Abstract: A semiconductor device includes a substrate, a first FET part and a second FET part disposed on a surface of the substrate. The first FET part includes a first gate electrode region and a first source electrode region spaced apart from each other. The second FET part, connected to the first FET part in a stacked structure, includes a second gate electrode region and a second drain electrode region spaced apart from each other. Each of the first FET part and the second FET part includes a first common electrode and a second common electrode disposed on the surface of the substrate and spaced apart from each other. Each of the first common electrode and the second common electrode is configured to be a single conductor wiring integrally formed by a first drain electrode of the first FET part and a second source electrode of the second FET part.

Abstract: A bedding includes: a cushion layer which is formed with a filament three-dimensional bonded member and which is breathable; a breathable water-repellent layer which is provided on the upper side of the cushion layer and which is breathable and water-repellent; and a breathable water-retentive layer which is provided on the upper side of the breathable water-repellent layer and which is water-retentive and is breathable during water retention.

Abstract: In a device for manufacturing a filament three-dimensional bonded member includes: a molten filament supply device which supplies a plurality of molten filaments; a three-dimensional structure formation device which receives and then cools and solidifies the molten filaments so as to form a filament three-dimensional bonded member; and a controller which controls the molten filament supply device and the three-dimensional structure formation device, a hardness index measurement device is provided which measures the hardness index of the filament three-dimensional bonded member that is brought into a cooled state by the three-dimensional structure formation device, and the controller uses the information of the measurement of the hardness index measurement device that is fed back and thereby performs feedback control on at least one of the molten filament supply device and the three-dimensional structure formation device so as to reduce a variation in the hardness of the formed filament three-dimensional bonde

Abstract: A mattress core material includes a plurality of flat cushion bodies stacked in a thickness direction thereof, including at least a first cushion body which becomes an upper part when using the mattress core material; and a second cushion body which becomes a lower part when using the mattress core material, the first and second cushion bodies including a three-dimensional filaments-linked structure, the first and second cushion bodies each including a high-density upper surface layer having high filament density, formed in an upper surface layer region; a high-density lower surface layer having high filament density, formed in a lower surface layer region; and a low-density elastic layer formed between the high-density upper surface layer and the high-density lower surface layer, the low-density elastic layer being lower in filament density than each high-density surface layer, a intermediate position in the thickness direction of the mattress core material in which the first and second cushion bodies are st

Abstract: A bedding includes: a cushion layer which is formed with a filament three-dimensional bonded member and which is breathable; a breathable water-repellent layer which is provided on the upper side of the cushion layer and which is breathable and water-repellent; and a breathable water-retentive layer which is provided on the upper side of the breathable water-repellent layer and which is water-retentive and is breathable during water retention.

Abstract: A manufacturing apparatus and manufacturing method for manufacturing a three-dimensional filaments-linked structure includes: divided weight information acquisition means which records divided weight information acquired by dividing weight distribution in a height direction of a person in a height axis direction, in correlation with a distance from a top of a head of the person; and three-dimensional linked structure formation means which tangles and fuses filaments of a thermoplastic resin material extruded from an extruder in a three-dimensional net shape, and forms a three-dimensional filaments-linked structure which is long in a product streaming direction, and the three-dimensional linked structure formation means includes filament density control means which controls filament density in the product streaming direction based on the divided weight information.

Abstract: A semiconductor device includes a substrate, a first FET part and a second FET part disposed on a surface of the substrate. The first FET part includes a first gate electrode region and a first source electrode region spaced apart from each other. The second FET part, connected to the first FET part in a stacked structure, includes a second gate electrode region and a second drain electrode region spaced apart from each other. Each of the first FET part and the second FET part includes a first common electrode and a second common electrode disposed on the surface of the substrate and spaced apart from each other. Each of the first common electrode and the second common electrode is configured to be a single conductor wiring integrally formed by a first drain electrode of the first FET part and a second source electrode of the second FET part.

Abstract: A mattress core material includes a plurality of flat cushion bodies stacked in a thickness direction thereof, including at least a first cushion body which becomes an upper part; and a second cushion body which becomes a lower part, the first and second cushion bodies including a three-dimensional filaments-linked structure, each including a high-density upper surface layer having high filament density; a high-density lower surface layer having high filament density; and a low-density elastic layer, a high-density intermediate layer being formed in an intermediate position in the thickness direction of the mattress core material in which the first and second cushion bodies are stacked as upper and lower parts in the thickness direction, respectively, the high-density intermediate layer having a function of distributing a vertically applied compressive stress, along a curvature of an interface between the first and second cushion bodies in the high-density intermediate layer.

Abstract: An impedance matching circuit, includes a multilayer substrate, a microstrip line, a spiral inductor, a first capacitor circuit, and a second capacitor circuit. The multilayer substrate includes a power amplifier, and the microstrip line is disposed on a first layer substrate and connected to the power amplifier. The spiral inductor includes a first spiral transmission line disposed on the first layer substrate and connected to the microstrip line, a second spiral transmission line disposed on a substrate layer below the first layer substrate and connected to the first spiral transmission line, and an output pad disposed on the first layer substrate and connected to the second spiral transmission line. The first capacitor circuit is disposed outside the spiral inductor and connected between the microstrip line and a ground. The second capacitor circuit is disposed outside the spiral inductor and connected between the output pad and the ground.

