantially the same length. The first sound signal generated by the first customer-side microphone is made to have a phase substantially opposite to that of the second sound signal generated by the first counselor-side microphone, and the sound signals are added together.

Abstract: A sound absorbing panel is provided above an uppermost of soundproof panels arranged in plural stages in a vertical direction and each having a back surface opposite to a sound source side, the back surface being formed to be a sound insulating surface, the sound absorbing panel including: an outer frame body having therein an acoustic space in which a first acoustic material is provided, the outer frame body allowing formation of a partition wall separating a sound source and a surrounding area from each other, the outer frame body having, at a front and back portions thereof, sound transmitting surfaces each having multiple sound through holes allowing transfer of sound between the acoustic space and outside thereof; and a second acoustic material provided above an upper end of the outer frame body such that a peripheral surface of the second acoustic material except for a corner portion is air-permeable.

Abstract: The present invention enables reduction in, as well as low-frequency sound, high-frequency sound of diffraction sound that is to be diffracted in the vicinity of an upper end edge of an uppermost one of soundproof panels.

Abstract: An acoustic system includes: a first customer-side microphone; a first counselor-side microphone; a first sound changing unit; a first loudspeaker; a second customer-side microphone; a second counselor-side microphone; and a second loudspeaker. Between the second loudspeaker and the first customer-side microphone, a first sound transmission path is provided. Also, between the second loudspeaker and the first counselor-side microphone, a second sound transmission path is provided. These sound transmission paths have substantially the same length. The first sound signal generated by the first customer-side microphone is made to have a phase substantially opposite to that of the second sound signal generated by the first counselor-side microphone, and the sound signals are added together.