Abstract: A photosensitive element comprising a support film, a barrier layer, and a photosensitive layer in this order, wherein the barrier layer contains a water-soluble resin and an ultraviolet absorber.

Abstract: A photosensitive element according to the present disclosure can be produced by a method including a step of forming a photosensitive layer on a support film using a photosensitive resin composition and a step of bonding a winding outer surface of a protective film having a roll shape onto the photosensitive layer, and includes a support film, a photosensitive layer provided on one surface of the support film, and a protective film provided on a surface of the photosensitive layer opposite to the support film, and the protective film has a weld line on a surface opposite to the photosensitive layer.

Abstract: A photosensitive element comprising a support film, a barrier layer, and a photosensitive layer in this order, wherein the barrier layer contains a water-soluble resin and an ultraviolet absorber.

Abstract: An object is to provide a method for forming a resist pattern able to form a resist pattern, in which the resist shape is favorable, the occurrence of resist footing can be reduced, and the adherence and the aspect ratio are improved; and provided is a method for forming a resist pattern comprising a step of forming a photosensitive resin layer on a substrate using a photosensitive resin composition for projection exposure; a step of exposing the photosensitive resin layer to active light projecting an image of a photomask through a lens; and a step of removing an unexposed part of the photosensitive resin layer from the substrate by development, wherein the photosensitive resin composition for projection exposure comprises an (A) binder polymer, a (B) photopolymerizing compound having an ethylenically unsaturated bond, and a (C) photopolymerization initiator; and a light transmittance of the photosensitive resin layer at a wavelength of 365 nm is not less than 58.0% and not more than 95.0%.

Abstract: An object of the present invention is to provide a photosensitive resin composition for projection exposure capable of forming a resist pattern that is excellent in adhesion, resolution, and inhibitory properties against the occurrence of resist footing, and the present invention provides a photosensitive resin composition for projection exposure comprising (A) a binder polymer; (B) a photopolymerizable compound having an ethylenically unsaturated bond; (C) a photopolymerization initiator; and (D) a sensitizing dye, wherein the (B) photopolymerizable compound having an ethylenically unsaturated bond comprises a (meth)acrylate compound having a skeleton derived from dipentaerythritol and a compound represented by the following formula (III): wherein R8, R9, R10, and R11 each independently represent a hydrogen atom or a methyl group, X and Y each independently represent an ethylene group or a propylene group, p1, p2, q1, and q2 each independently represent a numerical value of 0 to 9, both p1+q1 and p2+q2

Abstract: An object is to provide a method for forming a resist pattern able to form a resist pattern, in which the resist shape is favorable, the occurrence of resist footing can be reduced, and the adherence and the aspect ratio are improved; and provided is a method for forming a resist pattern comprising a step of forming a photosensitive resin layer on a substrate using a photosensitive resin composition for projection exposure; a step of exposing the photosensitive resin layer to active light projecting an image of a photomask through a lens; and a step of removing an unexposed part of the photosensitive resin layer from the substrate by development, wherein the photosensitive resin composition for projection exposure comprises an (A) binder polymer, a (B) photopolymerizing compound having an ethylenically unsaturated bond, and a (C) photopolymerization initiator; and a light transmittance of the photosensitive resin layer at a wavelength of 365 nm is not less than 58.0% and not more than 95.0%.

Abstract: An object of the present invention is to provide a photosensitive resin composition for projection exposure capable of forming a resist pattern that is excellent in adhesion, resolution, and inhibitory properties against the occurrence of resist footing, and the present invention provides a photosensitive resin composition for projection exposure comprising (A) a binder polymer; (B) a photopolymerizable compound having an ethylenically unsaturated bond; (C) a photopolymerization initiator; and (D) a sensitizing dye, wherein the (B) photopolymerizable compound having an ethylenically unsaturated bond comprises a (meth)acrylate compound having a skeleton derived from dipentaerythritol and a compound represented by the following formula (III): wherein R8, R9, R10, and R11 each independently represent a hydrogen atom or a methyl group, X and Y each independently represent an ethylene group or a propylene group, p1, p2, q1, and q2 each independently represent a numerical value of 0 to 9, both p1+q1 and p2+q2