Abstract: An impedance matching circuit, includes a multilayer substrate, a microstrip line, a spiral inductor, a first capacitor circuit, and a second capacitor circuit. The multilayer substrate includes a power amplifier, and the microstrip line is disposed on a first layer substrate and connected to the power amplifier. The spiral inductor includes a first spiral transmission line disposed on the first layer substrate and connected to the microstrip line, a second spiral transmission line disposed on a substrate layer below the first layer substrate and connected to the first spiral transmission line, and an output pad disposed on the first layer substrate and connected to the second spiral transmission line. The first capacitor circuit is disposed outside the spiral inductor and connected between the microstrip line and a ground. The second capacitor circuit is disposed outside the spiral inductor and connected between the output pad and the ground.

Abstract: In a device for manufacturing a filament three-dimensional bonded member includes: a molten filament supply device which supplies a plurality of molten filaments; a three-dimensional structure formation device which receives and then cools and solidifies the molten filaments so as to form a filament three-dimensional bonded member; and a controller which controls the molten filament supply device and the three-dimensional structure formation device, a hardness index measurement device is provided which measures the hardness index of the filament three-dimensional bonded member that is brought into a cooled state by the three-dimensional structure formation device, and the controller uses the information of the measurement of the hardness index measurement device that is fed back and thereby performs feedback control on at least one of the molten filament supply device and the three-dimensional structure formation device so as to reduce a variation in the hardness of the formed filament three-dimensional bonde

Abstract: A manufacturing apparatus and manufacturing method for manufacturing a three-dimensional filaments-linked structure includes: divided weight information acquisition means which records divided weight information acquired by dividing weight distribution in a height direction of a person in a height axis direction, in correlation with a distance from a top of a head of the person; and three-dimensional linked structure formation means which tangles and fuses filaments of a thermoplastic resin material extruded from an extruder in a three-dimensional net shape, and forms a three-dimensional filaments-linked structure which is long in a product streaming direction, and the three-dimensional linked structure formation means includes filament density control means which controls filament density in the product streaming direction based on the divided weight information.

Abstract: A base station including: an antenna configured to form a second cell, and a processor configured to: process a control signal with a terminal that is located in an overlapping area of a first cell and the second cell, the first cell being formed by another base station that processes a data signal with the terminal, and transfer processing of the control signal with the terminal to the other base station when a load of the processing of the control signal is more than a first threshold in the base station and when the terminal is located in the overlapping area for more than a given length of time.

Abstract: An amplification device includes: an amplitude adjustment circuit configured to adjust an amplitude level of an input signal so as to keep the amplitude level within a given range; an amplifier configured to amplify the adjusted signal; and a circuitry configured to change an amplitude level of the amplified signal, based on the amplitude level of the input signal and a first distortion compensation corresponding to the amplitude level of the input signal.

Abstract: A control device of a power amplifier includes: a limiter configured to limit a level of an input signal to the power amplifier; and a control unit configured to, when the limiter operates, make an operation voltage of the power amplifier invariable and control load of an output matching circuit of the power amplifier based on an amplitude of the input signal, and, when the limiter does not operate, to make the load of the output matching circuit invariable and control the operation voltage of the power amplifier.

Abstract: A power amplification device, includes: an amplifier to amplify an input signal; a switched capacitor, provided at an output stage of the amplifier, to change capacitance based on a first control signal; a matching unit, provided at the output stage of the amplifier and including a varactor pair in which two varactor diodes are coupled in series or a varactor pair in which two varactor diodes are coupled in parallel, to change capacitance based on a second control signal; a detection circuit to detect power of the input signal; a quantization circuit to quantize a detected power value, form a quantized bit string having a high-order bit group and a low-order bit group, and output the high-order bit group as the first control signal to the switched capacitor; and a conversion circuit to convert the low-order bit group into an analog value and form the second control signal.

Abstract: A communication apparatus makes a wireless communication with a communication control unit that is coupled to a network. The communication apparatus includes a part to make a call with respect to another communication apparatus on a called end, a part to receive an address of the other communication apparatus on the called end from a first communication control unit that is located at a location of the other communication apparatus on the called end, a part to make a call to the address, and a part to make a busy registration with respect to a server that is coupled to the network so as to register a telephone number of the communication apparatus.

Abstract: A method of exchanging data stored in a server connected to a network, so that a receiving user can access the data of a sending user, including the steps of encrypting information including at least identification of an item of the data to be exchanged with the receiving user and time information in which the sending user sets the item of data accessible, receiving second information indicating at least identification of an item of the data and a time period in which the item of data becomes accessible, comparing the first information and the second information, and setting the item of the data accessible for the time period if the first information and the second information match.

Abstract: The present invention relates to charging of rechargeable batteries built into electronic devices and is configured to constrain heat generation during the charging. A charging IC used for charging a rechargeable battery built into an electronic device is disclosed that comprises a power source unit which can be fed with power from an external power source with a drooping characteristic to pick up a constant current; and a control unit which applies a first constant current from the external power source to the rechargeable battery through a circuit element installed on a charging path of the rechargeable battery, the control unit applying a second constant current smaller than the first constant current from the power source unit to the rechargeable battery after the rechargeable battery is charged with the first constant current to a predetermined voltage.

Abstract: An information processing apparatus according to an embodiment of the present invention is capable of communication and exchanging images with a different information processing apparatus, and comprises a storage unit for storing a display pattern dictionary including one or a plurality of finger character images, each finger character image corresponding to a character and/or a numeral and representing a finger character, an operation unit for inputting a character and/or a numeral, an image selecting unit for selecting, from the display pattern dictionary, a finger character image corresponding to the character and/or numeral input by the operation unit, and a transmitting unit for transmitting the selected finger character image to the different information processing apparatus.